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Keywords: Electronic cooling
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021006.
Paper No: TSEA-23-1274
Published Online: November 16, 2023
... 16 11 2023 thermosyphon loop minichannel evaporator air cooling thermal resistance heat transfer performance condensation electronic cooling evaporation experimental/measurement techniques heat exchangers heat pipes thermal systems two-phase flow and heat transfer...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2024, 16(1): 011004.
Paper No: TSEA-23-1266
Published Online: October 20, 2023
... [14] Zhao , J. , Huang , S. , Gong , L. , and Huang , Z. , 2016 , “ Numerical Study and Optimizing on Micro Square Pin-Fin Heat Sink for Electronic Cooling ,” Appl. Therm. Eng. , 93 , pp. 1347 – 1359 . 10.1016/j.applthermaleng.2015.08.105 [15] Ndao , S. , Peles...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091011.
Paper No: TSEA-22-1438
Published Online: July 27, 2023
... have potential applications in portable electronics cooling devices. The heat pipe specifications are presented in Table 1 . Even though many researchers have researched the effect of various working fluids on a cylinder, pulsating, loop, dual-diameter, vapor chamber, and sintered heat pipe...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091010.
Paper No: TSEA-22-1540
Published Online: July 27, 2023
... 12 2022 01 06 2023 08 06 2023 27 07 2023 electronic cooling heat sink PCM forced convection orientation experiments energy systems extended surfaces/fins heat transfer enhancement Thermal management of electronics is vital as they have become extremely smart...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2023, 15(10): 101004.
Paper No: TSEA-23-1003
Published Online: June 26, 2023
... , “ Stereolithographically Fabricated Aluminum Nitride Microchannel Substrates for Integrated Power Electronics Cooling ,” Proceedings of the 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems , Orlando, FL , May 28–31 , IEEE, pp. 180 – 188 . [18] Zhang , X. , Chen...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091005.
Paper No: TSEA-23-1053
Published Online: June 14, 2023
... vapor compression refrigeration exergy analysis harsh thermal environment thermal management system conduction electronic cooling energy efficiency heat and mass transfer heat transfer enhancement thermal systems As the industrial economy grows, the energy gap is increasing [ 1 , 2...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081009.
Paper No: TSEA-23-1056
Published Online: May 30, 2023
...: rishikesh.pme16@iitp.ac.in 1 Corresponding author. Email: mkkhan@iitp.ac.in Email: mpathak@iitp.ac.in 10 02 2023 06 04 2023 11 04 2023 30 05 2023 thermoelectric cooler electronic cooling phase change material hotspot cooling melting and solidification micro/nanoscale...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2023, 15(6): 061004.
Paper No: TSEA-22-1390
Published Online: April 3, 2023
... conductivity as high as 31,824 W/m°C, which is quite suitable for electronics cooling. Orientation study revealed that horizontal orientation is comparatively better amongst all the other orientations for AGMBHP. References [1] Garimella , S. V. , Fleischer , A. S. , Murthy , J. Y...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2023, 15(4): 041010.
Paper No: TSEA-22-1451
Published Online: February 27, 2023
... and contribute to the commercialization of fuel cell vehicles. National key scientific instrument and equipment development project of China 10.13039/501100012149 2012YQ150256 proton exchange membrane fuel cell BOP cooling system parasitic power consumption system efficiency electronic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 011006.
Paper No: TSEA-22-1170
Published Online: September 22, 2022
... synchronous motor gas–liquid two phase jet cooling numerical simulation electronic cooling heat transfer enhancement jets impingement cooling two-phase flow and heat transfer The permanent magnet synchronous motor (PMSM) is characterized by high-power density, high energy conversion efficiency...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 011007.
Paper No: TSEA-22-1253
Published Online: September 22, 2022
...: baburaoponangi@gmail.com 17 05 2022 30 08 2022 31 08 2022 22 09 2022 BMS cold plate serpentine channel ANN FEM Galerkin method electronic cooling heat and mass transfer Electric vehicles (EVs) seem to be the way of the future for transportation. The shortcomings...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2022, 14(12): 121013.
Paper No: TSEA-22-1189
Published Online: September 22, 2022
... method forced convection decoupled method mixed convection shrouded plate finned channel electronic cooling extended surfaces/fins forced convection heat transfer enhancement natural and mixed convection thermal systems 18 04 2022 31 07 2022 04 08 2022 22 09 2022...
Journal Articles
Yu. E. Nikolaenko, D. V. Pekur, V. Yu. Kravets, V. M. Sorokin, D. V. Kozak, R. S. Melnyk, L. V. Lipnitskyi, A. S. Solomakha
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2022, 14(12): 121001.
Paper No: TSEA-21-1756
Published Online: August 23, 2022
..., and cheaper to manufacture and operate [ 18 – 23 ]. National Academy of Sciences of Ukraine 10.13039/501100004742 2020.02/0357 transmit/receive module low-cost air cooling system thermal characteristics heat sink gravity heat pipe electronic cooling forced convection heat and mass...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. November 2022, 14(11): 111013.
Paper No: TSEA-22-1109
Published Online: July 18, 2022
... , “ Experimental Study on Forced Convection Heat Transfer From Plate-Fin Heat Sinks With Partial Heating ,” Processes , 7 ( 10 ), pp. 772 – 790 . 10.3390/pr7100772 [5] Chu , R. , 2017 , “ The Challenges of Electronic Cooling Past, Current and Future ,” ASME J. Electron. Packag. , 126 ( 4 ), pp...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2022, 14(9): 091018.
Paper No: TSEA-21-1623
Published Online: May 30, 2022
... cryocooler electronic cooling energy systems heat and mass transfer low-temperature heat transfer thermal systems The single-stage Gifford–McMahon (GM) refrigerators are mostly adopted to cool electronic devices, high-temperature superconducting (HTS) magnets of nuclear-powered submarines...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061011.
Paper No: TSEA-21-1144
Published Online: November 18, 2021
... 2021 electrocaloric effect solid-state refrigeration heat pump electronic cooling energy efficiency Refrigeration has become an imperative for humankind. Due to the exponential growth of needs for cooling during the last decades, for the preservation and the transportation of food...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2022, 14(1): 011013.
Paper No: TSEA-20-1775
Published Online: November 18, 2021
...@iitp.ac.in 22 12 2020 12 10 2021 13 10 2021 18 11 2021 two-phase thermosyphon structured heating surface heat transfer enhancement thermal resistance bubble dynamics electronic cooling evaporation experimental techniques extended surfaces/fins two-phase flow and heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061013.
Paper No: TSEA-21-1350
Published Online: November 18, 2021
... transfer effectiveness for a thin, isothermal perforated plate using low-speed air as a working fluid. Air-cooled heat exchangers and heat sinks are commonly used in many industrial applications that include, but are not limited to, chemical processing, power plants, electronics cooling, and others...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2022, 14(1): 011014.
Paper No: TSEA-21-1366
Published Online: November 18, 2021
... insulation panel thermal radiation harsh environment heat flow direction index active thermal management system thermal protection conduction electronic cooling experimental techniques radiative heat transfer Electronics architecture design and its manufacturing trend exhibit a tremendous...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061010.
Paper No: TSEA-21-1236
Published Online: October 13, 2021
... electronics battery system electric vehicle automotive thermal management electronic cooling heat and mass transfer heat pipes heat transfer enhancement porous media Automotive has generic thermal management requirements in different sections, which is increasing in the new-generation energy...
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