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Proceedings Papers

Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation

Chongyang Cai, Jiefeng Xu, Yangyang Lai, Junbo Yang, Huayan Wang, Suresh Ramalingam, Gamal Refai-Ahmed, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 25–27, 2022
Paper No: IPACK2022-97338
DOI: https://doi.org/10.1115/IPACK2022-97338
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Proceedings Papers

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Paper No: IPACK2022-97349
DOI: https://doi.org/10.1115/IPACK2022-97349
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Reliability, Thermomechanics, Cycles, Solders, Corners (Structural elements), Bonding, Deformation, Stiffness
Proceedings Papers

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

Karthik Arun Deo, Raymond-Noel Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Paper No: IPACK2022-97253
DOI: https://doi.org/10.1115/IPACK2022-97253
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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Surface mount devices
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Paper No: IPACK2018-8257
DOI: https://doi.org/10.1115/IPACK2018-8257
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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics
Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Paper No: IPACK2017-74017
DOI: https://doi.org/10.1115/IPACK2017-74017
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Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders
Proceedings Papers

MEMS Die Warpage During Curing of Die Attach Material

Hohyung Lee, Ruiyang Liu, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A004, July 6–9, 2015
Paper No: IPACK2015-48010
DOI: https://doi.org/10.1115/IPACK2015-48010
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Topics: Hardening (Curing), Microelectromechanical systems, Warping, Materials properties, Finite element analysis, Manufacturing, Shrinkage (Materials), Stress, Adhesives, Glass transition
Proceedings Papers

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Ruiyang Liu, HoHyung Lee, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A005, July 6–9, 2015
Paper No: IPACK2015-48086
DOI: https://doi.org/10.1115/IPACK2015-48086
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Topics: Adhesives, Shrinkage (Materials), Storage, Finite element analysis, Sensors, Viscoelasticity, Epoxy adhesives, Epoxy resins, MEMS packaging, Microelectromechanical systems
Proceedings Papers

Comparative Study of Analytical Models to Predict Warpage in Microelectronics Packages

Charandeep Singh, Yeonsung Kim, Seungbae Park
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A066, November 14–20, 2014
Paper No: IMECE2014-38594
DOI: https://doi.org/10.1115/IMECE2014-38594
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Topics: Microelectronic devices, Warping, Design, Finite element analysis, Laminates, Reliability, Aluminum plate, Cracking (Materials), Deformation, Delamination
Proceedings Papers

Validation of Material Constants for Low-Cycle Fatigue Modeling

Quang Nguyen, Seungbae Park, Tung Nguyen
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A055, November 14–20, 2014
Paper No: IMECE2014-39267
DOI: https://doi.org/10.1115/IMECE2014-39267
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Topics: Low cycle fatigue, Modeling, Computer simulation, Electrical resistance, Failure, Fatigue life, Impact modeling, Lumber, Solder joints, Weibull distribution
Proceedings Papers

Characterization of Creep Behavior of Actual Lead-Free Solder Joint for Modeling

Hohyung Lee, Ruiyang Liu, Seungbae Park, Jae Kwak
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A071, November 14–20, 2014
Paper No: IMECE2014-38661
DOI: https://doi.org/10.1115/IMECE2014-38661
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Topics: Creep, Lead-free solders, Modeling, Solders, Displacement, Ball-Grid-Array packaging, Finite element analysis, Electronic packages, Mechanical behavior, Mechanical properties
Journal Articles

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Dapeng Liu, Seungbae Park
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034501.
Paper No: EP-13-1094
DOI: https://doi.org/10.1115/1.4026661
Published Online: May 5, 2014
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Topics: Diffusion (Physics), Simulation, Temperature, Transients (Dynamics), Materials properties
Journal Articles

Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art

Dapeng Liu, Seungbae Park
Journal: Journal of Electronic Packaging
Article Type: Technology Review
J. Electron. Packag. March 2014, 136(1): 014001.
Paper No: EP-13-1038
DOI: https://doi.org/10.1115/1.4026615
Published Online: February 18, 2014
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Topics: Bonding, Manufacturing, Semiconductor wafers, Solders, Packaging, Low temperature
Proceedings Papers

Characterization of Crack Growth in BGA Under Drop Impact

Quang Nguyen, Seungbae Park, Tung Nguyen
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A002, July 16–18, 2013
Paper No: IPACK2013-73110
DOI: https://doi.org/10.1115/IPACK2013-73110
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Topics: Ball-Grid-Array packaging, Fracture (Materials), Solder joints, Damage, Imaging, Low cycle fatigue, Microscopes, Polishing, Tin, Vehicles
Proceedings Papers

Dynamic Analysis of Thin Glass Under Ball Drop Impact With New Metrics

Liang Xue, Claire R. Coble, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A006, July 16–18, 2013
Paper No: IPACK2013-73291
DOI: https://doi.org/10.1115/IPACK2013-73291
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Topics: Dynamic analysis, Finite element analysis, Glass, Impact testing, Momentum
Proceedings Papers

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

Ah-Young Park, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A006, July 16–18, 2013
Paper No: IPACK2013-73280
DOI: https://doi.org/10.1115/IPACK2013-73280
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Topics: Compression, Copper, Finite element methods, Fracture mechanics, Bonding, Fracture (Materials), Solders, Density, Joining, Temperature
Proceedings Papers

An Experimental and Numerical Study of the Dynamic Fracture of Glass

Liang Xue, Yuling Niu, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A007, July 16–18, 2013
Paper No: IPACK2013-73292
DOI: https://doi.org/10.1115/IPACK2013-73292
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Topics: Finite element analysis, Fracture (Materials), Fracture (Process), Glass
Proceedings Papers

An Experimental and Numerical Study of the Behavior of the Thin Glass Edge Under Ball Drop Impact

Liang Xue, Dapeng Liu, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A008, July 16–18, 2013
Paper No: IPACK2013-73293
DOI: https://doi.org/10.1115/IPACK2013-73293
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Topics: Glass
Proceedings Papers

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

Hohyung Lee, Seungbae Park
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 485-490, November 9–15, 2012
Paper No: IMECE2012-89799
DOI: https://doi.org/10.1115/IMECE2012-89799
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Topics: Creep, Lead-free solders, Strain measurement, Solders, Solder joints, Ball-Grid-Array packaging, Displacement, Temperature, Alloys, Ball-Grid-Array packages
Journal Articles

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Da Yu, Hohyung Lee, Seungbae Park
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041008.
DOI: https://doi.org/10.1115/1.4007674
Published Online: November 16, 2012
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Topics: Cycles, Failure, Fracture (Materials), Reliability, Solder joints, Failure mechanisms, Stress, Failure analysis
Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031010.
DOI: https://doi.org/10.1115/1.4007118
Published Online: July 23, 2012
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Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing