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Daryl Santos
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Proceedings Papers

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)

Pushkraj Tumne, Vikram Venkatadri, Santosh Kudtarkar, Michael Delaus, Daryl Santos, Ross Havens, Krishnaswami Srihari
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 713-721, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52078
https://doi.org/10.1115/IPACK2011-52078
View Paper titled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)
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Topics: Design, Semiconductor wafers, Solders, Reliability, Electronics, Failure, Flip-chip, Intermetallic compounds, Brittle fracture, Failure mechanisms
Proceedings Papers

Optimizing System-on-Film (SOF) Design Using Finite Element Analysis

Vikram Venkatadri, Mark Downey, Xiaojie Xue, Dipak Sengupta, Daryl Santos, Ross Havens, Krishnaswami Srihari
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 723-731, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52143
https://doi.org/10.1115/IPACK2011-52143
View Paper titled, Optimizing System-on-Film (SOF) Design Using Finite Element Analysis
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Topics: Bonding, Compression, Design, Finite element analysis
Journal Articles

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Vikram Venkatadri, Bahgat Sammakia, Krishnaswami Srihari, Daryl Santos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
https://doi.org/10.1115/1.4005298
Published Online: December 9, 2011
View Article titled, A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
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Topics: Thermal management, Cooling, Silicon, Circuits, Integrated circuits, Heat
Journal Articles

Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process

Srinivasa Aravamudhan, Daryl Santos, Gerald Pham-Van-Diep, Frank Andres
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 340–352.
https://doi.org/10.1115/1.1938208
Published Online: December 10, 2004
View Article titled, Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process
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Topics: Printing, Solders