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Proceedings Papers

A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints

Y.-H. Pao, E. Jih, V. Siddapureddy, X. Song, R. Liu, R. McMillan, J. M. Hu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 1-12, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0884
https://doi.org/10.1115/IMECE1996-0884
View Paper titled, A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints
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Topics: Fatigue, Resistors, Solder joints, Surface mount packaging, Capacitors, Ceramics, Density, Failure, Failure analysis, Fatigue failure
Journal Articles

Vibration Mode Analysis of Frames by the Method of Reverberation Ray Matrix

F. X. Miao, Guojun Sun, Y. H. Pao
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Research Papers
J. Vib. Acoust. October 2009, 131(5): 051005.
https://doi.org/10.1115/1.3147127
Published Online: September 10, 2009
View Article titled, Vibration Mode Analysis of Frames by the Method of Reverberation Ray Matrix
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Topics: Finite element methods, Sound reverberation, Vibration, Displacement, Frequency response, Aluminum, Stress
Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
https://doi.org/10.1115/1.2792229
Published Online: September 1, 1997
View Article titled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations
Journal Articles

Determination of Fracture Toughness of Thermally Conductive Adhesives

E. Jih, Y.-H. Pao, X. Song, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 204–207.
https://doi.org/10.1115/1.2792235
Published Online: September 1, 1997
View Article titled, Determination of Fracture Toughness of Thermally Conductive Adhesives
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Topics: Adhesives, Fracture toughness
Journal Articles

Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects

Y.-H. Pao, E. Jih, V. Siddapureddy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 235–243.
https://doi.org/10.1115/1.2792158
Published Online: December 1, 1996
View Article titled, Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects
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Topics: Design, Reliability, Solders
Journal Articles

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 184–190.
https://doi.org/10.1115/1.2905684
Published Online: September 1, 1994
View Article titled, Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
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Topics: Failure analysis, Solder joints, Water, Solders, Cycles, Crack propagation, Cracking (Materials), Failure, Failure mechanisms, Fatigue damage
Journal Articles

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

R. K. Govila, E. Jih, Y.-H. Pao, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 83–88.
https://doi.org/10.1115/1.2905509
Published Online: June 1, 1994
View Article titled, Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
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Topics: Fatigue damage, Resistors, Solder joints, Solders, Damage, Stress concentration, Corners (Structural elements), Cracking (Materials), Cycles, Design
eBook Chapter

Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1994
https://doi.org/10.1520/STP23916S
ISBN-10: 0-8031-1994-1
ISBN: 978-0-8031-1994-9
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Journal Articles

Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints

Y.-H. Pao, S. Badgley, E. Jih, R. Govila, J. Browning
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 147–152.
https://doi.org/10.1115/1.2909310
Published Online: June 1, 1993
View Article titled, Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints
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Topics: Cycles, Fatigue, Solder joints, Creep, Deformation, Solders, Steady state, Cooling, Failure, Failure mechanisms
Journal Articles

Closure to “Discussion of ‘Axisymmetric Elastic Waves Excited by a Point Source in a Plate’” (1982, ASME J. Appl. Mech., 50, pp. 699–700)

R. L. Weaver, Y. H. Pao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Discussions
J. Appl. Mech. September 1983, 50(3): 700.
https://doi.org/10.1115/1.3167121
Published Online: September 1, 1983
View Article titled, Closure to “Discussion of ‘Axisymmetric Elastic Waves Excited by a Point Source in a Plate’” (1982, ASME J. Appl. Mech., 50, pp. 699–700)
Open the PDF for Closure to “Discussion of ‘Axisymmetric Elastic Waves Excited by a Point Source in a Plate’” (1982, ASME J. Appl. Mech., 50, pp. 699–700) in another window
Topics: Elastic waves
Journal Articles

Seismic Migration—Imaging of Acoustic Energy by Wave Field Extrapolation

A. J. Berkhout, Author, Y.-H. Pao, Reviewer
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Book Reviews
J. Appl. Mech. September 1982, 49(3): 682–683.
https://doi.org/10.1115/1.3162563
Published Online: September 1, 1982
View Article titled, Seismic Migration—Imaging of Acoustic Energy by Wave Field Extrapolation
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Topics: Acoustics, Imaging, Waves
Journal Articles

Unidirectional Wave Motions

H. Levine, Author, Y. H. Pao, Reviewer
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Book Reviews
J. Appl. Mech. December 1978, 45(4): 969.
https://doi.org/10.1115/1.3424475
Published Online: December 1, 1978
View Article titled, Unidirectional Wave Motions
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Topics: Waves
Journal Articles

Diffraction of Elastic Waves and Dynamic Stress Concentrations

Y.-H. Pao, Author, C.-C. Mow, Author, J. D. Achenbach, Reviewer
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Book Reviews
J. Appl. Mech. December 1973, 40(4): 872.
https://doi.org/10.1115/1.3423178
Published Online: December 1, 1973
View Article titled, Diffraction of Elastic Waves and Dynamic Stress Concentrations
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Topics: Diffraction, Elastic waves, Stress
Journal Articles

Nonlinear Flexural Vibrations of a Clamped Circular Plate

G. C. Kung, Y.-H. Pao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. December 1972, 39(4): 1050–1054.
https://doi.org/10.1115/1.3422827
Published Online: December 1, 1972
View Article titled, Nonlinear Flexural Vibrations of a Clamped Circular Plate
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Topics: Vibration, Hardening
Journal Articles

Discussion: “Application of Kirchhoff’s Integral Equation Formulation to an Elastic Wave Scattering Problem” (Ko, W. L., and Karlsson, T., 1967, ASME J. Appl. Mech., 34, pp. 921–930)

S. A. Thau, Y. H. Pao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Discussions
J. Appl. Mech. June 1968, 35(2): 428–429.
https://doi.org/10.1115/1.3601228
Published Online: June 1, 1968
View Article titled, Discussion: “Application of Kirchhoff’s Integral Equation Formulation to an Elastic Wave Scattering Problem” (Ko, W. L., and Karlsson, T., 1967, ASME J. Appl. Mech., 34, pp. 921–930)
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Topics: Elastic waves, Electromagnetic scattering, Integral equations, Radiation scattering, Scattering (Physics)
Journal Articles

The Influence of the Curvature of Spherical Waves on Dynamic Stress Concentration

F. C. Moon, Y-H. Pao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. June 1967, 34(2): 373–379.
https://doi.org/10.1115/1.3607692
Published Online: June 1, 1967
View Article titled, The Influence of the Curvature of Spherical Waves on Dynamic Stress Concentration
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Topics: Stress concentration, Waves, Cavities, Stress, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Wavelength