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S.-W. Ricky Lee
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Proceedings Papers
Hua Xu, Jeffery C. C. Lo, Xing Qiu, Yuanjie Cheng, Mian Tao, S. W. Ricky Lee, Lawrence C. L. Ko, Ho Ki Yeung, Chun Ho Yau
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111648
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041010.
Paper No: EP-21-1030
Published Online: January 28, 2022
Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 135-144, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2255
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
Published Online: January 19, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021008.
Paper No: EP-19-1006
Published Online: March 18, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
Published Online: September 10, 2018
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A046, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48664
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011003.
Paper No: EP-12-1017
Published Online: November 28, 2013
Proceedings Papers
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 855-863, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64782
Proceedings Papers
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 129-136, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40974
Proceedings Papers
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 137-144, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40975
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 579-583, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52219
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
Published Online: September 26, 2011
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 803-807, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89260
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 19-24, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33971
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 889-894, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33933
Proceedings Papers
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 213-218, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68120
Proceedings Papers
Proc. ASME. IMECE2008, Volume 12: Mechanics of Solids, Structures and Fluids, 339-347, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68110
Proceedings Papers
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 615-618, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70131
Proceedings Papers
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 47-54, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42561
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