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Proceedings Papers

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 61-71, November 16–21, 1997

Publisher: American Society of Mechanical Engineers

Paper No: IMECE1997-0501

https://doi.org/10.1115/IMECE1997-0501

View Paper titled, Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Topics: Failure, Flip-chip packages, Stress, Design, Electronic packages, Thermomechanics, Adhesive joints, Cracking (Materials), Fillers (Materials), Finite element analysis

Journal Articles

Peridynamic Modeling of Hyperelastic Membrane Deformation

D. J. Bang, E. Madenci

Publisher: ASME

J. Eng. Mater. Technol. July 2017, 139(3): 031007.

Paper No: MATS-16-1305

https://doi.org/10.1115/1.4035875

Published Online: March 27, 2017

View Article titled, Peridynamic Modeling of Hyperelastic Membrane Deformation

Topics: Density, Membranes, Deformation, Displacement, Fracture (Materials)

Journal Articles

Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging

I. Guven, Mem. ASME, V. Kradinov, J. L. Tor, E. Madenci, Mem. ASME

Publisher: ASME

J. Electron. Packag. September 2004, 126(3): 398–405.

https://doi.org/10.1115/1.1773855

Published Online: October 6, 2004

View Article titled, Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging

Topics: Cycles, Density, Fracture (Materials), Reliability, Solder joints, Stress, Finite element analysis, Solders, Electronic packaging

Journal Articles

A Complex Potential-Variational Method for Stress Analysis of Unsymmetric Laminates With an Elliptical Cutout

E. Madenci, A. Barut, M. P. Nemeth

Publisher: ASME

J. Appl. Mech. September 2001, 68(5): 731–739.

https://doi.org/10.1115/1.1379528

Published Online: January 11, 2001

View Article titled, A Complex Potential-Variational Method for Stress Analysis of Unsymmetric Laminates With an Elliptical Cutout

Topics: Displacement, Finite element analysis, Laminates, Plates (structures), Stress, Stress analysis (Engineering), Tension, Potential energy, Boundary-value problems, Equilibrium (Physics)

Journal Articles

Local Buckling of a Circular Interface Delamination Between a Layer and a Substrate With Finite Thickness

R. Sburlati, E. Madenci, Mem. ASME, I. Guven

Publisher: ASME

J. Appl. Mech. September 2000, 67(3): 590–596.

https://doi.org/10.1115/1.1309547

Published Online: November 7, 1999

View Article titled, Local Buckling of a Circular Interface Delamination Between a Layer and a Substrate With Finite Thickness

Topics: Buckling, Delamination, Stress, Integral equations, Elasticity, Boundary-value problems

Journal Articles

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Publisher: ASME

J. Electron. Packag. December 1998, 120(4): 336–341.

https://doi.org/10.1115/1.2792643

Published Online: December 1, 1998

View Article titled, Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Topics: Failure, Flip-chip packages, Stress, Density, Finite element analysis

Journal Articles

Local Delamination Growth in Layered Systems Under Compressive Load

E. Madenci, R. A. Westmann

Publisher: ASME

J. Appl. Mech. December 1993, 60(4): 895–902.

https://doi.org/10.1115/1.2900999

Published Online: December 1, 1993

View Article titled, Local Delamination Growth in Layered Systems Under Compressive Load

Topics: Delamination, Stress, Buckling, Boundary-value problems, Compressive stress, Elasticity, Stability

Journal Articles

Local Delamination Buckling in Layered Systems

E. Madenci, R. A. Westmann

Publisher: ASME

J. Appl. Mech. March 1991, 58(1): 157–166.

https://doi.org/10.1115/1.2897143

Published Online: March 1, 1991

View Article titled, Local Delamination Buckling in Layered Systems

Topics: Buckling, Delamination, Approximation, Boundary-value problems, Elasticity, Equilibrium (Physics), Failure mechanisms, Stress

Journal Articles

Discussion: “A Further Examination on the Application of the Strain Energy Density Theory to the Angled Crack Problem” (Chang, K. J., 1982, ASME J. Appl. Mech., 49, pp. 377–385)

G. C. Sih, E. Madenci

Publisher: ASME

J. Appl. Mech. March 1983, 50(1): 234–236.

https://doi.org/10.1115/1.3167007

Published Online: March 1, 1983

View Article titled, Discussion: “A Further Examination on the Application of the Strain Energy Density Theory to the Angled Crack Problem” (Chang, K. J., 1982, ASME J. Appl. Mech., 49, pp. 377–385)

Topics: Density, Fracture (Materials)

Journal citation

NARROW

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Peridynamic Modeling of Hyperelastic Membrane Deformation

Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging

A Complex Potential-Variational Method for Stress Analysis of Unsymmetric Laminates With an Elliptical Cutout

Local Buckling of a Circular Interface Delamination Between a Layer and a Substrate With Finite Thickness

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Local Delamination Growth in Layered Systems Under Compressive Load

Local Delamination Buckling in Layered Systems

Discussion: “A Further Examination on the Application of the Strain Energy Density Theory to the Angled Crack Problem” (Chang, K. J., 1982, ASME J. Appl. Mech., 49, pp. 377–385)

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