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1-7 of 7
Donald C. Price
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Proceedings Papers
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 67-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1004
Proceedings Papers
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 255-261, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32459
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 683-695, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73496
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 47-55, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35004
Proceedings Papers
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 631-639, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42209
Journal Articles
Donald C. Price, Life Fellow, ASME Principal Fellow,, B. Elliott Short,, Jr., Mem., ASME Senior Principal Mechanical Engineer,
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 11–17.
Published Online: February 15, 2005
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 67–73.
Published Online: April 30, 2004