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Proceedings Papers

Numerical Studies on the Transportation of Water Mist for Fire Suppression Applications

L. S. Hung, S. C. Yao
Proc. ASME. IMECE97, Heat Transfer: Volume 2, 73-80, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0869
https://doi.org/10.1115/IMECE1997-0869
View Paper titled, Numerical Studies on the Transportation of Water Mist for Fire Suppression Applications
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Topics: Fire, Transportation systems, Water, Strips, Drops, Flow (Dynamics), Sprays, Computer simulation, Delays, Density
Proceedings Papers

An Integrated Thermal Science Course for Third-Year Mechanical Engineering Students

Peter D. Noymer, Megan U. Hazen, S. C. Yao
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 49-53, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0636
https://doi.org/10.1115/IMECE1998-0636
View Paper titled, An Integrated Thermal Science Course for Third-Year Mechanical Engineering Students
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Topics: Mechanical engineering, Students, Heat transfer, Design, Engineering disciplines, Fluid mechanics, Thermodynamics, Complex systems, Feedback, Finite element model
Proceedings Papers

An Experimental Study of Droplets Impacting on Horizontal Screens

L. S. Hung, S. C. Yao
Proc. ASME. IMECE98, Heat Transfer: Volume 5 — Numerical and Experimental Methods in Heat Transfer, 467-474, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0765
https://doi.org/10.1115/IMECE1998-0765
View Paper titled, An Experimental Study of Droplets Impacting on Horizontal Screens
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Topics: Drops, Wire, Water, Generators, Liquid films, Surface tension, Weight (Mass), Wire screens
Proceedings Papers

MEMS Enabled Micro Spray Cooling System for Thermal Control of Electronic Chips

S. C. Yao, C. H. Amon, K. Gabriel, P. Kumta, J. Y. Murthy, C. F. Wu, C. C. Hsieh, D. Boyalakuntla, S. V. J. Narumanchi, K. Rebello
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 181-192, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24392
https://doi.org/10.1115/IMECE2001/HTD-24392
View Paper titled, MEMS Enabled Micro Spray Cooling System for Thermal Control of Electronic Chips
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Topics: Cooling systems, Microelectromechanical systems, Sprays, Cooling, Fluids, Drops, Nozzles, Flux (Metallurgy), Heat, Silicon
Proceedings Papers

Nondestructive Eddy Current Evaluation of Anisotropic Conductivities of Silicon Carbide Reinforced Aluminum Metal-Matrix Composite Extrusions

P. K. Liaw, R. Pitchumani, S. C. Yao, D. K. Hsu, H. Jeong
Proc. ASME. GT1993, Volume 2: Combustion and Fuels; Oil and Gas Applications; Cycle Innovations; Heat Transfer; Electric Power; Industrial and Cogeneration; Ceramics; Structures and Dynamics; Controls, Diagnostics and Instrumentation; IGTI Scholar Award, V002T11A003, May 24–27, 1993
Publisher: American Society of Mechanical Engineers
Paper No: 93-GT-015
https://doi.org/10.1115/93-GT-015
View Paper titled, Nondestructive Eddy Current Evaluation of Anisotropic Conductivities of Silicon Carbide Reinforced Aluminum Metal-Matrix Composite Extrusions
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Topics: Aluminum, Anisotropy, Composite materials, Eddies (Fluid dynamics), Eddy currents (Electricity), Metals, Silicon, Alloys, Electrical conductivity, Extruding
Journal Articles

Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution

Jun Jie Liu, Hua Zhang, S. C. Yao, Yubai Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021008.
Paper No: EP-13-1129
https://doi.org/10.1115/1.4027420
Published Online: April 29, 2014
View Article titled, Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution
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Topics: Boiling, Cooling, Flow (Dynamics), Heat flux, Heat transfer, Microchannels, Modeling, Porous materials, Pressure drop, Temperature
Proceedings Papers

Porous Media Modeling of Two-Phase Micro-Channel Cooling of Electronic Chips With Non-Uniform Power Distribution

Hua Zhang, Jun Jie Liu, Yubai Li, S. C. Yao
Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A071, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-64481
https://doi.org/10.1115/IMECE2013-64481
View Paper titled, Porous Media Modeling of Two-Phase Micro-Channel Cooling of Electronic Chips With Non-Uniform Power Distribution
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Topics: Cooling, Microchannels, Modeling, Porous materials, Flow (Dynamics), Temperature, Computation, Heat, Stress, Boiling
Proceedings Papers

Exploration of Unsteady Spray Cooling for High Power Electronics at Microgravity Using NASA Glenn’s Drop Tower

Eric L. Golliher, Chad P. Zivich, S. C. Yao
Proc. ASME. HT2005, Heat Transfer: Volume 2, 609-612, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72123
https://doi.org/10.1115/HT2005-72123
View Paper titled, Exploration of Unsteady Spray Cooling for High Power Electronics at Microgravity Using NASA Glenn’s Drop Tower
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Topics: Cooling, Electronics, NASA, Sprays, Fluids, Space vehicles, Gravity (Force), Aircraft, Analytical methods, Cooling systems
Proceedings Papers

Modeling of the Mist Dynamics and Heat Transfer at Various Ambient Pressures

Roy J. Issa, S. C. Yao
Proc. ASME. HT-FED2004, Volume 2, Parts A and B, 503-511, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56232
https://doi.org/10.1115/HT-FED2004-56232
View Paper titled, Modeling of the Mist Dynamics and Heat Transfer at Various Ambient Pressures
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Topics: Drops, Dynamics (Mechanics), Heat transfer, Modeling
Proceedings Papers

Droplet Impingement Cooling for Electronics Using Silicon Nozzles

Chi-fu Wu, S. C. Yao
Proc. ASME. HT2003, Heat Transfer: Volume 3, 519-527, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47358
https://doi.org/10.1115/HT2003-47358
View Paper titled, Droplet Impingement Cooling for Electronics Using Silicon Nozzles
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Topics: Drops, Electronics, Impingement cooling, Nozzles, Silicon, Condensers (steam plant), Coolants, Cooling, Gravity (Force), Heat
Proceedings Papers

Development of a Silicon-Based Passive Gas-Liquid Separation System for Microscale Direct Methanol Fuel Cells

C. C. Hsieh, Yousef Alyousef, S. C. Yao
Proc. ASME. ICNMM2006, ASME 4th International Conference on Nanochannels, Microchannels, and Minichannels, Parts A and B, 779-785, June 19–21, 2006
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2006-96084
https://doi.org/10.1115/ICNMM2006-96084
View Paper titled, Development of a Silicon-Based Passive Gas-Liquid Separation System for Microscale Direct Methanol Fuel Cells
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Topics: Direct methanol fuel cells, Microscale devices, Separation (Technology), Silicon, Design, Flow (Dynamics), Manufacturing, Bonding, Carbon dioxide, Glass
Proceedings Papers

Design of Direct Methanol Micro Fuel Cell Fluidic Systems

S. C. Yao, G. K. Fedder, C. H. Amon, C. C. Hsieh, X. Tang, Y. Alyousef
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 431-436, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32567
https://doi.org/10.1115/IMECE2002-32567
View Paper titled, Design of Direct Methanol Micro Fuel Cell Fluidic Systems
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Topics: Design, Methanol, Micro fuel cells, Bubbles, Carbon dioxide, Flow (Dynamics), Fluid handling, Manufacturing, Microelectromechanical systems, Microfluidics
Proceedings Papers

Development of a Silicon-Based Passive Gas-Liquid Separation System for Microscale Direct Methanol Fuel Cells

C. C. Hsieh, S. C. Yao, Yousef Alyousef
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 397-403, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42135
https://doi.org/10.1115/IMECE2003-42135
View Paper titled, Development of a Silicon-Based Passive Gas-Liquid Separation System for Microscale Direct Methanol Fuel Cells
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Topics: Direct methanol fuel cells, Microscale devices, Separation (Technology), Silicon, Design, Flow (Dynamics), Manufacturing, Bonding, Carbon dioxide, Glass
Proceedings Papers

MEMS-Based Spatial and Temporal Thermal Management of High Heat Flux Electronics

Cristina H. Amon, S. C. Yao
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 729-739, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42400
https://doi.org/10.1115/IMECE2003-42400
View Paper titled, MEMS-Based Spatial and Temporal Thermal Management of High Heat Flux Electronics
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Topics: Electronics, Heat flux, Microelectromechanical systems, Thermal management, Drops, Fluids, Cooling, Evaporation, Impingement cooling, Micromanufacturing
Proceedings Papers

Experimental Studies of Spray Cooling of High Temperature Metals Using High Mass Flux Industrial Nozzles

Hamed M. Al-Ahmadi, S. C. Yao
Proc. ASME. IMECE2006, Heat Transfer, Volume 2, 679-687, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15632
https://doi.org/10.1115/IMECE2006-15632
View Paper titled, Experimental Studies of Spray Cooling of High Temperature Metals Using High Mass Flux Industrial Nozzles
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Topics: Cooling, High temperature, Metals, Nozzles, Sprays
Journal Articles

A Numerical Model for the Mist Dynamics and Heat Transfer at Various Ambient Pressures

Roy J. Issa, S. C. Yao
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Special Section On Cfd Methods
J. Fluids Eng. July 2005, 127(4): 631–639.
https://doi.org/10.1115/1.1976743
Published Online: April 9, 2005
View Article titled, A Numerical Model for the Mist Dynamics and Heat Transfer at Various Ambient Pressures
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Topics: Drops, Heat transfer, Pressure, Sprays, Temperature, Cooling, Dynamics (Mechanics)
Journal Articles

Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

Cristina H. Amon, S.-C. Yao, C.-F. Wu, C.-C. Hsieh
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 66–75.
https://doi.org/10.1115/1.1839586
Published Online: February 15, 2005
View Article titled, Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics
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Topics: Coolants, Cooling, Drops, Electronics, Engineering prototypes, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Heat transfer
Journal Articles

Heat Transfer of Impacting Water Mist on High Temperature Metal Surfaces

N. Sozbir, Y. W. Chang, S. C. Yao
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. February 2003, 125(1): 70–74.
https://doi.org/10.1115/1.1527913
Published Online: January 29, 2003
View Article titled, Heat Transfer of Impacting Water Mist on High Temperature Metal Surfaces
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Topics: Cooling, Heat transfer, Heat transfer coefficients, High temperature, Sprays, Temperature, Water, Metal surfaces, Drops, Convection
Journal Articles

Heat Transfer of Sprays of Large Water Drops Impacting on High Temperature Surfaces

T. L. Cox, S. C. Yao
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 1999, 121(2): 446–450.
https://doi.org/10.1115/1.2825998
Published Online: May 1, 1999
View Article titled, Heat Transfer of Sprays of Large Water Drops Impacting on High Temperature Surfaces
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Topics: Drops, Heat transfer, High temperature, Sprays, Water
Journal Articles

Nondestructive Eddy Current Evaluation of Anisotropic Conductivities of Silicon Carbide Reinforced Aluminum Metal-Matrix Composite Extrusions

P. K. Liaw, R. Pitchumani, D. K. Hsu, H. Jeong, S. C. Yao
Journal: Journal of Engineering for Gas Turbines and Power
Publisher: ASME
Article Type: Research Papers
J. Eng. Gas Turbines Power. July 1994, 116(3): 647–656.
https://doi.org/10.1115/1.2906869
Published Online: July 1, 1994
View Article titled, Nondestructive Eddy Current Evaluation of Anisotropic Conductivities of Silicon Carbide Reinforced Aluminum Metal-Matrix Composite Extrusions
Open the PDF for Nondestructive Eddy Current Evaluation of Anisotropic Conductivities of Silicon Carbide Reinforced Aluminum Metal-Matrix Composite Extrusions in another window
Topics: Aluminum, Anisotropy, Composite materials, Eddies (Fluid dynamics), Eddy currents (Electricity), Metals, Silicon, Alloys, Electrical conductivity, Extruding