Tremendous efforts had been given to ensure proper heat dissipation in electronics cooling but very seldom consider design robustness and user preferences in design principles of the heat-dissipating devices. Multi-objective optimization problems are one of the preferences elicitation tools that could be used and is highly visual on the costs and benefits associated in choosing different preferences. It would be better if a wider temperature range is offered for thermal management schemes and is made available if the user desires. It would also be sought upon if automatic determination of the user preference for a wider range of varying performance were available. In this paper, a liquid impinging heat exchanger with a thermoelectric module was chosen as the example of how this paradigmatic scheme was implemented using black box models. An orthogonal sampling method was applied with three parameters considered. The temperature at the interface between the chip surface and the liquid impinging thermoelectric cooler (LITEC) is taken as the desired response. A response surface was generated using Kriging method, after which, a multi-objective optimization problem was then formulated to include robust definition and user preference for energy efficiency. The optimal operation parameters of the inlet flow velocity and the thermoelectric (TE) chip control voltage were found for various levels of heat loading conditions and different considerations of design robustness and energy awareness.
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June 2017
Research-Article
User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness
Mark Christian E. Manuel,
Mark Christian E. Manuel
School of Mechanical and Manufacturing
Engineering,
Mapua Institute of Technology,
Muralla Street,
Intramuros 1002, Manila, Philippines
e-mail: marchm.090407@gmail.com
Engineering,
Mapua Institute of Technology,
Muralla Street,
Intramuros 1002, Manila, Philippines
e-mail: marchm.090407@gmail.com
Search for other works by this author on:
Kuan Sung Hsu,
Kuan Sung Hsu
R&D Division,
San Shing Fastech Corp.,
No. 355-6, Sec. 3, Zhongshan Road,
Guiren District,
Tainan City 711, Taiwan
e-mail: larry79131@gmail.com
San Shing Fastech Corp.,
No. 355-6, Sec. 3, Zhongshan Road,
Guiren District,
Tainan City 711, Taiwan
e-mail: larry79131@gmail.com
Search for other works by this author on:
Shu-Ping Lin,
Shu-Ping Lin
Department of Mechanical Engineering,
Chung Yuan Christian University,
200 Chungpei Road,
Chungli 32023, Taoyuan, Taiwan
e-mail: lin9923203@gmail.com
Chung Yuan Christian University,
200 Chungpei Road,
Chungli 32023, Taoyuan, Taiwan
e-mail: lin9923203@gmail.com
Search for other works by this author on:
Po Ting Lin
Po Ting Lin
Mem. ASME
Department of Mechanical Engineering,
Chung Yuan Christian University,
200 Chungpei Road,
Chungli 32023, Taoyuan, Taiwan;
Department of Mechanical Engineering,
Chung Yuan Christian University,
200 Chungpei Road,
Chungli 32023, Taoyuan, Taiwan;
Department of Mechanical Engineering,
National Taiwan University of Science
and Technology,
43 Keelung Road, Sec. 4,
Taipei 10607, Taiwan
e-mail: potinglin223@gmail.com
National Taiwan University of Science
and Technology,
43 Keelung Road, Sec. 4,
Taipei 10607, Taiwan
e-mail: potinglin223@gmail.com
Search for other works by this author on:
Mark Christian E. Manuel
School of Mechanical and Manufacturing
Engineering,
Mapua Institute of Technology,
Muralla Street,
Intramuros 1002, Manila, Philippines
e-mail: marchm.090407@gmail.com
Engineering,
Mapua Institute of Technology,
Muralla Street,
Intramuros 1002, Manila, Philippines
e-mail: marchm.090407@gmail.com
Kuan Sung Hsu
R&D Division,
San Shing Fastech Corp.,
No. 355-6, Sec. 3, Zhongshan Road,
Guiren District,
Tainan City 711, Taiwan
e-mail: larry79131@gmail.com
San Shing Fastech Corp.,
No. 355-6, Sec. 3, Zhongshan Road,
Guiren District,
Tainan City 711, Taiwan
e-mail: larry79131@gmail.com
Shu-Ping Lin
Department of Mechanical Engineering,
Chung Yuan Christian University,
200 Chungpei Road,
Chungli 32023, Taoyuan, Taiwan
e-mail: lin9923203@gmail.com
Chung Yuan Christian University,
200 Chungpei Road,
Chungli 32023, Taoyuan, Taiwan
e-mail: lin9923203@gmail.com
Po Ting Lin
Mem. ASME
Department of Mechanical Engineering,
Chung Yuan Christian University,
200 Chungpei Road,
Chungli 32023, Taoyuan, Taiwan;
Department of Mechanical Engineering,
Chung Yuan Christian University,
200 Chungpei Road,
Chungli 32023, Taoyuan, Taiwan;
Department of Mechanical Engineering,
National Taiwan University of Science
and Technology,
43 Keelung Road, Sec. 4,
Taipei 10607, Taiwan
e-mail: potinglin223@gmail.com
National Taiwan University of Science
and Technology,
43 Keelung Road, Sec. 4,
Taipei 10607, Taiwan
e-mail: potinglin223@gmail.com
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received March 8, 2016; final manuscript received December 13, 2016; published online March 7, 2017. Assoc. Editor: Gamal Refaie-Ahmed.
J. Thermal Sci. Eng. Appl. Jun 2017, 9(2): 021012 (9 pages)
Published Online: March 7, 2017
Article history
Received:
March 8, 2016
Revised:
December 13, 2016
Citation
Manuel, M. C. E., Hsu, K. S., Lin, S., and Lin, P. T. (March 7, 2017). "User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness." ASME. J. Thermal Sci. Eng. Appl. June 2017; 9(2): 021012. https://doi.org/10.1115/1.4035837
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