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Proceedings Papers

Particle Inspection by Single Camera-Based 3D Stereoscopy

Hyun Jae Lee, Gugyeong Sung, Heebum Chun, ChaBum Lee
Proc. ASME. MSEC2024, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality & Reliability, V002T05A007, June 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2024-125207
https://doi.org/10.1115/MSEC2024-125207
View Paper titled, Particle Inspection by Single Camera-Based 3D Stereoscopy
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Topics: Inspection, Particulate matter, Semiconductor wafers, Stereoscopy
Journal Articles

Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis

Kuan Lu, Zhikun Wang, Heebum Chun, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070908.
Paper No: MANU-23-1366
https://doi.org/10.1115/1.4065639
Published Online: June 10, 2024
View Article titled, Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis
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Topics: Diffraction patterns, Imaging, Inspection, Metrology, Semiconductor wafers, Feature extraction, Particulate matter
Journal Articles

Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

Changheon Han, Heebum Chun, Jiho Lee, Fengfeng Zhou, Huitaek Yun, ChaBum Lee, Martin B.G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070906.
Paper No: MANU-23-1591
https://doi.org/10.1115/1.4065276
Published Online: May 9, 2024
View Article titled, Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation
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Topics: Resolution (Optics), Semiconductor wafers, Inspection
Journal Articles

Hole Edge Metrology and Inspection by Edge Diffractometry

Kuan Lu, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070905.
Paper No: MANU-24-1019
https://doi.org/10.1115/1.4065314
Published Online: April 29, 2024
View Article titled, Hole Edge Metrology and Inspection by Edge Diffractometry
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Topics: Diffraction, Diffraction patterns, Inspection, Metrology, Surface roughness, Geometry
Journal Articles

Nondestructive Surface Profiling and Inspection by Using a Single Unit Magneto-Eddy-Current Sensor

Jungsub Kim, Heebum Chun, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. June 2024, 146(6): 064501.
Paper No: MANU-21-1527
https://doi.org/10.1115/1.4053810
Published Online: April 9, 2024
View Article titled, Nondestructive Surface Profiling and Inspection by Using a Single Unit Magneto-Eddy-Current Sensor
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Topics: Eddies (Fluid dynamics), Inspection, Sensors, Nondestructive evaluation, Steel, Copper, Aluminum, Magnets, Rivets
Proceedings Papers

A Fringe Pattern Analysis Technique for Photomask Line-Edge-Roughness Characterization

Zhikun Wang, Kuan Lu, ChaBum Lee
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T06A007, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-103862
https://doi.org/10.1115/MSEC2023-103862
View Paper titled, A Fringe Pattern Analysis Technique for Photomask Line-Edge-Roughness Characterization
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Topics: Diffraction patterns, Photomasks, Surface roughness
Proceedings Papers

Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection

Changheon Han, Heebum Chun, ChaBum Lee, Martin Byung-Guk Jun
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T09A003, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-101213
https://doi.org/10.1115/MSEC2023-101213
View Paper titled, Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection
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Topics: Algorithms, Computers, Inspection, Intelligent machines, Machine learning, Manufacturing, Semiconductor wafers, Particulate matter, Machinery, Human factors
Proceedings Papers

In-Process Machining Process Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface

Heebum Chun, Jungsub Kim, Jungsoo Nam, Songhyun Ju, ChaBum Lee
Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T04A017, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85794
https://doi.org/10.1115/MSEC2022-85794
View Paper titled, In-Process Machining Process Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface
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Topics: Coating processes, Coatings, Machining, Process monitoring
Proceedings Papers

Review of KEI Method-Based Dimensional Measurement, Positioning Control and Part Inspection

Zhikun Wang, ChaBum Lee
Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T04A015, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85660
https://doi.org/10.1115/MSEC2022-85660
View Paper titled, Review of KEI Method-Based Dimensional Measurement, Positioning Control and Part Inspection
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Topics: Dimensional metrology, Inspection, Interferometry, Position control
Proceedings Papers

CFRP Milling and Drilling Process Monitoring by Using a Spindle-Integrated Three Axis Force Sensor

Jungsub Kim, Heebum Chun, ChaBum Lee
Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T04A018, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85799
https://doi.org/10.1115/MSEC2022-85799
View Paper titled, CFRP Milling and Drilling Process Monitoring by Using a Spindle-Integrated Three Axis Force Sensor
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Topics: Carbon, Carbon reinforced plastics, Cutting, Drilling, Fiber reinforced plastics, Force sensors, Milling, Process monitoring, Sensors
Proceedings Papers

Enhanced Three-Dimensional Surface Profiling Technique Based on a Feature-Selective Segmentation and Merging

Xiangyu Guo, ChaBum Lee
Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T04A003, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85343
https://doi.org/10.1115/MSEC2022-85343
View Paper titled, Enhanced Three-Dimensional Surface Profiling Technique Based on a Feature-Selective Segmentation and Merging
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Topics: Image segmentation, Imaging, Resolution (Optics)
Journal Articles

Damping Characteristics of Fluidic Pressure-Fed Mechanism for Positioning Applications

Heebum Chun, Jungsub Kim, Hyo-Young Kim, ChaBum Lee
Journal: Journal of Dynamic Systems, Measurement, and Control
Publisher: ASME
Article Type: Research-Article
J. Dyn. Sys., Meas., Control. November 2021, 143(11): 111001.
Paper No: DS-20-1413
https://doi.org/10.1115/1.4051294
Published Online: June 28, 2021
View Article titled, Damping Characteristics of Fluidic Pressure-Fed Mechanism for Positioning Applications
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Topics: Damping, Pressure, Dynamic systems, Vibration, Fluids, Water, Stiffness
Proceedings Papers

Non-Contact, Continuous, Synchronized, Cosine Error-Free Thickness Profile Measurement by Surface Metrology Tool Path Planning

Xiangyu Guo, Chabum Lee
Proc. ASME. MSEC2020, Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation, V001T05A013, September 3, 2020
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2020-8289
https://doi.org/10.1115/MSEC2020-8289
View Paper titled, Non-Contact, Continuous, Synchronized, Cosine Error-Free Thickness Profile Measurement by Surface Metrology Tool Path Planning
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Topics: Errors, Measurement systems, Metrology, Path planning, Sensors
Journal Articles

Cosine Error-Free Metrology Tool Path Planning for Thickness Profile Measurements

Xiangyu Guo, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2021, 143(4): 041006.
Paper No: MANU-20-1164
https://doi.org/10.1115/1.4048433
Published Online: October 27, 2020
View Article titled, Cosine Error-Free Metrology Tool Path Planning for Thickness Profile Measurements
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Topics: Errors, Metrology, Path planning, Sensors, Uncertainty
Journal Articles

Cosine Error Elimination Method for One-Dimensional Convex and Concave Surface Profile Measurements

Xiangyu Guo, Jaemin Han, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2020, 142(4): 041001.
Paper No: MANU-19-1565
https://doi.org/10.1115/1.4046078
Published Online: February 18, 2020
View Article titled, Cosine Error Elimination Method for One-Dimensional Convex and Concave Surface Profile Measurements
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Topics: Errors
Proceedings Papers

Additive Manufacturing-Based Adaptive Dynamic Parameter Characterization by Using Pressure-Fed Flexure Mechanisms

ChaBum Lee, JaeMin Han, Gyu Ha Kim
Proc. ASME. MSEC2019, Volume 1: Additive Manufacturing; Manufacturing Equipment and Systems; Bio and Sustainable Manufacturing, V001T01A028, June 10–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2019-2863
https://doi.org/10.1115/MSEC2019-2863
View Paper titled, Additive Manufacturing-Based Adaptive Dynamic Parameter Characterization by Using Pressure-Fed Flexure Mechanisms
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Topics: Adaptive dynamics, Additive manufacturing, Damping, Flexure mechanisms, Manufacturing, Pressure, Stiffness
Proceedings Papers

Precision Cutting Tool Wear Monitoring Method by Knife-Edge Diffraction Interferometry

ChaBum Lee
Proc. ASME. MSEC2018, Volume 3: Manufacturing Equipment and Systems, V003T02A026, June 18–22, 2018
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2018-6463
https://doi.org/10.1115/MSEC2018-6463
View Paper titled, Precision Cutting Tool Wear Monitoring Method by Knife-Edge Diffraction Interferometry
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Topics: Cutting tools, Diffraction, Interferometry, Wear, Wheels, Diffraction patterns, Waves, Cutting, Damage, Microelectromechanical systems
Proceedings Papers

Total Internal Reflection (TIR) Lens Design for Surface Mount Techonology (SMT) LED Application

JaeYoung Joo, Do Kyun Woo, ChaBum Lee, SunKyu Lee
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 105-106, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70261
https://doi.org/10.1115/MicroNano2008-70261
View Paper titled, Total Internal Reflection (TIR) Lens Design for Surface Mount Techonology (SMT) LED Application
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Topics: Design, Lenses (Optics), Reflection, Surface mount packaging, Diamond turning, Geometry, Matlab, Simulation results, Surface mount technology
Proceedings Papers

Fabrication of Phase Reflection Sawtooth Gratings Optimized by Scalar and Vector Way by Using Diamond Cutting

ChaBum Lee, T. Kuriyagawa, TaeJun Kim, SunKyu Lee
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 703-704, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70266
https://doi.org/10.1115/MicroNano2008-70266
View Paper titled, Fabrication of Phase Reflection Sawtooth Gratings Optimized by Scalar and Vector Way by Using Diamond Cutting
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Topics: Cutting, Diamonds, Diffraction gratings, Manufacturing, Reflection, Scalars, Diffraction, Polarization (Electricity), Polarization (Light), Polarization (Waves)