Search Results | ASME Digital Collection

1-7 of 7

Sort by

Sort Order Select

Proceedings Papers

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A003, October 25–27, 2022

Paper No: IPACK2022-94505

DOI: https://doi.org/10.1115/IPACK2022-94505

View Paper

Topics: Anisotropy, Crystals, Electron backscatter diffraction, Shear (Mechanics), Solder joints

Journal Articles

Research on Heat Transfer Characteristics and Typical Parameters Sensitivity Analysis of the Deep Borehole Heat Exchanger Combined With the Geothermal Wells

Jiuchen Ma, QiuLi Zhang, Feiyu Yi, Qian Jiang, Yacheng Xie, Yahui Wang

J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061008.

Paper No: TSEA-21-1151

DOI: https://doi.org/10.1115/1.4052345

Published Online: October 13, 2021

View Article

Topics: Geothermal engineering, Heat transfer, Temperature, Water, Wells, Sensitivity analysis, Reservoirs, Pipes, Soil, Heat exchangers

Journal Articles

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta, Ulrich Becker

J. Electron. Packag. September 2022, 144(3): 031006.

Paper No: EP-21-1025

DOI: https://doi.org/10.1115/1.4051647

Published Online: September 15, 2021

View Article

Topics: Damage, Durability, Fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Finite element analysis, Fatigue damage, Hydrostatics

Proceedings Papers

Flutter Study on High Speed Train External Windshield by a Tight Coupling Method

Qian Jiang, Guannan Zheng, Guilin Zhao

Proc. ASME. AJKFluids2019, Volume 2: Computational Fluid Dynamics, V002T02A050, July 28–August 1, 2019

Paper No: AJKFluids2019-5422

DOI: https://doi.org/10.1115/AJKFluids2019-5422

View Paper

Topics: Flutter (Aerodynamics), Trains, Vibration

Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018

Paper No: IPACK2018-8345

DOI: https://doi.org/10.1115/IPACK2018-8345

View Paper

Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design

Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017

Paper No: IPACK2017-74133

DOI: https://doi.org/10.1115/IPACK2017-74133

View Paper

Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling

Proceedings Papers

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

Qian Jiang, Subhasis Mukherjee, Bastian Vogt, Abhijit Dasgupta, David Shaddock, Liang Yin

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005, July 6–9, 2015

Paper No: IPACK2015-48708

DOI: https://doi.org/10.1115/IPACK2015-48708

View Paper

Topics: High temperature, Solders, Temperature, Stress, Creep, Equipment performance, Mechanical properties, Melting, Wire

Journal citation

NARROW

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Research on Heat Transfer Characteristics and Typical Parameters Sensitivity Analysis of the Deep Borehole Heat Exchanger Combined With the Geothermal Wells

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Flutter Study on High Speed Train External Windshield by a Tight Coupling Method

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Research on Heat Transfer Characteristics and Typical Parameters Sensitivity Analysis of the Deep Borehole Heat Exchanger Combined With the Geothermal Wells

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Flutter Study on High Speed Train External Windshield by a Tight Coupling Method

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only