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D. J. de Kock
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Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 253-258, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73185
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 343-350, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35151
Proceedings Papers
Proc. ASME. IDETC-CIE2005, Volume 2: 31st Design Automation Conference, Parts A and B, 637-646, September 24–28, 2005
Publisher: American Society of Mechanical Engineers
Paper No: DETC2005-84968
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 333–341.
Published Online: October 6, 2004
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 143–147.
Published Online: September 1, 1999