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Chris Chang
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Proceedings Papers
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 163-168, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24720
Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 79-89, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2249
Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 135-144, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2255
Proceedings Papers
A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 91-101, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2250
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
Published Online: July 26, 2002
Journal Articles
A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
Published Online: July 26, 2002
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 69–76.
Published Online: May 2, 2002
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 311–316.
Published Online: May 29, 2000