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Frank M. Gerner
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Journal Articles

Thin-Film Evaporation in a Mesh Screen Wick

Karthik S. Remella, Frank M. Gerner
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2022, 144(11): 111601.
Paper No: HT-21-1599
https://doi.org/10.1115/1.4055115
Published Online: August 23, 2022
View Article titled, Thin-Film Evaporation in a Mesh Screen Wick
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Topics: Evaporation, Thin films, Vapors, Pressure, Fluids, Heat transfer coefficients, Flow (Dynamics), Shapes
Proceedings Papers

Experimental Investigation of Heat Transfer and Pressure Drop Through Deep Microchannels in a (110) Silicon Substrate

Todd M. Harms, Michael Kazmierczak, Frank M. Gerner, A. Hölke, H. T. Henderson, J. Pilchowski, Karl Baker
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 347-357, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0860
https://doi.org/10.1115/IMECE1997-0860
View Paper titled, Experimental Investigation of Heat Transfer and Pressure Drop Through Deep Microchannels in a (110) Silicon Substrate
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Topics: Heat transfer, Microchannels, Pressure drop, Silicon, Flow (Dynamics), Theoretical analysis, Chemical etching, Fluids, Forced convection, Reynolds number
Journal Articles

Mathematical Modeling of Novel Two-Phase Heat Transfer Device for Thermal Management of Light Emitting Diodes

Karthik S. Remella, Frank M. Gerner, Ahmed Shuja
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2017, 139(6): 062901.
Paper No: HT-15-1623
https://doi.org/10.1115/1.4035649
Published Online: February 28, 2017
View Article titled, Mathematical Modeling of Novel Two-Phase Heat Transfer Device for Thermal Management of Light Emitting Diodes
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Topics: Condensers (steam plant), Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Light-emitting diodes, Temperature, Thermal energy, Thermal management, Modeling
Journal Articles

Thermal Modeling and Experimental Validation for High Thermal Conductivity Heat Pipe Thermal Ground Planes

Mohammed T. Ababneh, Shakti Chauhan, Pramod Chamarthy, Frank M. Gerner
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2014, 136(11): 112901.
Paper No: HT-14-1004
https://doi.org/10.1115/1.4028086
Published Online: August 18, 2014
View Article titled, Thermal Modeling and Experimental Validation for High Thermal Conductivity Heat Pipe Thermal Ground Planes
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Topics: Boundary-value problems, Condensers (steam plant), Evaporation, Heat, Heat pipes, Heat transfer coefficients, Modeling, Temperature, Temperature distribution, Thermal conductivity
Proceedings Papers

Steady State Parametric Modeling of Non-Conventional Loop Heat Pipes

Karthik S. Remella, Frank M. Gerner, Ahmed Shuja
Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A025, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-63991
https://doi.org/10.1115/IMECE2013-63991
View Paper titled, Steady State Parametric Modeling of Non-Conventional Loop Heat Pipes
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Topics: Cooling, Heat pipes, Light-emitting diodes, Modeling, Steady state
Proceedings Papers

Fluid Flow and Capillary Limit in Heat Pipe Thermal Ground Planes

Mohammed T. Ababneh, Frank M. Gerner
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A013, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17034
https://doi.org/10.1115/HT2013-17034
View Paper titled, Fluid Flow and Capillary Limit in Heat Pipe Thermal Ground Planes
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Topics: Fluid dynamics, Heat pipes, Vapors, Pressure drop, Shear stress, Temperature, Condensation, Convection, Energy budget (Physics), Evaporation
Proceedings Papers

Non-Dimensional Analysis for the Fluid Flow in the Flat Heat Pipes

Mohammed T. Ababneh, Frank M. Gerner
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A014, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17035
https://doi.org/10.1115/HT2013-17035
View Paper titled, Non-Dimensional Analysis for the Fluid Flow in the Flat Heat Pipes
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Topics: Flat heat pipes, Fluid dynamics, Heat pipes, Shear stress, Cooling, Pressure, Vapor pressure, Computational fluid dynamics, Design, Fluids
Proceedings Papers

Steady State Numerical Modeling of Non-Conventional Loop Heat Pipes (LHPs)

Karthik S. Remella, Frank M. Gerner, Ahmed Shuja, Praveen Medis
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1467-1478, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88217
https://doi.org/10.1115/IMECE2012-88217
View Paper titled, Steady State Numerical Modeling of Non-Conventional Loop Heat Pipes (LHPs)
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Topics: Computer simulation, Heat pipes, Steady state, Condensers (steam plant), Vapors, Evaporation, Pressure, Convection, Copper, Design
Proceedings Papers

Thermal Modeling for High Thermal Conductivity Thermal Ground Planes

Mohammed T. Ababneh, Pramod Chamarthy, Shakti Chauhan, Frank M. Gerner, Peter de Bock, Tao Deng
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 625-634, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58115
https://doi.org/10.1115/HT2012-58115
View Paper titled, Thermal Modeling for High Thermal Conductivity Thermal Ground Planes
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Topics: Modeling, Thermal conductivity, Heat transfer coefficients, Cooling, Energy budget (Physics), Vapors, Condensation, Evaporation, Finite element model, Flow (Dynamics)
Proceedings Papers

Thermo-Fluid Model for High Thermal Conductivity Thermal Ground Planes

Mohammed T. Ababneh, Frank M. Gerner, Pramod Chamarthy, Peter de Bock, Shakti Chauhan, Tao Deng
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 929-937, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75185
https://doi.org/10.1115/MNHMT2012-75185
View Paper titled, Thermo-Fluid Model for High Thermal Conductivity Thermal Ground Planes
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Topics: Thermal conductivity, Thermofluids, Heat, Cooling, Gases, Heat pipes, Laminar flow, Microelectronic devices, Porosity, Pressure
Journal Articles

Charging Station of a Planar Miniature Heat Pipe Thermal Ground Plane

Mohammed T. Ababneh, Shakti Chauhan, Frank M. Gerner, Doug Hurd, Peter de Bock, Tao Deng
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. February 2013, 135(2): 021401.
Paper No: HT-11-1479
https://doi.org/10.1115/1.4007430
Published Online: December 28, 2012
View Article titled, Charging Station of a Planar Miniature Heat Pipe Thermal Ground Plane
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Topics: Calibration, Errors, Evacuations, Fluids, Heat pipes, Pressure, Vacuum, Valves, Water, Heat
Proceedings Papers

Development and Experimental Validation of a Micro/Nano Thermal Ground Plane

H. Peter J. de Bock, Shakti Chauhan, Pramod Chamarthy, Chris Eastman, Stanton Weaver, Bryan P. Whalen, Tao Deng, Boris Russ, Frank M. Gerner, Douglas Johnson, David Courson, Quinn Leland, Kirk Yerkes
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10249, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44646
https://doi.org/10.1115/AJTEC2011-44646
View Paper titled, Development and Experimental Validation of a Micro/Nano Thermal Ground Plane
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Topics: Computer cooling, Condensation, Dimensions, Electrical conductivity, Evaporation, Fluids, Gravity (Force), Heat, Heat pipes, Heat sinks
Proceedings Papers

Charging Station of a Planar Miniature Thermal Ground Plane

Mohammed T. Ababneh, Frank M. Gerner, Doug Hurd, Peter de Bock, Shakti Chauhan, Tao Deng
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10117, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44056
https://doi.org/10.1115/AJTEC2011-44056
View Paper titled, Charging Station of a Planar Miniature Thermal Ground Plane
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Topics: Calibration, Cooling, Design, Electrodes, Errors, Evacuations, Fluids, Gravity (Force), Heat pipes, Pressure
Proceedings Papers

Experimental Investigation of Micro/Nano Heat Pipe Wick Structures

H. Peter J. de Bock, Kripa Varanasi, Pramod Chamarthy, Tao Deng, Ambarish Kulkarni, Brian M. Rush, Boris A. Russ, Stanton E. Weaver, Frank M. Gerner
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 991-996, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67288
https://doi.org/10.1115/IMECE2008-67288
View Paper titled, Experimental Investigation of Micro/Nano Heat Pipe Wick Structures
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Topics: Heat pipes, Heat, Design, Condensed matter, Condensers (steam plant), Experimental methods, Geometry, Heat transfer, Resilience, Temperature gradient
Proceedings Papers

Operating Ranges of the Planar Loop Heat Pipe Under Non-Vacuum Conditions

Junwoo Suh, Ahmed Shuja, Praveen Medis, Srinivas Parimi, Frank M. Gerner, H. Thurman Henderson
Proc. ASME. HT2005, Heat Transfer: Volume 4, 737-742, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72381
https://doi.org/10.1115/HT2005-72381
View Paper titled, Operating Ranges of the Planar Loop Heat Pipe Under Non-Vacuum Conditions
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Topics: Heat pipes, Vacuum, Electrical measurement, Fluids, Heat, Vapors, Borosilicate glasses, Condensers (steam plant), Design, Electronic systems
Proceedings Papers

Mathematical and Experimental Investigation of Liquid-Gas Interfaces in Porous Wicks

Yuelei Yang, Frank M. Gerner, H. Thurman Henderson
Proc. ASME. IMECE2002, Heat Transfer, Volume 5, 169-174, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39180
https://doi.org/10.1115/IMECE2002-39180
View Paper titled, Mathematical and Experimental Investigation of Liquid-Gas Interfaces in Porous Wicks
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Topics: Capillarity, Hydrodynamics, Multiphase flow, Navier-Stokes equations, Oscillations, Porous materials, Pressure, Shapes, Silicon, Transients (Dynamics)
Proceedings Papers

The Dynamic Characteristics of a Liquid-Gas Interface in Microscale Pores

Junwoo Suh, Yuelei Yang, Frank M. Gerner, H. Thurman Henderson
Proc. ASME. IMECE2003, Heat Transfer, Volume 4, 247-253, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41862
https://doi.org/10.1115/IMECE2003-41862
View Paper titled, The Dynamic Characteristics of a Liquid-Gas Interface in Microscale Pores
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Topics: Bubbles, Drugs, Gravity (Force), Heat pipes, Microelectronic devices, Microscale devices, Particulate matter, Pressure, Slurries, Vacuum
Proceedings Papers

Competitive Designs of Evaporator Top Cap of the Micro Loop Heat Pipe

Praveen Kumar Arragattu, Frank M. Gerner, Priyanka Ponugoti, H. T. Henderson
Proc. ASME. IMECE2004, Microelectromechanical Systems, 85-97, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59476
https://doi.org/10.1115/IMECE2004-59476
View Paper titled, Competitive Designs of Evaporator Top Cap of the Micro Loop Heat Pipe
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Topics: Heat pipes, Temperature, Heat conduction, Pressure drop, Design, Heat, Manufacturing, Finite element analysis, Modeling, Pressure
Proceedings Papers

Nucleate Boiling Inside the Evaporator of the Planar Loop Heat Pipe

Junwoo Suh, Ahmed Shuja, Frank M. Gerner, H. Thurman Henderson
Proc. ASME. IMECE2004, Heat Transfer, Volume 3, 75-83, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59928
https://doi.org/10.1115/IMECE2004-59928
View Paper titled, Nucleate Boiling Inside the Evaporator of the Planar Loop Heat Pipe
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Topics: Heat pipes, Nucleate boiling, Fluids, Borosilicate glasses, Condensers (steam plant), Cooling, Evaporation, Glass, Heat, Heat transfer
Proceedings Papers

Microfabrication and Packaging Issues in the Development of a Planar Silicon Loop Heat Pipe, Using Si02 Fiber Wicks

Praveen S. Medis, Srinivas Parimi, Ahmed Shuja, H. Thurman Henderson, Junwoo Suh, Frank M. Gerner
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 67-76, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13543
https://doi.org/10.1115/IMECE2006-13543
View Paper titled, Microfabrication and Packaging Issues in the Development of a Planar Silicon Loop Heat Pipe, Using Si02 Fiber Wicks
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Topics: Fibers, Heat pipes, Microfabrication, Packaging, Silicon, Glass, Computer cooling, Cooling, Electronics, Microelectromechanical systems