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Journal Articles

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Chu-Hsuan Sha, Pin J. Wang, Wen P. Lin, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
https://doi.org/10.1115/1.4005295
Published Online: December 9, 2011
View Article titled, Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C
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Topics: Bonding, Diffusion bonding (Metals), Pressure, Silver, Shear (Mechanics), Shear strength, Solders, Atoms, Temperature
Journal Articles

Silver Flip-Chip Technology by Solid-State Bonding

Pin J. Wang, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
https://doi.org/10.1115/1.4002297
Published Online: September 30, 2010
View Article titled, Silver Flip-Chip Technology by Solid-State Bonding
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Topics: Bonding, Flip-chip, Silver, Silicon chips
Journal Articles

Direct Silver to Copper Bonding Process

Pin J. Wang, Jong S. Kim, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
https://doi.org/10.1115/1.2993144
Published Online: November 14, 2008
View Article titled, Direct Silver to Copper Bonding Process
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Topics: Bonding, Copper, Silver, Electronic packaging, Thermal expansion, Stress, Scanning electron microscopy