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Paul A. Kohl
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Proceedings Papers

Nano-Micro Scale Characterization of Dielectric Materials

Paul A. Kohl, Sue Ann Bidstrup Allen
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 63-68, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24707
https://doi.org/10.1115/IMECE2001/EPP-24707
View Paper titled, Nano-Micro Scale Characterization of Dielectric Materials
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Topics: Dielectric materials, Glass, Particle spin, Rotation, Spin (Aerodynamics), Thin films, Coatings, Elastic moduli, Electrical properties, Fracture toughness
Journal Articles

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Jisu Jiang, Landon Keller, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011006.
Paper No: EP-19-1031
https://doi.org/10.1115/1.4044626
Published Online: September 24, 2019
View Article titled, Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging
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Topics: Epoxy adhesives, Epoxy resins, Porosity
Includes: Supplementary data
Journal Articles

Decomposable and Template Polymers: Fundamentals and Applications

Erdal Uzunlar, Jared Schwartz, Oluwadamilola Phillips, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020802.
Paper No: EP-16-1018
https://doi.org/10.1115/1.4033000
Published Online: April 19, 2016
View Article titled, Decomposable and Template Polymers: Fundamentals and Applications
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Topics: Polymers, Temperature, Ceilings
Journal Articles

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

Erdal Uzunlar, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041001.
Paper No: EP-14-1114
https://doi.org/10.1115/1.4030952
Published Online: July 23, 2015
View Article titled, Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications
Open the PDF for Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications in another window
Topics: MEMS packaging, Microelectromechanical systems, Polymers, Temperature, Semiconductor wafers, Reactive-ion etching, Nuclear magnetic resonance, Hardening (Curing)
Journal Articles

Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

Sarah Kim, Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031009.
https://doi.org/10.1115/1.4007111
Published Online: July 23, 2012
View Article titled, Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
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Topics: Absorption, Fluids, Heat pumps, Refrigerants, Refrigeration, Temperature, Pressure, Cooling, Heat
Proceedings Papers

Waste-Heat Driven Miniature Absorption Refrigeration System Using Ionic-Liquid as a Working Fluid

Yoon Jo Kim, Sarah Kim, Yogendra K. Joshi, Andrei G. Fedorov, Paul A. Kohl
Proc. ASME. ES2011, ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C, 1299-1305, August 7–10, 2011
Publisher: American Society of Mechanical Engineers
Paper No: ES2011-54217
https://doi.org/10.1115/ES2011-54217
View Paper titled, Waste-Heat Driven Miniature Absorption Refrigeration System Using Ionic-Liquid as a Working Fluid
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Topics: Absorption, Fluids, Refrigeration, Waste heat, Temperature, Refrigerants, Water, Computer cooling, Condensers (steam plant), Crystallization
Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
https://doi.org/10.1115/1.4005289
Published Online: December 9, 2011
View Article titled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling
Journal Articles

Electroless Deposition and Characterization of Pt x Ru 1 − x Catalysts on Pt/C Nanoparticles for Methanol Oxidation

William E. Mustain, Hyea Kim, Vijai Narayanan, Tyler Osborn, Paul A. Kohl
Journal: Journal of Electrochemical Energy Conversion and Storage
Publisher: ASME
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. August 2010, 7(4): 041013.
https://doi.org/10.1115/1.4000675
Published Online: April 8, 2010
View Article titled, Electroless Deposition and Characterization of Pt x Ru 1 − x Catalysts on Pt/C Nanoparticles for Methanol Oxidation
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Topics: Catalysts, Electrodes, Methanol, Nanoparticles, Oxidation, Platinum, Ruthenium, Temperature, Metals, Direct methanol fuel cells
Proceedings Papers

A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects

Bing Dang, Paul J. Joseph, Xiaojin Wei, Muhannad S. Bakir, Paul A. Kohl, Yogendra K. Joshi, James D. Meindl
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 605-610, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73416
https://doi.org/10.1115/IPACK2005-73416
View Paper titled, A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects
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Topics: Cooling, Heat sinks, Microfluidics, Silicon chips, Complementary metal oxide semiconductors, Density, Electroplating, Engineering prototypes, Flip-chip, Flip-chip assemblies