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Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
DOI: https://doi.org/10.1115/IPACK2022-97283
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Degradation Modeling and Reliability Assessment of Capacitors

Anunay Gupta, Om Prakash Yadav, Arighna Roy, Douglas DeVoto, Joshua Major
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A018, October 7–9, 2019
Paper No: IPACK2019-6456
DOI: https://doi.org/10.1115/IPACK2019-6456
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Topics: Capacitors, Modeling, Reliability, Stochastic processes
Proceedings Papers

Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules

Erick Gutierrez, Kevin Lin, Douglas DeVoto, Patrick McCluskey
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A020, October 7–9, 2019
Paper No: IPACK2019-6470
DOI: https://doi.org/10.1115/IPACK2019-6470
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Topics: Gates (Closures), Transistors
Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
DOI: https://doi.org/10.1115/1.4043406
Published Online: May 8, 2019
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Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages
Proceedings Papers

A Review of Degradation Behavior and Modeling of Capacitors

Anunay Gupta, Om Prakash Yadav, Douglas DeVoto, Joshua Major
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 27–30, 2018
Paper No: IPACK2018-8262
DOI: https://doi.org/10.1115/IPACK2018-8262
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Topics: Capacitors, Modeling, Failure, Electronic systems, Metallized plastic film, Physics, Reliability
Proceedings Papers

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paul Paret, Joshua Major, Douglas DeVoto, Sreekant Narumanchi, Yansong Tan, Guo-Quan Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018
Paper No: IPACK2018-8276
DOI: https://doi.org/10.1115/IPACK2018-8276
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Topics: Silver, Particulate matter, Pressure, Collaboration, Displacement, Electronics, Energy gap, High pressure (Physics), High temperature, Manufacturing
Proceedings Papers

Reliability of Bonded Interfaces for Automotive Power Electronics

Douglas DeVoto, Paul Paret, Sreekant Narumanchi, Mark Mihalic
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A004, July 16–18, 2013
Paper No: IPACK2013-73143
DOI: https://doi.org/10.1115/IPACK2013-73143
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Topics: Electronics, Reliability, Cycles, Acoustics, Adhesives, Carbon fibers, Silver, Thermal resistance, Copper, Damage
Proceedings Papers

Thermal Performance and Reliability of Large-Area Bonded Interfaces in Power Electronics Packages

Sreekant Narumanchi, Douglas DeVoto, Mark Mihalic, Tim Popp, Patrick McCluskey
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 837-842, November 11–17, 2011
Paper No: IMECE2011-65399
DOI: https://doi.org/10.1115/IMECE2011-65399
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Topics: Electronic packages, Reliability, Copper, Cycles, Heat, Stress, Thermal resistance, Acoustics, Adhesives, Carbon fibers
Proceedings Papers

Reliable Power Electronics for Wind Turbines

Patrick McCluskey, Peter Hansen, Douglas DeVoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 771-773, July 19–23, 2009
Paper No: InterPACK2009-89174
DOI: https://doi.org/10.1115/InterPACK2009-89174
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Topics: Electronics, Wind turbines, Electronic systems, Failure, Fatigue, Packaging, Heat, Temperature, Bonding, Ceramics
Proceedings Papers

Reliability Analysis of Wind Turbines

Douglas DeVoto, Patrick McCluskey
Proc. ASME. ES2009, ASME 2009 3rd International Conference on Energy Sustainability, Volume 2, 1041-1045, July 19–23, 2009
Paper No: ES2009-90474
DOI: https://doi.org/10.1115/ES2009-90474
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Topics: Event history analysis, Wind turbines, Reliability, Failure, Physics, Blades, Mechanical drives, Wind
Proceedings Papers

Reliable Power Electronics for Wind Turbines

Douglas DeVoto, Patrick McCluskey
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 55-59, November 13–19, 2009
Paper No: IMECE2009-11776
DOI: https://doi.org/10.1115/IMECE2009-11776
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Topics: Electronics, Wind turbines, Failure, Electronic systems, Fatigue, Maintenance, Packaging, Reliability, Stress, Temperature