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Journal Articles

40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Chu-Hsuan Sha, Wen P. Lin, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021004.
https://doi.org/10.1115/1.4006705
Published Online: June 11, 2012
View Article titled, 40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding
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Topics: Bonding, Composite materials, Copper, Flip-chip, Silicon chips, Silver
Journal Articles

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Chu-Hsuan Sha, Pin J. Wang, Wen P. Lin, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
https://doi.org/10.1115/1.4005295
Published Online: December 9, 2011
View Article titled, Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C
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Topics: Bonding, Diffusion bonding (Metals), Pressure, Silver, Shear (Mechanics), Shear strength, Solders, Atoms, Temperature
Journal Articles

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
https://doi.org/10.1115/1.4004660
Published Online: September 30, 2011
View Article titled, 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
Open the PDF for 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding in another window
Topics: Bonding, Flip-chip, Silicon chips, Silver, Soldering, Thermal expansion, Pressure, Copper
Journal Articles

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
https://doi.org/10.1115/1.4003990
Published Online: June 23, 2011
View Article titled, Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
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Topics: Electronic packaging, Stainless steel, Surface finishing, Grain boundaries, Grain size, X-ray diffraction, X-ray analysis
Journal Articles

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
https://doi.org/10.1115/1.4003868
Published Online: June 22, 2011
View Article titled, Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates
Open the PDF for Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates in another window
Topics: Bonding, Silicon chips, Pressure, Shear (Mechanics), Silicon, Thermal expansion, Low temperature, Temperature