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1-16 of 16
Takashi Kawakami
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Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74099
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48136
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48138
Proceedings Papers
Takahiro Kinoshita, Takashi Kawakami, Tomoya Sugiura, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48142
Proceedings Papers
Proc. ASME. GT1989, Volume 2: Aircraft Engine; Marine; Microturbines and Small Turbomachinery, V002T04A001, June 4–8, 1989
Publisher: American Society of Mechanical Engineers
Paper No: 89-GT-41
Proceedings Papers
Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73151
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73191
Journal Articles
Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020903.
Published Online: June 11, 2012
Proceedings Papers
Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 325-328, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52241
Proceedings Papers
Tetsuya Kugimiya, Kenji Hirohata, Minoru Mukai, Eitaro Miyake, Hiroshi Akiba, Nobutada Ohno, Takashi Kawakami
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89384
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1215-1221, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73297
eBook Chapter
Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2008
ISBN-10: 0791802823
ISBN: 9780791802823
Proceedings Papers
Kenji Hirohata, Katsumi Hisano, Takashi Kawakami, Hideo Aoki, Chiaki Takubo, Kuniaki Takahashi, Michael G. Pecht
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 289-303, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13800
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
Published Online: December 12, 2002
Journal Articles
Journal:
Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. December 1999, 121(4): 798–803.
Published Online: December 1, 1999
Journal Articles
Journal:
Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. September 1998, 120(3): 531–537.
Published Online: September 1, 1998