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Keywords: Electronic cooling
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Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 011006.
Paper No: TSEA-22-1170
Published Online: September 22, 2022
... systems (Fig. 1 ) [ 1 – 4 ]. permanent magnet synchronous motor gas–liquid two phase jet cooling numerical simulation electronic cooling heat transfer enhancement jets impingement cooling two-phase flow and heat transfer 08 04 2022 30 08 2022 31 08 2022 22 09 2022...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 011007.
Paper No: TSEA-22-1253
Published Online: September 22, 2022
...: baburaoponangi@gmail.com 17 05 2022 30 08 2022 31 08 2022 22 09 2022 BMS cold plate serpentine channel ANN FEM Galerkin method electronic cooling heat and mass transfer Electric vehicles (EVs) seem to be the way of the future for transportation. The shortcomings...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2022, 14(12): 121013.
Paper No: TSEA-22-1189
Published Online: September 22, 2022
... method forced convection decoupled method mixed convection shrouded plate finned channel electronic cooling extended surfaces/fins forced convection heat transfer enhancement natural and mixed convection thermal systems 18 04 2022 31 07 2022 04 08 2022 22 09 2022...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2022, 14(12): 121001.
Paper No: TSEA-21-1756
Published Online: August 23, 2022
... at higher inlet air temperatures. National Academy of Sciences of Ukraine 10.13039/501100004742 2020.02/0357 transmit/receive module low-cost air cooling system thermal characteristics heat sink gravity heat pipe electronic cooling forced convection heat and mass transfer heat...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. November 2022, 14(11): 111013.
Paper No: TSEA-22-1109
Published Online: July 18, 2022
... plate heat sink hybrid cooling thermal management electronic cooling energy systems heat transfer enhancement References [1] Pfahl , R. C. , and Mcelroy , J. , 2005 , “ The 2004 International Electronics Manufacturing Initiative (iNEMI) Technology Road Maps...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2022, 14(9): 091018.
Paper No: TSEA-21-1623
Published Online: May 30, 2022
... refrigeration regenerative cryocooler electronic cooling energy systems heat and mass transfer low-temperature heat transfer thermal systems The single-stage Gifford–McMahon (GM) refrigerators are mostly adopted to cool electronic devices, high-temperature superconducting (HTS) magnets of nuclear...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2022, 14(1): 011014.
Paper No: TSEA-21-1366
Published Online: November 18, 2021
... of these electronic components must avoid overheating and deterioration of lifetime [ 1 , 2 ]. These challenges point toward effective electronics cooling or a thermal management system for electronics systems. Electronic cooling is inevitable for computer processors, battery stack operation, and insulated gate...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061011.
Paper No: TSEA-21-1144
Published Online: November 18, 2021
...@univ-littoral.fr 04 03 2021 27 10 2021 31 10 2021 18 11 2021 electrocaloric effect solid-state refrigeration heat pump electronic cooling energy efficiency Refrigeration has become an imperative for humankind. Due to the exponential growth of needs for cooling...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061013.
Paper No: TSEA-21-1350
Published Online: November 18, 2021
... transfer effectiveness for a thin, isothermal perforated plate using low-speed air as a working fluid. Air-cooled heat exchangers and heat sinks are commonly used in many industrial applications that include, but are not limited to, chemical processing, power plants, electronics cooling, and others...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2022, 14(1): 011013.
Paper No: TSEA-20-1775
Published Online: November 18, 2021
... Cooling System for High Heat Flux ,” J. Electron. Cool. Therm. Control , 1 ( 04 ), pp. 128 – 137 . 10.4236/jectc.2014.44014 [9] Chang , C. C. , Kuo , S. C. , Ke , M. T. , and Chen , S. L. , 2010 , “ Two-Phase Closed-Loop Thermosyphon for Electronic Cooling ,” Exp. Heat...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061010.
Paper No: TSEA-21-1236
Published Online: October 13, 2021
... electronics battery system electric vehicle automotive thermal management electronic cooling heat and mass transfer heat pipes heat transfer enhancement porous media Automotive has generic thermal management requirements in different sections, which is increasing in the new-generation energy...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2022, 14(3): 031007.
Paper No: TSEA-21-1156
Published Online: July 26, 2021
... and PCM Volume Fraction ,” Appl. Therm. Eng. , 112 , pp. 143 – 155 . 10.1016/j.applthermaleng.2016.10.090 [14] Ashraf , M. J. , Ali , H. M. , Usman , H. , and Arshad , A. , 2017 , “ Experimental Passive Electronics Cooling: Parametric Investigation of Pin-Fin Geometries...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2022, 14(2): 021002.
Paper No: TSEA-21-1006
Published Online: June 18, 2021
... cycle characterized by flow conditions similar to Couette flow. Email: 160100001@iitb.ac.in Email: kshankar@iitb.ac.in 05 01 2021 03 05 2021 05 05 2021 18 06 2021 convective heat transfer flow agitation electronics cooling numerical modeling electronic cooling...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2021, 13(6): 061025.
Paper No: TSEA-20-1223
Published Online: May 14, 2021
... electronic cooling forced convection This is the second of a two-part study on the accuracy and computational cost of six turbulent modeling approaches for low Reynolds number turbulent flows that experience significant separation. In Part 2 of this study, the test case under consideration...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2021, 13(6): 061023.
Paper No: TSEA-20-1620
Published Online: May 12, 2021
...@mail.ipc.ac.cn 10 10 2020 07 03 2021 08 03 2021 12 05 2021 liquid metal thermal resistance heat dissipation thermal conductivity electronic cooling With the rapid advancement of electronic information technology, the integration degree of the semiconductor integrated...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2021, 13(5): 051028.
Paper No: TSEA-20-1688
Published Online: April 8, 2021
... Microchannel and Micro Pin Fins for Electronic Cooling ,” Int. J. Heat Mass Transfer , 66 , pp. 315 – 323 . 10.1016/j.ijheatmasstransfer.2013.07.039 [14] Roth , R. , Lenk , G. , Cobry , K. , and Woias , P. , 2013 , “ Heat Transfer in Freestanding Microchannels With In-Line...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2021, 13(6): 061017.
Paper No: TSEA-20-1666
Published Online: April 2, 2021
... 2021 free convection magnetic nanofluids stability analysis ferrohydrodynamic magnetohydrodynamics electronic cooling heat and mass transfer heat transfer enhancement micro/nanoscale heat transfer natural and mixed convection The electronics industry has seen a tremendous...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2021, 13(6): 061003.
Paper No: TSEA-20-1681
Published Online: March 30, 2021
... 30 03 2021 electronic cooling extended surfaces/fins natural and mixed convection porous media Buoyancy-induced convection plays an important role in the cooling of electronic components and electrical systems. Despite significantly lower heat transfer coefficients compared...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2021, 13(5): 051016.
Paper No: TSEA-20-1273
Published Online: March 10, 2021
... performance enhancement electronic cooling experimental techniques forced convection heat and mass transfer heat exchangers heat transfer enhancement The continuing integration and miniaturization of microelectronic devices widely make multiple microelectronic modules or microcomponents...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2021, 13(5): 051010.
Paper No: TSEA-20-1489
Published Online: March 9, 2021
...@gmail.com Email: Adeel.Arshad@nottingham.ac.uk Email: yassinehariti@gmail.com 07 08 2020 01 12 2020 03 12 2020 09 03 2021 melting NePCM hybrid nanoparticle inclination natural convection cooling electronic component electronic cooling heat transfer enhancement...