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Chandrakant S. Desai
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Proceedings Papers

Use of Lamb Waves to Predict Current Damaged State of Mortar

Michael S. Keller, Tribikram Kundu, Chandrakant S. Desai
Proc. ASME. IMECE2001, NDE Challenges of the 21st Century: Theory to Practice, 9-20, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/NDE-25801
https://doi.org/10.1115/IMECE2001/NDE-25801
View Paper titled, Use of Lamb Waves to Predict Current Damaged State of Mortar
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Topics: Mortar, Nondestructive evaluation, Waves, Concretes, Testing, Damage, Stress, Compression, Computers, Deformation
Journal Articles

Interface Behavior Between Carbon-Fiber Polymer and Sand

Vahab Toufigh, Ahad Ouria, Chandrakant S. Desai, Navid Javid, Vahid Toufigh, Hamid Saadatmanesh
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. January 2016, 44(1): 385–390.
Paper No: JTE20140153
https://doi.org/10.1520/JTE20140153
Published Online: January 28, 2016
View Article titled, Interface Behavior Between Carbon-Fiber Polymer and Sand
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Proceedings Papers

Design and Reliability in Electronic Packaging Including Power Temperature Cycling and Vibration Effects

Mark D. Nickerson, Chandrakant S. Desai
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 941-946, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35353
https://doi.org/10.1115/IPACK2003-35353
View Paper titled, Design and Reliability in Electronic Packaging Including Power Temperature Cycling and Vibration Effects
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Topics: Design, Electronic packaging, Reliability, Temperature, Vibration
Journal Articles

Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation

Chandrakant S. Desai, Zhichao Wang, Russell Whitenack, Tribikram Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 232–236.
https://doi.org/10.1115/1.1756147
Published Online: July 8, 2004
View Article titled, Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation
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Topics: Calibration, Modeling, Solders, Temperature, Testing, Finite element analysis, Electronic packaging, Shear (Mechanics), Stress, Boundary-value problems
Journal Articles

Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing

Chandrakant S. Desai, Zhichao Wang, Russell Whitenack, Tribikram Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 225–231.
https://doi.org/10.1115/1.1756146
Published Online: July 8, 2004
View Article titled, Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing
Open the PDF for Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing in another window
Topics: Failure, Solders, Stress, Temperature, Testing, Thermomechanics, Modeling, Electronic packaging, Fracture (Process), Constitutive equations
Journal Articles

Mechanics of Materials and Interfaces: The Disturbed State Concept

Chandrakant S. Desai,, Author, Antonio Gens,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2001, 123(4): 406.
https://doi.org/10.1115/1.1416148
Published Online: December 1, 2001
View Article titled, Mechanics of Materials and Interfaces: The Disturbed State Concept
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Topics: Civil engineering, Interface phenomena, Strength (Materials)