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Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 25–27, 2022

Paper No: IPACK2022-97478

DOI: https://doi.org/10.1115/IPACK2022-97478

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Topics: Data centers, Modeling, Transients (Dynamics)

Journal Articles

Recent Progress and Challenges in Microscale Urban Heat Modeling and Measurement for Urban Engineering Applications

Shuv Dey, Yogendra Joshi

J. Thermal Sci. Eng. Appl. January 2023, 15(1): 010801.

Paper No: TSEA-22-1328

DOI: https://doi.org/10.1115/1.4056054

Published Online: November 10, 2022

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Topics: Cities, Heat, Modeling, Microscale devices

Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi

J. Electron. Packag. June 2023, 145(2): 021004.

Paper No: EP-22-1038

DOI: https://doi.org/10.1115/1.4055094

Published Online: August 18, 2022

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Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles

Journal Articles

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi

J. Electron. Packag. June 2022, 144(2): 021114.

Paper No: EP-21-1052

DOI: https://doi.org/10.1115/1.4053121

Published Online: February 7, 2022

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Topics: Engines, Finite element analysis, Lamination, Motors, Stators, Temperature, Thermal conductivity, Winding (process), Sensitivity analysis, Contact resistance

Proceedings Papers

MEMS-Based Test Structures for IC Technology

Stephen A. Smee, Michael Gaitan, Yogendra Joshi

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 147-149, November 15–20, 1998

Paper No: IMECE1998-1151

DOI: https://doi.org/10.1115/IMECE1998-1151

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Topics: Delamination, Density, Electrodiffusion, Failure, Integrated circuits, Microelectromechanical systems, Probability, Reliability, Stress, Thermomechanics

Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi

J. Electron. Packag. September 2021, 143(3): 031007.

Paper No: EP-20-1045

DOI: https://doi.org/10.1115/1.4049814

Published Online: February 19, 2021

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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat

Journal Articles

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Tomas Moreno-Torres, Daniel Lorenzini, Yogendra Joshi, Abel Hernandez-Guerrero, J. Luis Luviano-Ortiz

J. Heat Transfer. April 2021, 143(4): 044502.

Paper No: HT-20-1769

DOI: https://doi.org/10.1115/1.4049639

Published Online: February 2, 2021

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Topics: Computer simulation, Cooling systems, Density, Experimental design, Heat, Microfluidics, Pressure drop, Silicon, Temperature, Fins

Journal Articles

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi

J. Electron. Packag. September 2021, 143(3): 030801.

Paper No: EP-19-1124

DOI: https://doi.org/10.1115/1.4048861

Published Online: January 19, 2021

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Topics: Heat sinks, Metal foams, Heat transfer

Journal Articles

Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array

Yuanchen Hu, Thomas Sarvey, Muhannad S. Bakir, Yogendra Joshi

J. Heat Transfer. March 2021, 143(3): 031501.

Paper No: HT-20-1115

DOI: https://doi.org/10.1115/1.4049189

Published Online: January 18, 2021

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Topics: Cooling, Design, Flow (Dynamics), Heat flux, Hydrofoil, Pressure drop, Temperature, Coolants, Fins, Heat transfer coefficients

Proceedings Papers

Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020

Paper No: IPACK2020-2550

DOI: https://doi.org/10.1115/IPACK2020-2550

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Topics: Electric motors, Engines, Finite element analysis, Motors, Permanent magnets, Sensitivity analysis, Thermal management

Journal Articles

Packaging Environmental Sensors for Monitoring Urban-Microclimates

Shuv Dey, J. Michael Brown, Yogendra Joshi

J. Eng. Sustain. Bldgs. Cities. August 2020, 1(3): 031001.

Paper No: JESBC-20-1004

DOI: https://doi.org/10.1115/1.4047422

Published Online: June 18, 2020

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Topics: Packaging, Sensors, Design

Journal Articles

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi

J. Electron. Packag. March 2021, 143(1): 011006.

Paper No: EP-19-1100

DOI: https://doi.org/10.1115/1.4046756

Published Online: June 4, 2020

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Topics: Heat flux, Heat sinks, Metal foams, Heat transfer, Temperature, Fluids

Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang

J. Electron. Packag. September 2020, 142(3): 031120.

Paper No: EP-19-1127

DOI: https://doi.org/10.1115/1.4046933

Published Online: May 4, 2020

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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics

Journal Articles

Predictive Model Development and Validation for Raised Floor Plenum Data Center

Yogesh Fulpagare, Atul Bhargav, Yogendra Joshi

J. Electron. Packag. June 2020, 142(2): 021009.

Paper No: EP-18-1078

DOI: https://doi.org/10.1115/1.4046554

Published Online: March 19, 2020

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Topics: Computational fluid dynamics, Data centers, Temperature, Testing, Transients (Dynamics), Heat, Stress

Proceedings Papers

Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies

Shuv Dey, Yogendra Joshi, J. Michael Brown

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 7–9, 2019

Paper No: IPACK2019-6515

DOI: https://doi.org/10.1115/IPACK2019-6515

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Topics: Cities, Heat, Internet of things, Packaging, Pollution, Sensor networks, Sensors

Proceedings Papers

A Numerical Investigation of Additive Manufactured Foam Structures for Single Phase Hotspot Thermal Management

Justin Broughton, Yogendra Joshi

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019

Paper No: IPACK2019-6519

DOI: https://doi.org/10.1115/IPACK2019-6519

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Topics: Additive manufacturing, Electronics, Metal foams, Modeling, Thermal management

Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019

Paper No: IPACK2019-6391

DOI: https://doi.org/10.1115/IPACK2019-6391

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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software

Journal citation

NARROW

Manuscript

Evaluation and Validation of Microscale Atmospheric Modeling with Offline Weather Research and Forecasting Model to Parallelized Large-eddy Simulation Model Forcing Conditions

Special Issue: Ivan Catton Memorial Issue — Innovations and Advancements in Heat & Mass Transfer: Part I

Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications

Data Driven Modeling Advancements for Thermal Predictions in Data Center Applications

Recent Progress and Challenges in Microscale Urban Heat Modeling and Measurement for Urban Engineering Applications

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

MEMS-Based Test Structures for IC Technology

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array

Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor

Packaging Environmental Sensors for Monitoring Urban-Microclimates

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Predictive Model Development and Validation for Raised Floor Plenum Data Center

Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies

A Numerical Investigation of Additive Manufactured Foam Structures for Single Phase Hotspot Thermal Management

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

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