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Proceedings Papers

Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions

Nhi V. Quach, Jewoo Park, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Alex K. Lee, Chenxi Yin, Yoonjin Won

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 25–27, 2022

Paper No: IPACK2022-96542

DOI: https://doi.org/10.1115/IPACK2022-96542

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Topics: Autonomous vehicles, Machine learning

Proceedings Papers

A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles

Nicholas Choi, Nhi V. Quach, Yoonjin Won

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 26–28, 2021

Paper No: IPACK2021-69751

DOI: https://doi.org/10.1115/IPACK2021-69751

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Topics: Batteries, Cooling, Electric vehicles, Energy dissipation, Heat, Thermal management

Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won

J. Electron. Packag. December 2021, 143(4): 041112.

Paper No: EP-21-1105

DOI: https://doi.org/10.1115/1.4052790

Published Online: November 9, 2021

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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)

Includes: Supplementary data

Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020

Paper No: IPACK2020-2613

DOI: https://doi.org/10.1115/IPACK2020-2613

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Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel

Proceedings Papers

Molecular Dynamics Investigation of Water Behavior Through Nanopores

Kimia Montazeri, Penghui Cao, Yoonjin Won

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 27–29, 2020

Paper No: IPACK2020-2699

DOI: https://doi.org/10.1115/IPACK2020-2699

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Topics: Density, Molecular dynamics, Nanopores, Water, Nanoscale phenomena, Dimensions, Dynamics (Mechanics), Energy storage, Engineering systems and industry applications, Fluids

Journal Articles

Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won

J. Electron. Packag. September 2020, 142(3): 031105.

Paper No: EP-19-1137

DOI: https://doi.org/10.1115/1.4046767

Published Online: April 17, 2020

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Topics: Evaporation, Fluorescence, Temperature, Vapors, Microscale devices

Includes: Supplementary data

Proceedings Papers

Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings

Quang N. Pham, Youngjoon Suh, Bowen Shao, Yoonjin Won

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 7–9, 2019

Paper No: IPACK2019-6307

DOI: https://doi.org/10.1115/IPACK2019-6307

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Topics: Boiling, Bubbles, Coatings, Dynamics (Mechanics), Heat transfer, Pool boiling, Flow (Dynamics), Thermal management, Cooling, Design

Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019

Paper No: IPACK2019-6372

DOI: https://doi.org/10.1115/IPACK2019-6372

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Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics

Journal Articles

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won

J. Electron. Packag. September 2019, 141(3): 031013.

Paper No: EP-18-1104

DOI: https://doi.org/10.1115/1.4044373

Published Online: September 19, 2019

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Topics: Copper, Evaporation, Flux (Metallurgy), Heat, Heat flux, Permeability

Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018

Paper No: IPACK2018-8456

DOI: https://doi.org/10.1115/IPACK2018-8456

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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux

Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2018, 140(2): 020906.

Paper No: EP-18-1003

DOI: https://doi.org/10.1115/1.4040088

Published Online: May 9, 2018

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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles

Proceedings Papers

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017

Paper No: IPACK2017-74090

DOI: https://doi.org/10.1115/IPACK2017-74090

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Topics: Boiling, Copper, Heat transfer, Bubbles, Critical heat flux, Cooling, Heat transfer coefficients, Microscale devices, Nucleation (Physics), Optical images

Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. March 2016, 138(1): 010907.

Paper No: EP-15-1104

DOI: https://doi.org/10.1115/1.4032655

Published Online: March 10, 2016

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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation

Proceedings Papers

Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Karen M. Dowling, Ateeq J. Suria, Yoonjin Won, Ashwin Shankar, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson, Debbie G. Senesky

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A006, July 6–9, 2015

Paper No: IPACK2015-48409

DOI: https://doi.org/10.1115/IPACK2015-48409

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Topics: Cooling, Microchannels, Plasma etching, Silicon, Gallium nitride, Electronics, Density, Etching, Finite element analysis, Heat transfer coefficients

Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015

Paper No: IPACK2015-48122

DOI: https://doi.org/10.1115/IPACK2015-48122

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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction

Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson

Paper No: IPACK2015-48670

DOI: https://doi.org/10.1115/IPACK2015-48670

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Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction

Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015

Paper No: IPACK2015-48592

DOI: https://doi.org/10.1115/IPACK2015-48592

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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer

Proceedings Papers

Thermoelectric Characterization of Ge 2 Sb 2 Te 5 Films for Phase-Change Memory

Jaeho Lee, Takashi Kodama, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 687-693, March 3–6, 2012

Paper No: MNHMT2012-75092

DOI: https://doi.org/10.1115/MNHMT2012-75092

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Topics: Crystallization, Electromagnetic scattering, Engineering simulation, Film thickness, Grain boundaries, Optimization, Phase change materials, Radiation scattering, Scattering (Physics), Simulation

Journal citation

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Supplemental Material

Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions

A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Molecular Dynamics Investigation of Water Behavior Through Nanopores

Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence

Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Evaporative Wicking Phenomena on Nanotextured Surfaces

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Thermoelectric Characterization of Ge 2 Sb 2 Te 5 Films for Phase-Change Memory

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