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Proceedings Papers

Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution

Vibin Shalom Simon, Saket Karajgikar, Veerendra Mulay, Sai Abhideep Pundla, Krishna Bhavana Sivaraju, Gautam Gupta, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112078
https://doi.org/10.1115/IPACK2023-112078
View Paper titled, Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution
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Topics: Cooling, Data centers, Doors, Heat exchangers
Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97429
https://doi.org/10.1115/IPACK2022-97429
View Paper titled, Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
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Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

Single-Phase Immersion Cooling Study of a High-Density Storage System

Saket Karajgikar, Jasper Kidger, Andrew Shaw, Neil Edmunds, Veerendra Mulay
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97490
https://doi.org/10.1115/IPACK2022-97490
View Paper titled, Single-Phase Immersion Cooling Study of a High-Density Storage System
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Topics: Cooling, Density, Storage
Proceedings Papers

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97494
https://doi.org/10.1115/IPACK2022-97494
View Paper titled, Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center
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Topics: Cooling, Data centers, Density, Doors, Heat exchangers
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Article titled, Special Issue on InterPACK2020
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
View Article titled, Special Issue on InterPACK 2019 – Part 1
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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Proceedings Papers

Thermal-Aware Power Migration in Many-Core Processors

Avinash Raghu, Saket Karajgikar, Dereje Agonafer, Bahgat Sammakia, Gamal Refai-Ahmed
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 385-392, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40232
https://doi.org/10.1115/IMECE2010-40232
View Paper titled, Thermal-Aware Power Migration in Many-Core Processors
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Topics: Computation, Cooling, Currents, Design, Junctions, Leakage, Reliability, Temperature, Thermal management
Proceedings Papers

Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers

Venkata Naga Poornima Mynampati, Saket Karajgikar, Ibraheem Sheerah, Dereje Agonafer, Shlomo Novotny, Roger Schmidt
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 405-410, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40659
https://doi.org/10.1115/IMECE2010-40659
View Paper titled, Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers
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Topics: Cooling, Data centers, Doors, Heat exchangers, Telecommunications, Heat, Stress, Density, Energy consumption, Thermal analysis
Proceedings Papers

Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics

Fahad Mirza, Bharathkrishnan Muralidharan, Poornima Mynampati, Saket Karajgikar, Dereje Agonafer
Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 675-680, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40803
https://doi.org/10.1115/IMECE2010-40803
View Paper titled, Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics
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Topics: Electronics, Energy dissipation, Heat, Silicon, Delays, Density, Electronic products, Failure, Insulation, Integrated circuits
Proceedings Papers

Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 111-118, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89188
https://doi.org/10.1115/InterPACK2009-89188
View Paper titled, Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance
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Topics: Clocks, Computer simulation, Computers, Control equipment, Junctions, Pareto optimization, Product reliability, Temperature, Temperature gradient
Proceedings Papers

Cooling of Data Centers Using Airside Economizers

Saket Karajgikar, Veerendra Mulay, Dereje Agonafer, Roger Schmidt
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1001-1007, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89356
https://doi.org/10.1115/InterPACK2009-89356
View Paper titled, Cooling of Data Centers Using Airside Economizers
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Topics: Cooling, Data centers, Energy consumption, Air conditioners, Computer simulation, Computers, Electronic components, Environmental Protection Agency, Failure, Heat
Proceedings Papers

Mechanical Design Optimization of a Package on Package

Abhilash R. Menon, Nikhil Lakhkar, Saket Karajgikar, Dereje Agonafer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 177-184, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89349
https://doi.org/10.1115/InterPACK2009-89349
View Paper titled, Mechanical Design Optimization of a Package on Package
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Topics: Design engineering, Optimization, Package on package
Proceedings Papers

Optimization of Location of a Power Cell for Energy Efficient Operation of Air Cool Drives

Saket Karajgikar, Veerendra Mulay, Abhilash Menon, Dereje Agonafer, Jiahui Zhang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 815-820, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89189
https://doi.org/10.1115/InterPACK2009-89189
View Paper titled, Optimization of Location of a Power Cell for Energy Efficient Operation of Air Cool Drives
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Topics: Optimization, Flow (Dynamics), Electronic components, Electronics, Low temperature
Proceedings Papers

Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers

Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Mark Hendrix
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1469-1475, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-13136
https://doi.org/10.1115/IMECE2009-13136
View Paper titled, Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers
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Topics: Telecommunications, Thermal management, Thermoelectric coolers, Batteries, Temperature, Air conditioners, Electronics, Heat, Stress, Battery life
Proceedings Papers

Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmad
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 179-184, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11769
https://doi.org/10.1115/IMECE2009-11769
View Paper titled, Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance
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Topics: Clocks, Temperature, Computers, Junctions, Control equipment, Numerical analysis, Pareto optimization, Product reliability, Temperature gradient
Journal Articles

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021008.
https://doi.org/10.1115/1.4001852
Published Online: June 25, 2010
View Article titled, Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
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Topics: Junctions, Temperature, Pareto optimization, Delays, Temperature gradient, Engines
Proceedings Papers

Computational Study of Hybrid Cooling Solution for Thermal Management of Data Centers

Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Roger Schmidt, Madshusudan Iyengar, Jay Nigen
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 723-731, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33000
https://doi.org/10.1115/IPACK2007-33000
View Paper titled, Computational Study of Hybrid Cooling Solution for Thermal Management of Data Centers
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Topics: Cooling, Data centers, Thermal management, Stress, Heat, Air conditioners, Ceilings, Computational fluid dynamics, Computers, Design
Proceedings Papers

Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers

Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Roger Schmidt, Madhusudan Iyengar
Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 519-526, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43761
https://doi.org/10.1115/IMECE2007-43761
View Paper titled, Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers
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Topics: Cooling, Data centers, Thermal management, Stress, Heat, Air conditioners, Computational fluid dynamics, Computers, Storage, Temperature
Proceedings Papers

Bump Electromigration and Back End Design Rules

Vishal Nagaraj, Saket Karajgikar, Dereje Agonafer, Senol Pekin
Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 377-384, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43766
https://doi.org/10.1115/IMECE2007-43766
View Paper titled, Bump Electromigration and Back End Design Rules
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Topics: Design, Electrodiffusion, Flip-chip, Flip-chip devices, Packaging, Temperature, Finite element analysis, Laminates, Ceramics, Current density
Proceedings Papers

Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage

Saket Karajgikar, Wonkee Ahn, Dereje Agonafer
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1187-1192, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73184
https://doi.org/10.1115/IPACK2005-73184
View Paper titled, Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage
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Topics: Manufacturing, Printed circuit boards, Warping