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Dirk Vandepitte
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Journal Articles

Analytical Prediction of Large Radius Bending by Circular Approximation

Vitalii Vorkov, Richard Aerens, Dirk Vandepitte, Joost R. Duflou
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2018, 140(12): 121010.
Paper No: MANU-18-1183
https://doi.org/10.1115/1.4041496
Published Online: October 5, 2018
View Article titled, Analytical Prediction of Large Radius Bending by Circular Approximation
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Topics: Approximation, Clearances (Engineering), Hardening, Steel, Errors
Journal Articles

Large Scale Validation of a Flexible Multibody Wind Turbine Gearbox Model

Frederik Vanhollebeke, Pepijn Peeters, Jan Helsen, Emilio Di Lorenzo, Simone Manzato, Joris Peeters, Dirk Vandepitte, Wim Desmet
Journal: Journal of Computational and Nonlinear Dynamics
Publisher: ASME
Article Type: Research-Article
J. Comput. Nonlinear Dynam. July 2015, 10(4): 041006.
Paper No: CND-13-1305
https://doi.org/10.1115/1.4028600
Published Online: July 1, 2015
View Article titled, Large Scale Validation of a Flexible Multibody Wind Turbine Gearbox Model
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Topics: Gears, Mechanical drives
Proceedings Papers

Analysis of Efficient Interval Field Techniques for Random Field Analysis With Uncertain Correlation Length

Wim Verhaeghe, Wim Desmet, Dirk Vandepitte, David Moens
Proc. ASME. IMECE2011, Volume 9: Transportation Systems; Safety Engineering, Risk Analysis and Reliability Methods; Applied Stochastic Optimization, Uncertainty and Probability, 841-848, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-63496
https://doi.org/10.1115/IMECE2011-63496
View Paper titled, Analysis of Efficient Interval Field Techniques for Random Field Analysis With Uncertain Correlation Length
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Topics: Dimensions, Eigenvalues, Uncertainty
Journal Articles

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 351–358.
https://doi.org/10.1115/1.1772416
Published Online: October 6, 2004
View Article titled, Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies
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Topics: Flip-chip assemblies, Stress, Thermomechanics, Flip-chip devices, Deformation, Structural mechanics, Finite element model
Journal Articles

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Bart Vandevelde, Eric Beyne, Kouchi (G.Q.) Zhang, Jo Caers, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 498–505.
https://doi.org/10.1115/1.1604150
Published Online: December 15, 2003
View Article titled, Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
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Topics: Finite element analysis, Reliability, Simulation, Solder joints, Solders, Modeling, Thermomechanics, Sensitivity analysis, Design, Dimensions