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Fuqian Yang
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Journal Articles

Neural Network-Based Modeling of Diffusion-Induced Stress in a Hollow Cylindrical Nano-Electrode of Lithium-Ion Battery

Yong Li, Yunhao Wu, He Huang, Kai Zhang, Fuqian Yang
Journal: Journal of Electrochemical Energy Conversion and Storage
Publisher: ASME
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. February 2025, 22(1): 011011.
Paper No: JEECS-24-1046
https://doi.org/10.1115/1.4065536
Published Online: June 7, 2024
View Article titled, Neural Network-Based Modeling of Diffusion-Induced Stress in a Hollow Cylindrical Nano-Electrode of Lithium-Ion Battery
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Topics: Diffusion (Physics), Electrodes, Stress, Partial differential equations, Artificial neural networks, Lithium, Deep learning, Modeling, Boundary-value problems
Includes: Supplementary data
Proceedings Papers

Elasto-Plastic Finite Element Analysis of Indentations in Free Abrasive Machining

Milind Bhagavat, Fuqian Yang, Imin Kao
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 819-824, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1097
https://doi.org/10.1115/IMECE1998-1097
View Paper titled, Elasto-Plastic Finite Element Analysis of Indentations in Free Abrasive Machining
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Topics: Abrasive machining, Finite element analysis, Abrasives, Finite element methods, Fracture (Process), Sawing, Semiconductor wafers, Shapes, Slurries, Stress analysis (Engineering)
Proceedings Papers

Interaction Between Wire and Ingot in Wiresaw Slicing

Fuqian Yang, J. C. M. Li, Imin Kao
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 3-8, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0910
https://doi.org/10.1115/IMECE1999-0910
View Paper titled, Interaction Between Wire and Ingot in Wiresaw Slicing
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Topics: Wire, Deformation, Stiffness, Friction, Tension, Cutting, Displacement, Finite element analysis, Pressure
Proceedings Papers

Stress Analysis of Wiresaw Slicing Piezoelectric Materials

Fuqian Yang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 243-248, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2270
https://doi.org/10.1115/IMECE2000-2270
View Paper titled, Stress Analysis of Wiresaw Slicing Piezoelectric Materials
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Topics: Piezoelectric materials, Stress analysis (Engineering), Contact mechanics, Displacement, Electric fields, Stress, Boundary-value problems, Electric potential, Piezoelectricity, Stress singularity
Proceedings Papers

Determination of Surface Damage in the Grinding of Silicon Wafers

Fuqian Yang, Peixing Fei
Proc. ASME. IMECE2003, Manufacturing, 683-687, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42309
https://doi.org/10.1115/IMECE2003-42309
View Paper titled, Determination of Surface Damage in the Grinding of Silicon Wafers
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Topics: Damage, Grinding, Semiconductor wafers, Cutting, Elasticity, Fracture mechanics, Ground glass, Manufacturing industry, Silicon, Surface cracks
Journal Articles

Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

Fuqian Yang, Research Assistant Professor, Imin Kao, Associate Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 254–259.
https://doi.org/10.1115/1.1348019
Published Online: August 30, 2000
View Article titled, Free Abrasive Machining in Slicing Brittle Materials With Wiresaw
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Topics: Abrasive machining, Abrasives, Brittleness, Cutting, Deformation, Fracture (Materials), Particulate matter, Stress, Wire, Modeling
Journal Articles

Squeezing Flow of an Eyring Fluid

Fuqian Yang, T. F. Conry, J. C. M. Li
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. July 1997, 119(3): 593–596.
https://doi.org/10.1115/1.2833542
Published Online: July 1, 1997
View Article titled, Squeezing Flow of an Eyring Fluid
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Topics: Flow (Dynamics), Fluids