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Michael Pecht
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Journal Articles

Lithium-Ion Battery Strain Gauge Monitoring and Depth of Discharge Estimation

Christopher Hendricks, Bhanu Sood, Michael Pecht
Journal: Journal of Electrochemical Energy Conversion and Storage
Publisher: ASME
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. February 2023, 20(1): 011008.
Paper No: JEECS-21-1224
https://doi.org/10.1115/1.4054340
Published Online: May 12, 2022
View Article titled, Lithium-Ion Battery Strain Gauge Monitoring and Depth of Discharge Estimation
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Topics: Artificial neural networks, Batteries, Lithium-ion batteries, Strain gages, Lithium, Electrodes, Stress, US Department of Defense
Journal Articles

Intermittent Failures in Hardware and Software

Roozbeh Bakhshi, Surya Kunche, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011014.
Paper No: EP-13-1111
https://doi.org/10.1115/1.4026639
Published Online: February 18, 2014
View Article titled, Intermittent Failures in Hardware and Software
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Topics: Computer software, Failure, Hardware
Proceedings Papers

Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach

Preeti Chauhan, Subhasis Mukherjee, Michael Osterman, Abhijit Dasgupta, Michael Pecht
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73164
https://doi.org/10.1115/IPACK2013-73164
View Paper titled, Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach
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Topics: Creep, Micromechanics (Engineering), Solders, Tin, Nanoscale phenomena, Solder joints, Alloys, Image processing, Intermetallic compounds, Particulate matter
Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
https://doi.org/10.1115/1.4006704
Published Online: June 11, 2012
View Article titled, Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric
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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms
Proceedings Papers

Design for Reliability of Refrigerator Components Subject to Repetitive Loads in Use

Seong-woo Woo, Dennis L. O’Neal, Michael Pecht, Hyoung-Eui Kim
Proc. ASME. IMECE2010, Volume 11: New Developments in Simulation Methods and Software for Engineering Applications; Safety Engineering, Risk Analysis and Reliability Methods; Transportation Systems, 235-242, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37134
https://doi.org/10.1115/IMECE2010-37134
View Paper titled, Design for Reliability of Refrigerator Components Subject to Repetitive Loads in Use
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Topics: Design, Reliability, Stress, Corrective actions, Failure, Life testing, Food products, Fracture (Process)
Proceedings Papers

Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions

Shilin Liu, Qiang Yu, Michael Pecht
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 201-205, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52111
https://doi.org/10.1115/IPACK2011-52111
View Paper titled, Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions
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Topics: Reliability, Stress, Accounting, Electronic components, Fatigue life, Semiconductors (Materials)
Proceedings Papers

Evaluation of Robust Covariance Estimation Techniques for Anomaly Detection of Insulated Gate Bipolar Transistors (IGBT)

Nishad Patil, Sandeep Menon, Diganta Das, Michael Pecht
Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 769-773, September 28–October 1, 2010
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2010-3861
https://doi.org/10.1115/SMASIS2010-3861
View Paper titled, Evaluation of Robust Covariance Estimation Techniques for Anomaly Detection of Insulated Gate Bipolar Transistors (IGBT)
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Topics: Failure, Gates (Closures), Stress, Transistors
Proceedings Papers

Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 783-792, September 28–October 1, 2010
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2010-3864
https://doi.org/10.1115/SMASIS2010-3864
View Paper titled, Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging
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Topics: Capacitors, Temperature, Failure, Failure mechanisms, Insulation, Capacitance, Laminates, Printed circuit boards, Composite materials, Energy dissipation
Journal Articles

Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

Weiqiang Wang, Michael Osterman, Diganta Das, Michael Pecht
Journal: Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. September 2010, 7(8): 1–11.
https://doi.org/10.1520/JAI102939
Published Online: September 1, 2010
View Article titled, Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
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Proceedings Papers

A Radio Frequency Sensor System for Prognostics and Health Management

Shunfeng Cheng, Larry Thomas, Jason L. Cook, Michael Pecht
Proc. ASME. IDETC-CIE2009, Volume 2: 29th Computers and Information in Engineering Conference, Parts A and B, 1317-1322, August 30–September 2, 2009
Publisher: American Society of Mechanical Engineers
Paper No: DETC2009-87723
https://doi.org/10.1115/DETC2009-87723
View Paper titled, A Radio Frequency Sensor System for Prognostics and Health Management
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Topics: Sensors, Algorithms, Computers, Failure
Proceedings Papers

Identification of Failure Precursor Parameters for Cooling Fans

Hyunseok Oh, Tadahiro Shibutani, Michael Pecht
Proc. ASME. IDETC-CIE2009, Volume 2: 29th Computers and Information in Engineering Conference, Parts A and B, 1253-1258, August 30–September 2, 2009
Publisher: American Society of Mechanical Engineers
Paper No: DETC2009-86280
https://doi.org/10.1115/DETC2009-86280
View Paper titled, Identification of Failure Precursor Parameters for Cooling Fans
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Topics: Cooling, Failure, Fans, Reliability, Testing, Acoustics, Ball bearings, Electronic equipment, Failure mechanisms, Military systems
Proceedings Papers

Characterization of Lead-Free Solder Interconnects Reliability Under Torsional Loads

Vikram Srinivas, Moustafa Al-Bassyiouni, Michael Osterman, Michael Pecht
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 211-216, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11376
https://doi.org/10.1115/IMECE2009-11376
View Paper titled, Characterization of Lead-Free Solder Interconnects Reliability Under Torsional Loads
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Topics: Lead-free solders, Reliability, Resistors, Stress, Torsion
Proceedings Papers

Physics of Failure Based Virtual Testing of Communications Hardware

Elviz George, Diganta Das, Michael Osterman, Michael Pecht, Christopher Otte
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 191-197, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12181
https://doi.org/10.1115/IMECE2009-12181
View Paper titled, Physics of Failure Based Virtual Testing of Communications Hardware
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Topics: Failure, Hardware, Physics, Testing, Design, Simulation, Computer software, Cycles, Reliability, Vibration
Proceedings Papers

Impact of Thermal Aging on the Growth of Cu-Sn Intermetallic Compounds in Pb-Free Solder Joints in 2512 Resistors

Preeti Chauhan, Michael Osterman, Michael Pecht
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 199-210, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10169
https://doi.org/10.1115/IMECE2009-10169
View Paper titled, Impact of Thermal Aging on the Growth of Cu-Sn Intermetallic Compounds in Pb-Free Solder Joints in 2512 Resistors
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Topics: Intermetallic compounds, Lead-free solders, Resistors, Tin, Solders, Temperature, Copper, High temperature, Manufacturing, Reliability
Proceedings Papers

Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method

Vinh Khuu, Michael Osterman, Avram Bar-Cohen, Michael Pecht
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 405-414, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33554
https://doi.org/10.1115/IPACK2007-33554
View Paper titled, Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method
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Topics: Lasers, Heat, Composite materials, Thermal resistance, Acoustics, Adhesives, Algorithms, Cracking (Materials), Delamination, Electronic packages
Proceedings Papers

Sensor System Selection for Prognostics and Health Monitoring

Shunfeng Cheng, Michael Azarian, Michael Pecht
Proc. ASME. IDETC-CIE2008, Volume 3: 28th Computers and Information in Engineering Conference, Parts A and B, 1383-1389, August 3–6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: DETC2008-49907
https://doi.org/10.1115/DETC2008-49907
View Paper titled, Sensor System Selection for Prognostics and Health Monitoring
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Topics: Sensors, Data collection
Proceedings Papers

Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability

Eric Stellrecht, Bongtae Han, Michael Pecht
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 497-503, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35252
https://doi.org/10.1115/IPACK2003-35252
View Paper titled, Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability
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Topics: Proton exchange membranes, Reliability
Proceedings Papers

Auditing the Reliability Capability of Electronics Manufacturers

Sanjay Tiku, Michael Pecht
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 947-953, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35359
https://doi.org/10.1115/IPACK2003-35359
View Paper titled, Auditing the Reliability Capability of Electronics Manufacturers
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Topics: Electronics, Reliability, Supply chains
Proceedings Papers

Methods for Predicting the Remaining Life of Electronic Assemblies With Carbon Nanotubes and an Optical Transduction Technique

Paul Casey, Sanka Ganesan, Michael Pecht, Davinder K. Anand
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 407-415, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41682
https://doi.org/10.1115/IMECE2003-41682
View Paper titled, Methods for Predicting the Remaining Life of Electronic Assemblies With Carbon Nanotubes and an Optical Transduction Technique
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Topics: Carbon nanotubes, Circuits, Cycles, Damage, Failure data, Fibers, Manufacturing, Nanotubes, Optical fiber, Sensors
Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Joseph Varghese, Bo Song, Michael H. Azarian, Abhijit Dasgupta, Michael Pecht
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 139-146, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82428
https://doi.org/10.1115/IMECE2005-82428
View Paper titled, Failure Site Transition During Drop Testing of Printed Wiring Assemblies
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Topics: Ball-Grid-Array packaging, Electrical wires, Failure, Intermetallic compounds, Testing