1-18 of 18
Veerendra Mulay
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Paper No: IPACK2022-97429
DOI: https://doi.org/10.1115/IPACK2022-97429
View Paper
PDF
Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

Single-Phase Immersion Cooling Study of a High-Density Storage System

Saket Karajgikar, Jasper Kidger, Andrew Shaw, Neil Edmunds, Veerendra Mulay
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 25–27, 2022
Paper No: IPACK2022-97490
DOI: https://doi.org/10.1115/IPACK2022-97490
View Paper
PDF
Topics: Cooling, Density, Storage
Proceedings Papers

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Paper No: IPACK2022-97494
DOI: https://doi.org/10.1115/IPACK2022-97494
View Paper
PDF
Topics: Cooling, Data centers, Density, Doors, Heat exchangers
Journal Articles

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, Richard Eiland, Pavan Rajmane, Ashwin Siddarth, Dereje Agonafer, Veerendra Mulay
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
DOI: https://doi.org/10.1115/1.4042979
Published Online: April 10, 2019
View Article
PDF
Topics: Cooling, Data centers, Mineral oil, Printed circuit boards, Reliability, Temperature, Testing, Capacitors, Viscosity
Journal Articles

Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation

Richard Eiland, John Edward Fernandes, Bharath Nagendran, Veerendra Mulay, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041011.
Paper No: EP-17-1021
DOI: https://doi.org/10.1115/1.4038235
Published Online: October 27, 2017
View Article
PDF
Topics: Fans, Temperature
Journal Articles

Effectiveness of Rack-Level Fans—Part II: Control Strategies and System Redundancy

John Edward Fernandes, Richard Eiland, Bharath Nagendran, Veerendra Mulay, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041012.
Paper No: EP-17-1022
DOI: https://doi.org/10.1115/1.4038014
Published Online: October 27, 2017
View Article
PDF
Topics: Failure, Fans, Stress, Redundancy (Engineering), Cooling
Proceedings Papers

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance

John Edward Fernandes, Saeed Ghalambor, Richard Eiland, Dereje Agonafer, Veerendra Mulay
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A025, July 16–18, 2013
Paper No: IPACK2013-73107
DOI: https://doi.org/10.1115/IPACK2013-73107
View Paper
PDF
Topics: Energy consumption, Forced convection, Fans, Heat sinks, Temperature, Cooling, Manufacturing, Data centers, Heat, Junctions
Proceedings Papers

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

Saeed Ghalambor, John Edward Fernandes, Dereje Agonafer, Veerendra Mulay
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A026, July 16–18, 2013
Paper No: IPACK2013-73108
DOI: https://doi.org/10.1115/IPACK2013-73108
View Paper
PDF
Topics: Forced convection, Heat sinks, Manufacturing, Pressure, Design, Screws, Computer simulation, Cooling, Microelectronic devices, Numerical analysis
Proceedings Papers

Cooling of Data Centers Using Airside Economizers

Saket Karajgikar, Veerendra Mulay, Dereje Agonafer, Roger Schmidt
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1001-1007, July 19–23, 2009
Paper No: InterPACK2009-89356
DOI: https://doi.org/10.1115/InterPACK2009-89356
View Paper
PDF
Topics: Cooling, Data centers, Energy consumption, Air conditioners, Computer simulation, Computers, Electronic components, Environmental Protection Agency, Failure, Heat
Proceedings Papers

Optimization of Location of a Power Cell for Energy Efficient Operation of Air Cool Drives

Saket Karajgikar, Veerendra Mulay, Abhilash Menon, Dereje Agonafer, Jiahui Zhang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 815-820, July 19–23, 2009
Paper No: InterPACK2009-89189
DOI: https://doi.org/10.1115/InterPACK2009-89189
View Paper
PDF
Topics: Optimization, Flow (Dynamics), Electronic components, Electronics, Low temperature
Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009
Paper No: InterPACK2009-89340
DOI: https://doi.org/10.1115/InterPACK2009-89340
View Paper
PDF
Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning
Proceedings Papers

Effective Thermal Management of Data Centers Using Efficient Cabinet Designs

Veerendra Mulay, Dereje Agonafer, Gary Irwin, Darshan Patell
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 993-999, July 19–23, 2009
Paper No: InterPACK2009-89351
DOI: https://doi.org/10.1115/InterPACK2009-89351
View Paper
PDF
Topics: Data centers, Thermal management, Energy consumption, Design, Combined heat and power, Cooling, Environmental Protection Agency, Exhaust systems, Heat, Stress
Proceedings Papers

Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers

Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Mark Hendrix
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1469-1475, November 13–19, 2009
Paper No: IMECE2009-13136
DOI: https://doi.org/10.1115/IMECE2009-13136
View Paper
PDF
Topics: Telecommunications, Thermal management, Thermoelectric coolers, Batteries, Temperature, Air conditioners, Electronics, Heat, Stress, Battery life
Proceedings Papers

Computational Study of Hybrid Cooling Solution for Thermal Management of Data Centers

Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Roger Schmidt, Madshusudan Iyengar, Jay Nigen
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 723-731, July 8–12, 2007
Paper No: IPACK2007-33000
DOI: https://doi.org/10.1115/IPACK2007-33000
View Paper
PDF
Topics: Cooling, Data centers, Thermal management, Stress, Heat, Air conditioners, Ceilings, Computational fluid dynamics, Computers, Design
Proceedings Papers

Liquid Cooling for Thermal Management of Data Centers

Veerendra Mulay, Dereje Agonafer, Roger Schmidt
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 95-101, October 31–November 6, 2008
Paper No: IMECE2008-68743
DOI: https://doi.org/10.1115/IMECE2008-68743
View Paper
PDF
Topics: Cooling, Data centers, Thermal management, Stress, Heat, Air conditioners, Computers, Storage
Proceedings Papers

Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers

Veerendra Mulay, Saket Karajgikar, Dereje Agonafer, Roger Schmidt, Madhusudan Iyengar
Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 519-526, November 11–15, 2007
Paper No: IMECE2007-43761
DOI: https://doi.org/10.1115/IMECE2007-43761
View Paper
PDF
Topics: Cooling, Data centers, Thermal management, Stress, Heat, Air conditioners, Computational fluid dynamics, Computers, Storage, Temperature
Proceedings Papers

Effect of the Thermostatic Expansion Valve Characteristics on the Stability of a Refrigeration System

Veerendra Mulay, Dereje Agonafer, Roger Schmidt
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 299-305, November 15–21, 2003
Paper No: IMECE2003-42536
DOI: https://doi.org/10.1115/IMECE2003-42536
View Paper
PDF
Topics: Refrigeration, Stability, Valves, Temperature, Stress, Low temperature, Sensors, Computers, Cooling, Thermal resistance
Journal Articles

Effect of the Location and the Properties of Thermostatic Expansion Valve Sensor Bulb on the Stability of a Refrigeration System

Veerendra Mulay, Amit Kulkarni, Dereje Agonafer, ASME Fellow, Roger Schmidt, ASME Fellow
Journal: Journal of Heat Transfer
Article Type: Article
J. Heat Transfer. January 2005, 127(1): 85–94.
DOI: https://doi.org/10.1115/1.1839584
Published Online: February 15, 2005
View Article
PDF
Topics: Refrigeration, Sensors, Temperature, Valves, Stability, Refrigerants, Flow (Dynamics), Cooling, Thermal resistance, Stress