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Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Paper No: IPACK2022-97434
DOI: https://doi.org/10.1115/IPACK2022-97434
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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level

Himanshu Modi, Pardeep Shahi, Akiilessh Sivakumar, Satyam Saini, Pratik Bansode, Vibin Shalom, Amrutha Valli Rachakonda, Gautam Gupta, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 25–27, 2022
Paper No: IPACK2022-97443
DOI: https://doi.org/10.1115/IPACK2022-97443
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Topics: Computational fluid dynamics, Cooling, Transient analysis, Transients (Dynamics)
Proceedings Papers

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022
Paper No: IPACK2022-97402
DOI: https://doi.org/10.1115/IPACK2022-97402
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Topics: Computational fluid dynamics, Cooling, Fluids, Forced convection, Power density, Simulation, Temperature, Thermal conductivity
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
DOI: https://doi.org/10.1115/IPACK2022-97587
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server

Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 25–27, 2022
Paper No: IPACK2022-97445
DOI: https://doi.org/10.1115/IPACK2022-97445
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Topics: Computational fluid dynamics, Cooling, Heat
Proceedings Papers

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Paper No: IPACK2022-97494
DOI: https://doi.org/10.1115/IPACK2022-97494
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Topics: Cooling, Data centers, Density, Doors, Heat exchangers