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Chad S. Korach
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Journal Articles

Synergistic Effects of Fatigue and Marine Environments on Carbon Fiber Vinyl-Ester Composites

Arash Afshar, Maen Alkhader, Chad S. Korach, Fu-Pen Chiang
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. October 2015, 137(4): 041002.
Paper No: MATS-14-1187
https://doi.org/10.1115/1.4030481
Published Online: October 1, 2015
View Articletitled, Synergistic Effects of Fatigue and Marine Environments on Carbon Fiber Vinyl-Ester Composites
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Topics: Carbon fibers, Composite materials, Damage, Ester, Fatigue, Stiffness, Cycles, Stress, Laminates, Tensile strength
Journal Articles

Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes

Chunhui Chung, Chad S. Korach, Imin Kao
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2011, 133(3): 031006.
https://doi.org/10.1115/1.4004137
Published Online: June 8, 2011
View Articletitled, Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes
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Topics: Grinding, Surface roughness, Abrasives, Slurries, Semiconductor wafers, Particulate matter, Modeling
Proceedings Papers

Measurement of Epoxy Stiffness by Atomic Force Acoustic Microscopy

Wei Zhao, Chad S. Korach
Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 85-87, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-13228
https://doi.org/10.1115/IMECE2009-13228
View Paper titled, Measurement of Epoxy Stiffness by Atomic Force Acoustic Microscopy
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Topics: Acoustics, Epoxy adhesives, Epoxy resins, Fundamental forces (Physics), Microscopy, Stiffness, Fillers (Materials), Composite materials, Polymer composites, Contact mechanics
Proceedings Papers

The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load

Joseph A. Levert, David Haas, Chad S. Korach, Nicholas Lakomcik, Edward Peters
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 731-733, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71217
https://doi.org/10.1115/IJTC2008-71217
View Paper titled, The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load
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Topics: Friction, Stress, Polishing, Slurries, Damage, Deflection, Dielectric materials, Integrated circuits, Manufacturing, Thin films
Proceedings Papers

Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips

Joo Hoon Choi, Yangro Lee, Louis E. DeMarco, Richard T. Leveille, Joseph A. Levert, Chad S. Korach
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 749-751, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44383
https://doi.org/10.1115/IJTC2007-44383
View Paper titled, Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips
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Topics: Atomic force microscopy, Friction, Polishing, Particulate matter, Scanning probe microscopy, Circuits, Damage, Delamination, Glass, Integrated circuit fabrication
Proceedings Papers

Models of Friction and Wear of DLC Films

Feodor M. Borodich, Chad S. Korach, Leon M. Keer
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 403-404, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-64085
https://doi.org/10.1115/WTC2005-64085
View Paper titled, Models of Friction and Wear of DLC Films
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Topics: Diamond films, Friction, Wear, Atoms, Carbon, Coatings, Oxygen, Abrasion, Cycles, Desorption
Proceedings Papers

The Relative Friction Force Contributions of Polishing Pads and Slurries During Chemical Mechanical Polishing

Joseph A. Levert, Chad S. Korach
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 427-428, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63817
https://doi.org/10.1115/WTC2005-63817
View Paper titled, The Relative Friction Force Contributions of Polishing Pads and Slurries During Chemical Mechanical Polishing
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Topics: Friction, Polishing, Slurries, Nanoscale phenomena, Dielectric materials, Damage, Integrated circuits, Particulate matter, Shear (Mechanics), Silicon
Proceedings Papers

CMP Friction as a Function of Slurry Silica Nanoparticle Concentration and Diameter

Joseph A. Levert, Chad S. Korach
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 981-986, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12235
https://doi.org/10.1115/IJTC2006-12235
View Paper titled, CMP Friction as a Function of Slurry Silica Nanoparticle Concentration and Diameter
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Topics: Friction, Nanoparticles, Slurries, Particulate matter, Atomic force microscopy, Damage, Dielectric materials, Abrasives, Integrated circuits, Nanoscale phenomena
Journal Articles

Modeling the Tribochemical Aspects of Friction and Gradual Wear of Diamond-Like Carbon Films

Feodor M. Borodich, Chad S. Korach, Leon M. Keer
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. January 2007, 74(1): 23–30.
https://doi.org/10.1115/1.2172267
Published Online: December 2, 2005
View Articletitled, Modeling the Tribochemical Aspects of Friction and Gradual Wear of Diamond-Like Carbon Films
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Topics: Carbon, Diamond films, Friction, Wear, Modeling, Atoms, Oxygen, Cycles, Hydrogen