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Proceedings Papers

Influence of the Conductivity of the Oil on the Electrorheology of Zeolite/Mineral Oil Suspensions

C. W. Wu, Y. Chen, H. Conrad
Proc. ASME. IMECE96, Rheology and Fluid Mechanics of Nonlinear Materials, 267-275, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0250
https://doi.org/10.1115/IMECE1996-0250
View Paper titled, Influence of the Conductivity of the Oil on the Electrorheology of Zeolite/Mineral Oil Suspensions
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Topics: Electrical conductivity, Electrorheological fluids, Mineral oil, Thermal conductivity, Current density, Oils, Petroleum, Electric fields, Heat conduction, Heating
Proceedings Papers

Theoretical and Experimental Considerations of Electrorheology With DC and AC Fields

C. W. Wu, H. Conrad
Proc. ASME. IMECE97, Rheology and Fluid Mechanics of Nonlinear Materials, 185-196, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0486
https://doi.org/10.1115/IMECE1997-0486
View Paper titled, Theoretical and Experimental Considerations of Electrorheology With DC and AC Fields
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Topics: Electrorheological fluids, Particulate matter, Current density, Design, Electrical conductivity, Fluids, Shear (Mechanics), Thermal conductivity, Thin films, Yield strength
Journal Articles

Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor

J. Campbell, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 241–245.
https://doi.org/10.1115/1.2792099
Published Online: September 1, 1995
View Article titled, Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor
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Topics: Thick films, Wetting, Temperature, Tin, Alloys, Atoms, Diffusion (Physics), Intermetallic compounds, Solders
Journal Articles

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

Z. Guo, Yi-Hsin Pao, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 100–104.
https://doi.org/10.1115/1.2792074
Published Online: June 1, 1995
View Article titled, Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints
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Topics: Deformation, Solder joints, Temperature, Shear rate, Shear stress, Creep, Diffusion (Physics), Dislocations, Grain size, High temperature
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

D. Barker, S. Burchett, H. Conrad, A. Dasgupta, P. Engel, J. Lau, Y. Pao, A. Rafanelli, R. Ross, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1995, 117(2): 93.
https://doi.org/10.1115/1.2792086
Published Online: June 1, 1995
View Article titled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints

Z. Guo, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 159–164.
https://doi.org/10.1115/1.2909312
Published Online: June 1, 1993
View Article titled, Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints
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Topics: Fatigue cracks, Solder joints, Shear (Mechanics), Solders, Intermetallic compounds, Metals, Preferences, Temperature
Journal Articles

Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening

P. Hacke, A. F. Sprecher, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 153–158.
https://doi.org/10.1115/1.2909311
Published Online: June 1, 1993
View Article titled, Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening
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Topics: Computer simulation, Fatigue, Solder joints, Thermomechanics, Creep, Stress, Cycles, Damage, Failure, Fatigue life
eBook Chapter

Metallography Applied to the Structure of Electrorheological (ER) Fluids

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1993
https://doi.org/10.1520/STP25114S
ISBN-10: 0-8031-1484-2
ISBN: 978-0-8031-1484-5
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eBook Chapter

Modeling of the Thermomechanical Fatigue of 63Sn-37Pb Alloy

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1993
https://doi.org/10.1520/STP24251S
ISBN-10: 0-8031-1871-6
ISBN: 978-0-8031-1871-3
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Journal Articles

Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue

Z. Guo, A. F. Sprecher, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 112–117.
https://doi.org/10.1115/1.2906406
Published Online: June 1, 1992
View Article titled, Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue
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Topics: Deformation, Low cycle fatigue, Solder joints, Tin, Stress, Alloys, Dislocations, Shear (Mechanics)
eBook Chapter

Multiparticle Erosion of Pyrex Glass

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1979
https://doi.org/10.1520/STP35796S
ISBN-10: 0-8031-0334-4
ISBN: 978-0-8031-0334-4
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Journal Articles

The Fracture Toughness of Beryllium

H Conrad, J Hurd, D Woodard
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. March 1973, 1(2): 88–99.
https://doi.org/10.1520/JTE10883J
Published Online: March 1, 1973
View Article titled, The Fracture Toughness of Beryllium
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eBook Chapter

Introduction

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1968
https://doi.org/10.1520/STP33616S
ISBN-10: 0-8031-0748-X
ISBN: 978-0-8031-0748-9
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eBook
Book Cover Image

Applications Related Phenomena in Titanium Alloys

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1968
https://doi.org/10.1520/STP432-EB
ISBN-10: 0-8031-0748-X
ISBN: 978-0-8031-0748-9
eBook Chapter

3-2 Cold Welding in Copper in an Ultra-High Vacuum

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1967
https://doi.org/10.1520/STP45164S
ISBN-10: 0-8031-6182-4
ISBN: 978-0-8031-6182-5
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