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Proceedings Papers

Microscale Liquid Impingement Cooling

Lian Zhang, Evelyn N. Wang, Jon D. Koch, Jonathan T. C. Liu, Jae-Mo Koo, Linan Jiang, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 135-140, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23820
https://doi.org/10.1115/IMECE2001/MEMS-23820
View Paper titled, Microscale Liquid Impingement Cooling
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Topics: Impingement cooling, Microelectromechanical systems, Microscale devices, Jets, Water, Computer cooling, Flow (Dynamics), Heat flux, Heat transfer coefficients, Orifices
Proceedings Papers

Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions

Lian Zhang, Jae-Mo Koo, Linan Jiang, Shilajeet S. Banerjee, Mehdi Ashegi, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 129-135, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1082
https://doi.org/10.1115/IMECE2000-1082
View Paper titled, Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions
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Topics: Boundary-value problems, Heat flux, Microchannels, Modeling, Two-phase flow, Boiling, Dimensions, Flow (Dynamics), Silicon, Bubbles
Proceedings Papers

Compact Model of Slug Flow in Microchannels

Dong Rip Kim, Jae-Mo Koo, Chen Fang, Julie E. Steinbrenner, Eon Soo Lee, Fu-Min Wang, Carlos H. Hidrovo, John K. Eaton, Kenneth E. Goodson
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 321-329, June 18–20, 2007
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2007-30146
https://doi.org/10.1115/ICNMM2007-30146
View Paper titled, Compact Model of Slug Flow in Microchannels
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Topics: Microchannels, Slug flows, Pressure drop, Drops, Proton exchange membrane fuel cells, Water, Flow (Dynamics), Friction, Gas flow, Momentum
Proceedings Papers

Frictional Characteristics of Microchannel Gas Flow

Abdullahel Bari, Jae-Mo Koo, Linan Jiang, Jay Paidipati, Kenneth E. Goodson
Proc. ASME. ICMM2003, 1st International Conference on Microchannels and Minichannels, 307-310, April 24–25, 2003
Publisher: American Society of Mechanical Engineers
Paper No: ICMM2003-1034
https://doi.org/10.1115/ICMM2003-1034
View Paper titled, Frictional Characteristics of Microchannel Gas Flow
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Topics: Gas flow, Microchannels, Turbulence, Design, Flow (Dynamics), Friction, Heat transfer, Microfluidics
Proceedings Papers

Convective Boiling in Silicon Microchannels With Localized Heating and Thermometry

Roger D. Flynn, Theresa A. Kramer, Jae-Mo Koo, Ching-Hsiang Cheng, David W. Fogg, Evelyn N. Wang, Kenneth E. Goodson
Proc. ASME. ICMM2005, ASME 3rd International Conference on Microchannels and Minichannels, Part B cont’d, 125-130, June 13–15, 2005
Publisher: American Society of Mechanical Engineers
Paper No: ICMM2005-75209
https://doi.org/10.1115/ICMM2005-75209
View Paper titled, Convective Boiling in Silicon Microchannels With Localized Heating and Thermometry
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Topics: Boiling, Heating, Microchannels, Silicon, Temperature measurement, Flow (Dynamics), Heat sinks, Sensors, Aluminum, Design
Proceedings Papers

Two-Phase Microfluidics for Semiconductor Circuits and Fuel Cells (Keynote)

Carlos H. Hidrovo, Theresa A. Kramer, Evelyn N. Wang, Se´bastien Vigneron, Julie E. Steinbrenner, Jae-Mo Koo, Fu-Min Wang, David W. Fogg, Roger D. Flynn, Eon Soo Lee, Ching-Hsiang Cheng, Thomas W. Kenny, John K. Eaton, Kenneth E. Goodson
Proc. ASME. ICMM2005, ASME 3rd International Conference on Microchannels and Minichannels, Parts A and B, 49-58, June 13–15, 2005
Publisher: American Society of Mechanical Engineers
Paper No: ICMM2005-75085
https://doi.org/10.1115/ICMM2005-75085
View Paper titled, Two-Phase Microfluidics for Semiconductor Circuits and Fuel Cells (Keynote)
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Topics: Circuits, Cooling, Fuel cells, Microchannels, Microfluidics, Semiconductors (Materials), Two-phase flow
Proceedings Papers

Cross-Linked Microchannels for VLSI Hotspot Cooling

Linan Jiang, Jae-Mo Koo, Evelyn Wang, Abdullahel Bari, Eun Seok Cho, Wendy Ong, Ravi S. Prasher, Jim Maveety, Min Soo Kim, Thomas W. Kenny, Juan G. Santiago, Kenneth E. Goodson
Proc. ASME. IMECE2002, Microelectromechanical Systems, 13-17, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39238
https://doi.org/10.1115/IMECE2002-39238
View Paper titled, Cross-Linked Microchannels for VLSI Hotspot Cooling
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Topics: Cooling, Heat sinks, Heating, Microchannels
Proceedings Papers

VLSI Hotspot Cooling Using Two-Phase Microchannel Convection

Jae-Mo Koo, Sungjun Im, Eun Seok Cho, Ravi S. Prasher, Evelyn Wang, Linan Jiang, Abdullahel Bari, David Campion, David Fogg, Min Soo Kim, Thomas W. Kenny, Juan G. Santiago, Kenneth E. Goodson
Proc. ASME. IMECE2002, Process Industries, 13-19, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39585
https://doi.org/10.1115/IMECE2002-39585
View Paper titled, VLSI Hotspot Cooling Using Two-Phase Microchannel Convection
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Topics: Convection, Cooling, Heat sinks, Microchannels
Proceedings Papers

Boiling Flow Interaction Between Two Parallel Microchannels

Roger D. Flynn, David W. Fogg, Jae-Mo Koo, Ching-Hsiang Cheng, Kenneth E. Goodson
Proc. ASME. IMECE2006, Heat Transfer, Volume 2, 317-322, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-14696
https://doi.org/10.1115/IMECE2006-14696
View Paper titled, Boiling Flow Interaction Between Two Parallel Microchannels
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Topics: Boiling, Flow (Dynamics), Microchannels, Heat transfer, Heat exchangers, Boundary-value problems, Fluids, Heat sinks, Pumps, Silicon
Journal Articles

Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

Jae-Mo Koo, Sungjun Im, Linan Jiang, Kenneth E. Goodson
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 49–58.
https://doi.org/10.1115/1.1839582
Published Online: February 15, 2005
View Article titled, Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures
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Topics: Circuits, Convection, Cooling, Heat sinks, Microchannels, Temperature, Thermal resistance, Heat, Boiling, Flow (Dynamics)