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K. J. Lau
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Proceedings Papers

A Method for Assessing the “Local” Accuracy of Weight Functions for Plates With Embedded Cracks

S. W. Ng, K. J. Lau
Proc. ASME. DETC95, Volume 2: 11th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention; 7th International Conference on Design Theory and Methodology; JSME Symposium on Design and Production; Mechanical Design Education and History; Computer-Integrated Concurrent Design Conference, 243-247, September 17–20, 1995
Publisher: American Society of Mechanical Engineers
Paper No: DETC1995-0158
https://doi.org/10.1115/DETC1995-0158
View Paper titled, A Method for Assessing the “Local” Accuracy of Weight Functions for Plates With Embedded Cracks
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Topics: Fracture (Materials), Plates (structures), Weight (Mass), Stress, Algorithms, Finite element analysis
Proceedings Papers

A Unified Viscoplastic Fatigue Damage Model for 63Sn-37Pb Solder Alloy Under Cyclic Stress Control

X. J. Yang, C. L. Chow, K. J. Lau
Proc. ASME. IMECE2002, Applied Mechanics and Biomedical Technology, 45-54, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32862
https://doi.org/10.1115/IMECE2002-32862
View Paper titled, A Unified Viscoplastic Fatigue Damage Model for 63Sn-37Pb Solder Alloy Under Cyclic Stress Control
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Topics: Alloys, Creep, Damage, Fatigue damage, Solders, Stress
Journal Articles

Behavior of Lead-Free Solder Under Thermomechanical Loading

Y. Wei, C. L. Chow, K. J. Lau, P. Vianco, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 367–373.
https://doi.org/10.1115/1.1773197
Published Online: October 6, 2004
View Article titled, Behavior of Lead-Free Solder Under Thermomechanical Loading
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Topics: Constitutive equations, Damage, Deformation, Finite element analysis, Lead-free solders, Solders, Stress, Temperature, Thermomechanics, Alloys
Journal Articles

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Xianjie Yang, C. L. Chow, K. J. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
https://doi.org/10.1115/1.1649246
Published Online: April 30, 2004
View Article titled, Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
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Topics: Algorithms, Computer simulation, Constitutive equations, Damage, Hardening, Shear (Mechanics), Solders, Stress, Viscoplasticity, Finite element analysis
Journal Articles

Robust Fixture Configuration Design for Sheet Metal Assembly With Laser Welding

Bing Li, B. W. Shiu, K. J. Lau
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2003, 125(1): 120–127.
https://doi.org/10.1115/1.1536172
Published Online: March 4, 2003
View Article titled, Robust Fixture Configuration Design for Sheet Metal Assembly With Laser Welding
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Topics: Design, Laser welding, Manufacturing, Sheet metal, Response surface methodology, Metals