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Ralph L. Webb
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Proceedings Papers
Proc. ASME. IMECE2000, Advances in Enhanced Heat Transfer, 49-57, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1278
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 365-372, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73262
Proceedings Papers
Proc. ASME. HT-FED2004, Volume 4, 961-969, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56918
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 699-704, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35354
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 527-535, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35251
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 537-543, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35253
Proceedings Papers
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 235-243, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42172
Proceedings Papers
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 583-591, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42179
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. July 2007, 129(7): 899–901.
Published Online: October 12, 2006
Journal Articles
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 2–10.
Published Online: February 15, 2005
Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Heat Mass Transfer. December 2004, 126(6): 1051–1059.
Published Online: January 26, 2005
Journal Articles
Publisher: ASME
Article Type: Discussion and Closure
J. Heat Mass Transfer. December 2003, 125(6): 1208.
Published Online: November 19, 2003
Journal Articles
Publisher: ASME
Article Type: Technical Notes
J. Heat Mass Transfer. February 2003, 125(1): 184–185.
Published Online: January 29, 2003
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 189–195.
Published Online: April 1, 2000
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 1979, 101(2): 335–339.
Published Online: May 1, 1979