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James Petroski
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Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48635
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041005.
Paper No: EP-13-1106
Published Online: September 19, 2014
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A035, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73179
Proceedings Papers
Proc. ASME. HT2008, Heat Transfer: Volume 2, 671-677, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56405
Proceedings Papers
Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 1347-1354, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-41275
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 111-117, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35055
Proceedings Papers
Proc. ASME. IMECE2004, Heat Transfer, Volume 1, 29-37, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61145
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 328–338.
Published Online: April 9, 2007