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R. K. Agarwal
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Journal Articles

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

X. Yan, R. K. Agarwal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 150–155.
https://doi.org/10.1115/1.2792607
Published Online: June 1, 1998
View Article titled, Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies
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Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks
Journal Articles

Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

R. K. Agarwal, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 219–224.
https://doi.org/10.1115/1.2909321
Published Online: June 1, 1993
View Article titled, Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
Open the PDF for Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design in another window
Topics: Composite materials, Design, Electrical properties, Printed circuit boards, Textiles, Boundary-value problems, Epoxy adhesives, Epoxy resins, Finite element methods, Glass