Abstract
With the application of various high-power electronic devices to improving aircraft comprehensive performance, there has been a significant interest in the use of high heat flux dissipation technology to maintain an effective and safe operation for electronic devices. This article presents a numerical study on the thermal and electrical performance of the avionics server module by using single-phase immersion cooling technology with flow distributor and investigates the influence of heat dissipation capacity on the thermal performance of the avionics server module and DC IR-drop of printed circuit board power distribution network (PDN). The simulation results showed that a higher dielectric fluid flowrate can be provided b flow distributor with the same pumping power, and the maximum temperature of the hot spot was 4–8 °C lower than the module without a flow distributor. The result confirmed the improved flow performance and enhances heat transfer of the hot spot for the module with a flow distributor. However, the module without the flow distributor showed better comprehensive cooling performance with about 10–15% reduction in average Nusselt number with an increase in Re. The discrepancy of PDN DC IR-drop under different Re values was constant at 3% for different design geometries, which means the effect of the flow distributor on power delivery capability can be neglected.
Issue Section:
Research Papers
Keywords:
avionics server module,
immersion cooling,
flow guide integration,
thermal performance,
power distribution network (PDN)
Topics:
Avionics,
Cooling,
Design,
Flow (Dynamics),
Fluids,
Temperature,
Heat,
Energy dissipation,
Heat transfer
References
1.
Cai
, S. Q.
, Bhunia
, A.
, and Asfia
, J. F.
, 2017
, “A Passive and Remote Heat Transfer Solution for Avionics Thermal Management
,” ASME J. Therm. Sci. Eng. Appl.
, 9
(2
), p. 021009
. 2.
Zhao
, M.
, Pang
, L.
, Liu
, M.
, Yu
, S.
, and Mao
, X.
, 2020
, “Control Strategy for Helicopter Thermal Management System Based on Liquid Cooling and Vapor Compression Refrigeration
,” Energies
, 13
(9
), p. 2177
. 3.
Wang
, J.-X.
, Guo
, W.
, Xiong
, K.
, and Wang
, S.-N.
, 2020
, “Review of Aerospace-Oriented Spray Cooling Technology
,” Prog. Aerosp. Sci.
, 116
, p. 100635
. 4.
Schmidt
, D. K.
, Stevens
, J.
, and Roney
, J.
, 2007
, “Near-Space Station-Keeping Performance of a Large High-Altitude Notional Airship
,” J. Aircr.
, 44
(2
), pp. 611
–615
. 5.
Emo
, S.
, Ervin
, J.
, Michalak
, T. E.
, and Tsao
, V.
, 2014
, “Cycle-Based Vapor Cycle System Control and Active Charge Management for Dynamic Airborne Applications
,” SAE 2014 Aerospace Systems and Technology Conference
, Cincinnati, OH
, Sept. 23–25
, Paper No. 2014-01-2224.6.
Suresh
, A.
, 2022
, “Thermal Sort: A Simple Optimization Problem in Avionics Cooling
,” AIAA SCITECH 2022 Forum
, San Diego, CA
, Jan. 3–7
, Paper No. 2022-1912.7.
Zhang
, H.
, Li
, Y.
, Wang
, S.
, Liu
, Y.
, and Zhong
, M.
, 2016
, “Ground Experimental Investigations Into an Ejected Spray Cooling System for Space Closed-Loop Application
,” Chin. J. Aeronaut.
, 29
(3
), pp. 630
–638
. 8.
Shanmugasundaram
, V.
, Ramalingam
, M.
, Donovan
, B.
, Mahefkey
, T.
, and Hager
, B.
, 2005
, “Analytical Investigation of Thermal Management Options for an Aircraft Based High Pulsed Power System Application
,” 3rd International Energy Conversion Engineering Conference
, San Francisco, CA
, Aug. 15–18
, AIAA, Paper No. 2005-5649.9.
Smakulski
, P.
, and Pietrowicz
, S.
, 2016
, “A Review of the Capabilities of High Heat Flux Removal by Porous Materials, Microchannels and Spray Cooling Techniques
,” Appl. Therm. Eng.
, 104
(5
), pp. 636
–646
. 10.
Salah
, W. A.
, and Abuhelwa
, M.
, 2020
, “Review of Thermoelectric Cooling Devices Recent Applications
,” J. Eng. Sci. Technol.
, 15
(1
), pp. 455
–476
.11.
Cheng
, J.
, Shuai
, S.
, Zhao
, R.
, and Tang
, Z.
, 2022
, “Numerical Analysis of Heat-Pipe-Based Battery Thermal Management System for Prismatic Lithium-Ion Batteries
,” ASME J. Therm. Sci. Eng. Appl.
, 14
(8
), p. 081008
. 12.
Bulut
, M.
, Kandlikar
, S. G.
, and Sozbir
, N.
, 2019
, “A Review of Vapor Chambers
,” Heat Transfer Eng.
, 40
(19
), pp. 1551
–1573
. 13.
Kim
, J.
, 2007
, “Spray Cooling Heat Transfer: The State of the Art
,” Int. J. Heat Fluid Flow
, 28
(4
), pp. 753
–767
. 14.
Hotta
, T.
, and Patil
, N.
, 2018
, “A Review on Cooling of Discrete Heated Modules Using Liquid Jet Impingement
,” Front. Heat Mass Transfer
, 11
(16
), pp. 1
–13
. 15.
Roe
, C.
, Feng
, X.
, White
, G.
, Li
, R.
, Wang
, H.
, Rui
, X.
, Li
, C.
, Zhang
, F.
, Null
, V.
, and Parkes
, M.
, 2022
, “Immersion Cooling for Lithium-Ion Batteries—A Review
,” J. Power Sources
, 525
(30
), p. 231094
. 16.
Liang
, K.
, Li
, Z.
, Chen
, M.
, and Jiang
, H.
, 2019
, “Comparisons Between Heat Pipe, Thermoelectric System, and Vapour Compression Refrigeration System for Electronics Cooling
,” Appl. Therm. Eng.
, 146
(5
), pp. 260
–267
. 17.
Siddique
, A. R. M.
, Mahmud
, S.
, and Van Heyst
, B.
, 2018
, “A Comprehensive Review on a Passive (Phase Change Materials) and an Active (Thermoelectric Cooler) Battery Thermal Management System and Their Limitations
,” J. Power Sources
, 401
(15
), pp. 224
–237
. 18.
Kuncoro
, I.
, Pambudi
, N.
, Biddinika
, M.
, Widiastuti
, I.
, Hijriawan
, M.
, and Wibowo
, K.
, 2019
, “Immersion Cooling as the Next Technology for Data Center Cooling: A Review
,” J. Phys. Conf. Ser.
, 1402
(4
), p. 044057
. 19.
Levin
, I.
, Dordopulo
, A.
, Doronchenko
, Y.
, Raskladkin
, M.
, Fedorov
, A.
, and Kalyaev
, Z.
, 2016
, “Immersion Liquid Cooling FPGA-Based Reconfigurable Computer System
,” IFAC-PapersOnLine
, 49
(25
), pp. 366
–371
. 20.
Pérez
, S.
, Arroba
, P.
, and Moya
, J. M.
, 2021
, “Energy-Conscious Optimization of Edge Computing Through Deep Reinforcement Learning and Two-Phase Immersion Cooling
,” Future Gener. Comput. Syst.
, 125
, pp. 891
–907
. 21.
Patil
, M. S.
, Seo
, J.-H.
, and Lee
, M.-Y.
, 2021
, “A Novel Dielectric Fluid Immersion Cooling Technology for Li-Ion Battery Thermal Management
,” Energy Convers. Manage.
, 229
(1
), p. 113715
. 22.
Sivakumar
, B.
, Navakrishnan
, S.
, Cibi
, M. R.
, and Senthil
, R.
, 2021
, “Experimental Study on the Electrical Performance of a Solar Photovoltaic Panel by Water Immersion
,” Environ. Sci. Pollut. Res.
, 28
(31
), pp. 42981
–42989
. 23.
Cengiz
, C.
, Muslu
, A. M.
, Arik
, M.
, and Dogruoz
, B.
, 2020
, “Enhanced Thermal Performance of High Flux Led Systems With Two-Phase Immersion Cooling
,” 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
, Orlando, FL
, July 21–23
, IEEE
, pp. 196
–206
, Paper No. 19995251.24.
Lionello
, M.
, Rampazzo
, M.
, Beghi
, A.
, Varagnolo
, D.
, and Vesterlund
, M.
, 2020
, “Graph-Based Modelling and Simulation of Liquid Immersion Cooling Systems
,” Energy
, 207
(15
), p. 118238
. 25.
Cheng
, C.-C.
, Chang
, P.-C.
, Li
, H.-C.
, and Hsu
, F.-I.
, 2020
, “Design of a Single-Phase Immersion Cooling System Through Experimental and Numerical Analysis
,” Int. J. Heat Mass Transfer
, 160
, p. 120203
. 26.
Ali
, A.
, 2020
, “Thermal Performance and Stress Analysis of Heat Spreaders for Immersion Cooling Applications
,” Appl. Therm. Eng.
, 181
(25
), p. 115984
. 27.
Fan
, S.
, and Duan
, F.
, 2021
, “Correlations for Heat Transfer Characteristics of the Onset of Nucleate Boiling in Submerged Jet Impingement
,” Int. J. Therm. Sci.
, 170
, p. 107071
. 28.
Ren
, L.
, Wang
, Y.
, Yang
, Z.
, and Ding
, W.
, 2021
, “High Power and High Repetition Frequency Sub-Nanosecond Pulse Generator With Two-Phase Immersion Cooling Technique
,” Rev. Sci. Instrum.
, 92
(3
), p. 034716
. 29.
Jithin
, K. V.
, and Rajesh
, P. K.
, 2022
, “Numerical Analysis of Single-Phase Liquid Immersion Cooling for Lithium-Ion Battery Thermal Management Using Different Dielectric Fluids
,” Int. J. Heat Mass Transfer
, 188
, p. 122608
. 30.
Kang
, D.
, Lee
, J.
, Chakraborty
, A.
, Lee
, S.-E.
, Kim
, G.
, and Yu
, C.
, 2022
, “Recent Advances in Two-Phase Immersion Cooling With Surface Modifications for Thermal Management
,” Energies
, 15
(3
), p. 1214
. 31.
Pambudi
, N. A.
, Sarifudin
, A.
, Firdaus
, R. A.
, Ulfa
, D. K.
, Gandidi
, I. M.
, and Romadhon
, R.
, 2022
, “The Immersion Cooling Technology: Current and Future Development in Energy Saving
,” Alex. Eng. J.
, 61
(12
), pp. 9509
–9527
. 32.
Wang
, J.-X.
, Li
, Y.-Z.
, Zhang
, H.-S.
, Wang
, S.-N.
, Liang
, Y.-H.
, Guo
, W.
, Liu
, Y.
, and Tian
, S.-P.
, 2016
, “A Highly Self-Adaptive Cold Plate for the Single-Phase Mechanically Pumped Fluid Loop for Spacecraft Thermal Management
,” Energy Convers. Manage.
, 111
(1
), pp. 57
–66
. 33.
Gess
, J.
, Bhavnani
, S. H.
, and Johnson
, R. W.
, 2014
, “Thermal Resistance and PIV Characterization of a Line-Replaceable Compact Liquid-Cooled Server Module for High Performance Computing Platforms
,” ASME 2014 International Mechanical Engineering Congress and Exposition
, Montreal, Quebec, Canada
, Nov. 14–20
, p. V010T13A084
, Paper No. IMECE2014-38866.34.
Xuequan
, Y.
, Hang
, Y.
, Gezi
, Z.
, and Haisan
, W.
, 2010
, “Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material
,” IEEE International Symposium on Electromagnetic Compatibility
, Fort Lauderdale, FL
, July 25–30
, IEEE
, pp. 228
–232
, Paper No. 11832913.35.
Tan
, H.
, Wu
, L.
, Wang
, M.
, Yang
, Z.
, and Du
, P.
, 2019
, “Heat Transfer Improvement in Microchannel Heat Sink by Topology Design and Optimization for High Heat Flux Chip Cooling
,” Int. J. Heat Mass Transfer
, 129
, pp. 681
–689
. 36.
Patankar
, S. V.
, and Spalding
, D. B.
, 1995
, “A Calculation Procedure for Heat, Mass and Momentum Transfer in Three-Dimensional Parabolic Flows
,” Int. J. Heat Mass Transfer
, 17
(3
), pp. 54
–73
. 37.
Marcellus
, M.
, Spilhaus Jr
, A.
, and Troeltzsch
, L.
, 1961
, “Heat Transfer Characteristics of Fluorochemical Inert Liquid FC-75
,” J. Chem. Eng. Data
, 6
(3
), pp. 459
–463
. 38.
Arden
, W. M.
, 2002
, “The International Technology Roadmap for Semiconductors—Perspectives and Challenges for the Next 15 Years
,” Curr. Opin. Solid State Mater. Sci.
, 6
(5
), pp. 371
–377
. 39.
Tao
, W.
, 2001
, Numerical Heat Transfer
, 2nd ed., Press Xian Jiatong University
, China
.40.
Zhao
, J.
, Huang
, S.
, Gong
, L.
, and Huang
, Z.
, 2016
, “Numerical Study and Optimizing on Micro Square Pin-Fin Heat Sink for Electronic Cooling
,” Appl. Therm. Eng.
, 93
(25
), pp. 1347
–1359
. 41.
Zhuang
, D.
, Yang
, Y.
, Ding
, G.
, Du
, X.
, and Hu
, Z.
, 2020
, “Optimization of Microchannel Heat Sink With Rhombus Fractal-Like Units for Electronic Chip Cooling
,” Int. J. Refrig.
, 116
, pp. 108
–118
. 42.
Li
, P.
, Tang
, M.
, Huang
, Z. X.
, Jiang
, L. J.
, and Bağcı
, H.
, 2020
, “DC IR-Drop Analysis of Multilayered Power Distribution Network by Discontinuous Galerkin Method With Thermal Effects Incorporated
,” IEEE Trans. Compon. Packag. Manuf. Technol.
, 10
(6
), pp. 1035
–1042
. 43.
Intel
, 2021
, “Device-Specific Power Delivery Network (PDN) Tool 2.0 User Guide
,” Version: 2021.08.24, ID. 683293.44.
Md
, O. H.
, 2019
, “Power Delivery and Thermal Considerations for 2.5-D and 3-D Integration Technologies
,” Ph.D. thesis
, Georgia Institute of Technology
, Atlanta, GA
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