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1-6 of 6
Siddhartha Das
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Proceedings Papers
Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A001, October 25–27, 2022
Paper No: IPACK2022-92306
Proceedings Papers
Beihan Zhao, Christopher Riso, David Leslie, Abhijit Dasgupta, Siddhartha Das, Jason Fleischer, Daniel Hines
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 26–28, 2021
Paper No: IPACK2021-73197
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011012.
Paper No: EP-19-1002
Published Online: November 14, 2019
Topics:
Aerosols,
Electrical conductivity,
Flow (Dynamics),
Gas flow,
Inks,
Magnification,
Nanoparticles,
Printing,
Silver,
Agglomeration (Materials)
Includes: Supplementary data
Proceedings Papers
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T08A002, August 3–7, 2014
Paper No: ICNMM2014-21120
Proceedings Papers
Proc. ASME. IMECE2013, Volume 7B: Fluids Engineering Systems and Technologies, V07BT08A012, November 15–21, 2013
Paper No: IMECE2013-63357
Proceedings Papers
Proc. ASME. FEDSM2013, Volume 2, Fora: Cavitation and Multiphase Flow; Fluid Measurements and Instrumentation; Microfluidics; Multiphase Flows: Work in Progress, V002T21A004, July 7–11, 2013
Paper No: FEDSM2013-16265