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Journal Articles

Study on the Performance of the Low-Cost Cooling System for Transmit/Receive Module and Broadening the Exploitative Capabilities of the System Using Gravity Heat Pipes

Yu. E. Nikolaenko, D. V. Pekur, V. Yu. Kravets, V. M. Sorokin, D. V. Kozak, R. S. Melnyk, L. V. Lipnitskyi, A. S. Solomakha

Publisher: ASME

J. Thermal Sci. Eng. Appl. December 2022, 14(12): 121001.

Paper No: TSEA-21-1756

https://doi.org/10.1115/1.4054812

Published Online: August 23, 2022

View Article titled, Study on the Performance of the Low-Cost Cooling System for Transmit/Receive Module and Broadening the Exploitative Capabilities of the System Using Gravity Heat Pipes

Topics: Cooling systems, Heat sinks, Temperature, Transistors, Computer simulation, Cooling

Journal Articles

User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness

Mark Christian E. Manuel, Kuan Sung Hsu, Shu-Ping Lin, Po Ting Lin

Publisher: ASME

J. Thermal Sci. Eng. Appl. June 2017, 9(2): 021012.

Paper No: TSEA-16-1057

https://doi.org/10.1115/1.4035837

Published Online: March 7, 2017

View Article titled, User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness

Topics: Computer cooling, Design, Heat, Preferences, Response surface methodology, Robustness, Temperature, Cooling, Flow (Dynamics), Transistors

Journal Articles

Efficient Thermal-Impedance Simulation of Insulated-Gate Bipolar Transistors Modules on Heat Sinks

Thomas B. Gradinger, Uwe Drofenik

Publisher: ASME

J. Thermal Sci. Eng. Appl. December 2013, 5(4): 041009.

Paper No: TSEA-12-1128

https://doi.org/10.1115/1.4023889

Published Online: October 3, 2013

View Article titled, Efficient Thermal-Impedance Simulation of Insulated-Gate Bipolar Transistors Modules on Heat Sinks

Topics: Heat sinks, Simulation, Temperature, Junctions, Gates (Closures), Transistors, Errors

Journal Articles

Vapor Chamber Acting as a Heat Spreader for Power Module Cooling

Y. P. Zhang, X. L. Yu, Q. K. Feng, L. H. Zhang

Publisher: ASME

J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021003.

https://doi.org/10.1115/1.4000285

Published Online: November 4, 2009

View Article titled, Vapor Chamber Acting as a Heat Spreader for Power Module Cooling

Topics: Cooling, Copper, Flat heat pipes, Heat, Heat sinks, Junctions, Temperature, Thermal resistance, Vapors, Heat flux

Journal citation

NARROW

Study on the Performance of the Low-Cost Cooling System for Transmit/Receive Module and Broadening the Exploitative Capabilities of the System Using Gravity Heat Pipes

User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness

Efficient Thermal-Impedance Simulation of Insulated-Gate Bipolar Transistors Modules on Heat Sinks

Vapor Chamber Acting as a Heat Spreader for Power Module Cooling

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Study on the Performance of the Low-Cost Cooling System for Transmit/Receive Module and Broadening the Exploitative Capabilities of the System Using Gravity Heat Pipes

User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness

Efficient Thermal-Impedance Simulation of Insulated-Gate Bipolar Transistors Modules on Heat Sinks

Vapor Chamber Acting as a Heat Spreader for Power Module Cooling

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

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