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Proceedings Papers

Effects of Wall Shear and Rayleigh-Taylor Instabilities on a Gas-Liquid Interface in a High-Speed Multiphase Flow

Carlton Adam, Hamid Hadim
Proc. ASME. IMECE2015, Volume 7A: Fluids Engineering Systems and Technologies, V07AT09A002, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-51033
https://doi.org/10.1115/IMECE2015-51033
View Paper titled, Effects of Wall Shear and Rayleigh-Taylor Instabilities on a Gas-Liquid Interface in a High-Speed Multiphase Flow
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Topics: Multiphase flow, Shear (Mechanics), Slug flows, Fluids, Pressure, Simulation, Cycles, Design, Boundary-value problems, Combustion
Proceedings Papers

Numerical Study of Transient Multiphase Slug Flow Through a Tube at High Velocity

Carlton Adam, Hamid Hadim
Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A073, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65104
https://doi.org/10.1115/IMECE2013-65104
View Paper titled, Numerical Study of Transient Multiphase Slug Flow Through a Tube at High Velocity
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Topics: Slug flows, Transients (Dynamics), Computer simulation, Flow (Dynamics), Pressure, Computational fluid dynamics, Deformation, Phase transitions, Pipes, Plumes (Fluid dynamics)
Proceedings Papers

Characterization of Thermoelectric Oxide Nanofibers Using MEMS Device

Weihe Xu, Guitao Zhang, Hamid Hadim, Yong Shi
Proc. ASME. IDETC-CIE2013, Volume 1: 15th International Conference on Advanced Vehicle Technologies; 10th International Conference on Design Education; 7th International Conference on Micro- and Nanosystems, V001T09A027, August 4–7, 2013
Publisher: American Society of Mechanical Engineers
Paper No: DETC2013-13421
https://doi.org/10.1115/DETC2013-13421
View Paper titled, Characterization of Thermoelectric Oxide Nanofibers Using MEMS Device
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Topics: Microelectromechanical systems, Nanofibers, Thermal conductivity, Electrospinning
Journal Articles

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

Tohru Suwa, Hamid Hadim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
https://doi.org/10.1115/1.4005291
Published Online: December 23, 2011
View Article titled, Thermal Modeling Technique for Multiple Transistors Within Silicon Chip
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Topics: Finite element analysis, Heat, Modeling, Silicon chips, Temperature, Temperature distribution, Transistors
Journal Articles

Fabrication of Thermoelectric La 0.95 Sr 0.05 CoO 3 Thin Film and Seebeck Coefficient Measurement

Weihe Xu, Qi Chen, Hamid Hadim, Yong Shi
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. December 2011, 3(4): 044502.
https://doi.org/10.1115/1.4005051
Published Online: October 24, 2011
View Article titled, Fabrication of Thermoelectric La 0.95 Sr 0.05 CoO 3 Thin Film and Seebeck Coefficient Measurement
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Topics: Manufacturing, Thin films, Microelectromechanical systems, Spin coating
Proceedings Papers

Fabrication of Thermoelectric La 0.95 Sr 0.05 CoO 3 Thin Film and Seebeck Coefficient Measurement

Weihe Xu, Qi Chen, Yong Shi, Hamid Hadim
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30096, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44554
https://doi.org/10.1115/AJTEC2011-44554
View Paper titled, Fabrication of Thermoelectric La 0.95 Sr 0.05 CoO 3 Thin Film and Seebeck Coefficient Measurement
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Topics: Manufacturing, Microelectromechanical systems, Thin films
Proceedings Papers

Multi-Packaging-Level Thermal Modeling Technique for Silicon Chip Transistors

Tohru Suwa, Hamid Hadim
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1365-1372, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11815
https://doi.org/10.1115/IMECE2009-11815
View Paper titled, Multi-Packaging-Level Thermal Modeling Technique for Silicon Chip Transistors
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Topics: Integrated circuits, Modeling, Packaging, Silicon chips, Transistors
Proceedings Papers

Optimal Placement of Heat Generating Components at Various Levels of Electronics Packaging

Tohru Suwa, Hamid Hadim
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 185-190, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11795
https://doi.org/10.1115/IMECE2009-11795
View Paper titled, Optimal Placement of Heat Generating Components at Various Levels of Electronics Packaging
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Topics: Artificial neural networks, Electronic packaging, Heat, Optimization
Proceedings Papers

Multidisciplinary Design and Optimization for Oscillating Flow Polymerase Chain Reaction Microfluidics Device

Tohru Suwa, Hamid Hadim, Yong Shi
Proc. ASME. IMECE2009, Volume 2: Biomedical and Biotechnology Engineering, 187-193, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11820
https://doi.org/10.1115/IMECE2009-11820
View Paper titled, Multidisciplinary Design and Optimization for Oscillating Flow Polymerase Chain Reaction Microfluidics Device
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Topics: Chain, Design, Flow (Dynamics), Microfluidics, Optimization, Transients (Dynamics)
Proceedings Papers

Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm

Tohru Suwa, Hamid Hadim
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 773-779, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33443
https://doi.org/10.1115/IPACK2007-33443
View Paper titled, Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm
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Topics: Electrical wires, Genetic algorithms, Heat, Optimization
Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks

Tohru Suwa, Hamid Hadim
Proc. ASME. HT2008, Heat Transfer: Volume 2, 779-787, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56056
https://doi.org/10.1115/HT2008-56056
View Paper titled, Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks
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Topics: Design, Electrical wires, Heat, Optimization, Semiconductors (Materials)
Proceedings Papers

A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design

Hamid Hadim, Tohru Suwa
Proc. ASME. HT2003, Heat Transfer: Volume 3, 557-564, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47524
https://doi.org/10.1115/HT2003-47524
View Paper titled, A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design
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Topics: Ball-Grid-Array packaging, Design, Electronic packaging, Optimization, Artificial neural networks, Electronic products, Engineering disciplines, Leakage, Packaging, Tradeoffs
Journal Articles

Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Hamid Hadim, Tohru Suwa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
https://doi.org/10.1115/1.2957459
Published Online: July 30, 2008
View Article titled, Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review
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Topics: Design, Electronic packaging, Optimization, Optimization algorithms
Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks

Tohru Suwa, Hamid Hadim
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 339-347, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81483
https://doi.org/10.1115/IMECE2005-81483
View Paper titled, Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks
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Topics: Artificial neural networks, Channel flow, Electronic components, Forced convection, Heat, Optimization, Printed circuit boards, Temperature, Junctions, Heat flux
Proceedings Papers

Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Tohru Suwa, Hamid Hadim
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 275-286, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15283
https://doi.org/10.1115/IMECE2006-15283
View Paper titled, Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review
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Topics: Design, Electronic packaging, Optimization, Artificial neural networks, Experimental design, Modeling, Numerical analysis, Computation, Computer-aided design, Graphical user interfaces
Journal Articles

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

Tohru Suwa, Hamid Hadim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
https://doi.org/10.1115/1.2429715
Published Online: April 19, 2006
View Article titled, Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards
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Topics: Genetic algorithms, Heat, Junctions, Optimization, Temperature, Electrical wires, Density, Artificial neural networks, Electronic components
Journal Articles

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

Hamid Hadim, Tohru Suwa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
https://doi.org/10.1115/1.1997161
Published Online: November 16, 2004
View Article titled, A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks
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Topics: Artificial neural networks, Design, Optimization, Ball-Grid-Array packaging, Ball-Grid-Array packages, Solders