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Nikhil Lakhkar
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Proceedings Papers

Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications

Nikhil Lakhkar, Arijit Banerjee, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 571-578, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89341
https://doi.org/10.1115/InterPACK2009-89341
View Paper titled, Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications
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Topics: Flat heat pipes, Graphite, Pareto optimization, Cooling, Copper, Laptop computers, Temperature, Thermal conductivity, Weight (Mass), Density
Proceedings Papers

Mechanical Design Optimization of a Package on Package

Abhilash R. Menon, Nikhil Lakhkar, Saket Karajgikar, Dereje Agonafer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 177-184, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89349
https://doi.org/10.1115/InterPACK2009-89349
View Paper titled, Mechanical Design Optimization of a Package on Package
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Topics: Design engineering, Optimization, Package on package
Proceedings Papers

Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability

Nikhil Lakhkar, Puligandla Viswanadham, Dereje Agonafer
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 239-249, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11832
https://doi.org/10.1115/IMECE2009-11832
View Paper titled, Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability
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Topics: Reliability, Semiconductor wafers, Shear strength, Structural design, Shear (Mechanics), Solders, Failure, Testing, Compression, Manufacturing
Proceedings Papers

Process Development and Die Shear Testing in MOEMS Packaging

Nikhil Lakhkar, Abiodun Fasoro, Amit Patil, Woo Ho Lee, Dan Popa, Dereje Agonafer, Harry Stephanou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 971-977, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33986
https://doi.org/10.1115/IPACK2007-33986
View Paper titled, Process Development and Die Shear Testing in MOEMS Packaging
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Topics: Microoptoelectromechanical systems, Packaging, Shear (Mechanics), Testing, Reliability, MEMS packaging, Microelectromechanical systems, Signals, Contamination, Failure
Proceedings Papers

Experimental and Computational Characterization of a Heat Sink Tester

Aalok Trivedi, Nikhil Lakhkar, Madhusudhan Iyengar, Michael Ellsworth, Jr., Roger Schmidt, Dereje Agonafer
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 643-652, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33975
https://doi.org/10.1115/IPACK2007-33975
View Paper titled, Experimental and Computational Characterization of a Heat Sink Tester
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Topics: Heat sinks, Uncertainty analysis
Proceedings Papers

Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading

Nikhil Lakhkar, Mohammad M. Hossain, Puligandla Viswanadham, Dereje Agonafer
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 557-562, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33543
https://doi.org/10.1115/IPACK2007-33543
View Paper titled, Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading
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Topics: Solders, Tin, Temperature, Copper, Electronic packages, Electronic packaging, Fatigue life, Fracture (Materials), Fracture toughness, Lead-free solders
Proceedings Papers

Multi-Objective Parameterization of Graphite Heat Spreader for Portable Systems Applications

Arijit Banerjee, Nikhil Lakhkar, Shahi Riaz, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 79-85, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42927
https://doi.org/10.1115/IMECE2007-42927
View Paper titled, Multi-Objective Parameterization of Graphite Heat Spreader for Portable Systems Applications
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Topics: Flat heat pipes, Graphite, Cooling, Copper, Electronic systems, Laptop computers, Temperature, Thermal conductivity, Weight (Mass), Density
Proceedings Papers

The Impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit: Part I — Computational Study

Nikhil Lakhkar, Saket Karajgikar, Dereje Agonafer, Roger Schmidt
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 651-656, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42254
https://doi.org/10.1115/IMECE2003-42254
View Paper titled, The Impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit: Part I — Computational Study
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Topics: Refrigeration, Sensors, Temperature, Computers, Cooling, Circuits, Design, Electrical resistance, Electronics, Energy dissipation
Proceedings Papers

Design of a Cold Plate Tester for Accurate Measurement of Thermal Performance

Nikhil Lakhkar, Madhusudan Iyengar, Michael Ellsworth, Jr., Dereje Agonafer
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 531-539, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81553
https://doi.org/10.1115/IMECE2005-81553
View Paper titled, Design of a Cold Plate Tester for Accurate Measurement of Thermal Performance
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Topics: Design, Uncertainty analysis, Errors, Plates (structures), Thermal resistance, Computers, Energy dissipation, Heat, Heat flux, Heat sinks
Journal Articles

Impact of Area Contact Between Sensor Bulb and Evaporator Return Line on Modular Refrigeration Unit: Computational and Experimental

Saket Karajgikar, Nikhil Lakhkar, Dereje Agonafer, Fellow ASME, Roger Schmidt, Fellow ASME
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 95–100.
https://doi.org/10.1115/1.1839585
Published Online: February 15, 2005
View Article titled, Impact of Area Contact Between Sensor Bulb and Evaporator Return Line on Modular Refrigeration Unit: Computational and Experimental
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Topics: Refrigeration, Sensors, Stress, Temperature, Vapors, Compression, Valves, Heat, Refrigerants, Cooling