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E. Jih
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Proceedings Papers

A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints

Y.-H. Pao, E. Jih, V. Siddapureddy, X. Song, R. Liu, R. McMillan, J. M. Hu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 1-12, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0884
https://doi.org/10.1115/IMECE1996-0884
View Paper titled, A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints
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Topics: Fatigue, Resistors, Solder joints, Surface mount packaging, Capacitors, Ceramics, Density, Failure, Failure analysis, Fatigue failure
Journal Articles

Determination of Fracture Toughness of Thermally Conductive Adhesives

E. Jih, Y.-H. Pao, X. Song, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 204–207.
https://doi.org/10.1115/1.2792235
Published Online: September 1, 1997
View Article titled, Determination of Fracture Toughness of Thermally Conductive Adhesives
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Topics: Adhesives, Fracture toughness
Journal Articles

Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects

Y.-H. Pao, E. Jih, V. Siddapureddy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 235–243.
https://doi.org/10.1115/1.2792158
Published Online: December 1, 1996
View Article titled, Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects
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Topics: Design, Reliability, Solders
Journal Articles

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

R. K. Govila, E. Jih, Y.-H. Pao, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 83–88.
https://doi.org/10.1115/1.2905509
Published Online: June 1, 1994
View Article titled, Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
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Topics: Fatigue damage, Resistors, Solder joints, Solders, Damage, Stress concentration, Corners (Structural elements), Cracking (Materials), Cycles, Design
eBook Chapter

Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1994
https://doi.org/10.1520/STP23916S
ISBN-10: 0-8031-1994-1
ISBN: 978-0-8031-1994-9
Open the PDF for Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints in another window
Journal Articles

Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints

Y.-H. Pao, S. Badgley, E. Jih, R. Govila, J. Browning
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 147–152.
https://doi.org/10.1115/1.2909310
Published Online: June 1, 1993
View Article titled, Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints
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Topics: Cycles, Fatigue, Solder joints, Creep, Deformation, Solders, Steady state, Cooling, Failure, Failure mechanisms