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Nhi V. Quach
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Proceedings Papers
Nhi V. Quach, Jewoo Park, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Alex K. Lee, Chenxi Yin, Yoonjin Won
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 25–27, 2022
Paper No: IPACK2022-96542
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 26–28, 2021
Paper No: IPACK2021-69751
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Paper No: IPACK2020-2613