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Michael H. Azarian
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Proceedings Papers

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A001, October 25–27, 2022
Paper No: IPACK2022-92306
DOI: https://doi.org/10.1115/IPACK2022-92306
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Topics: Aerosols, Drops, Electronics, Silver, Temperature, Testing, Water
Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
DOI: https://doi.org/10.1115/1.4006704
Published Online: June 11, 2012
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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms
Proceedings Papers

Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 783-792, September 28–October 1, 2010
Paper No: SMASIS2010-3864
DOI: https://doi.org/10.1115/SMASIS2010-3864
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Topics: Capacitors, Temperature, Failure, Failure mechanisms, Insulation, Capacitance, Laminates, Printed circuit boards, Composite materials, Energy dissipation
Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Joseph Varghese, Bo Song, Michael H. Azarian, Abhijit Dasgupta, Michael Pecht
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 139-146, November 5–11, 2005
Paper No: IMECE2005-82428
DOI: https://doi.org/10.1115/IMECE2005-82428
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Topics: Ball-Grid-Array packaging, Electrical wires, Failure, Intermetallic compounds, Testing