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E. E. Marotta
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Journal Articles

Thermal Modeling of a Multilayer Insulation System

D. K. Kim, E. E. Marotta, L. S. Fletcher
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. September 2010, 132(9): 091303.
https://doi.org/10.1115/1.4001624
Published Online: June 29, 2010
View Article titled, Thermal Modeling of a Multilayer Insulation System
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Topics: Insulation, Pressure, Thermal conductivity, Thermal resistance, Wire, Modeling, Wire screens
Proceedings Papers

The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers

E. E. Marotta, M. J. Ellsworth, Jr., J. Norley, G. Getz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 139-146, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35060
https://doi.org/10.1115/IPACK2003-35060
View Paper titled, The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers
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Topics: Epoxy adhesives, Epoxy resins, Graphite, Heat sinks, Copper, Aluminum, Density, Thermal conductivity, Heat, Metals
Proceedings Papers

Modeling of Thermal Joint Resistance of Polymer-Metal Rough Interfaces

M. Bahrami, M. M. Yovanovich, E. E. Marotta
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 211-220, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60131
https://doi.org/10.1115/IMECE2004-60131
View Paper titled, Modeling of Thermal Joint Resistance of Polymer-Metal Rough Interfaces
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Topics: Metals, Modeling, Polymers, Surface roughness, Deformation, Thermal resistance, Vacuum
Journal Articles

Thermal Joint Resistance of Polymer-Metal Rough Interfaces

M. Bahrami, M. M. Yovanovich, E. E. Marotta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 23–29.
https://doi.org/10.1115/1.2159005
Published Online: May 11, 2005
View Article titled, Thermal Joint Resistance of Polymer-Metal Rough Interfaces
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Topics: Deformation, Metals, Polymers, Surface roughness, Thermal resistance, Temperature, Microhardness
Journal Articles

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 186–191.
https://doi.org/10.1115/1.1568126
Published Online: June 10, 2003
View Article titled, Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces
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Topics: Boundary-value problems, Contact resistance, Cylinders, Stress, Temperature, Thermal conductivity, Model development, Mechanical properties, Dimensions, Contact mechanics
Journal Articles

Thermal Contact Resistance Modeling of Non-Flat, Roughened Surfaces With Non-Metallic Coatings

E. E. Marotta, Assistant Professor, Mem. ASME, L. S. Fletcher, Thomas A. Dietz, Professor, Fellow ASME
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. February 2001, 123(1): 11–23.
https://doi.org/10.1115/1.1338135
Published Online: July 10, 2000
View Article titled, Thermal Contact Resistance Modeling of Non-Flat, Roughened Surfaces With Non-Metallic Coatings
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Topics: Coatings, Contact resistance, Surface roughness, Thermal conductivity
Journal Articles

Thermal Enhancement Coatings for Microelectronic Systems

L. S. Fletcher, M. A. Lambert, E. E. Marotta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 229–237.
https://doi.org/10.1115/1.2792627
Published Online: September 1, 1998
View Article titled, Thermal Enhancement Coatings for Microelectronic Systems
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Topics: Coatings, Electronic components, Failure, Heat
Journal Articles

The Thermal Contact Conductance of Hard and Soft Coat Anodized Aluminum

M. A. Lambert, E. E. Marotta, L. S. Fletcher
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 1995, 117(2): 270–275.
https://doi.org/10.1115/1.2822516
Published Online: May 1, 1995
View Article titled, The Thermal Contact Conductance of Hard and Soft Coat Anodized Aluminum
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Topics: Aluminum, Contact resistance, Coatings, Temperature, Electrical conductance, Electrolytes, Low temperature, Pressure, Anodizing, Electronic equipment