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Keywords: heat dissipation
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. May 2024, 16(5): 051008.
Paper No: TSEA-23-1303
Published Online: March 19, 2024
...Lianfeng Ren; Le Zhang; Yifu Liang; Yujun Su; Xin Li; Yong Tang In this work, an embedded heat source vapor chamber (EHS-VC) is proposed for efficient and cost-effective heat dissipation in a limited space of aerospace electronics. The effect of the filling liquid mass and the layers of copper mesh...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031003.
Paper No: TSEA-23-1358
Published Online: January 12, 2024
..., and heat transfer rate. Efficient cooling systems, such as heat sinks, fans, or liquid cooling, can enhance heat dissipation and help maintain a more uniform temperature across the battery. Hence, the influence of heat generation on temperature is crucial for the effective TMS of batteries. By optimizing...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2023, 15(10): 101003.
Paper No: TSEA-22-1134
Published Online: June 26, 2023
...Jia Chen; Xiaobing Zhang; Ruijie Zhu The trend of miniaturization and intgration of the electronic device has put forward higher requirements on efficiency of heat radiating, which can hardly be satisfied by the traditional forced convection heat dissipation method. In this paper, the strategy...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2021, 13(6): 061023.
Paper No: TSEA-20-1620
Published Online: May 12, 2021
... velocity appears near the anode. On the temperature distribution profile of the heat dissipation system, the temperature on the electric heater side was much higher than the other regions and the role of the rotated liquid metal was to homogenize the temperature of the system. To analyze the heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021003.
Published Online: November 4, 2009
... 2008 07 09 2009 04 11 2009 04 11 2009 cooling heat sinks insulated gate bipolar transistors integrated circuit packaging thermal resistance VC heat dissipation thermal characteristic power module electronics cooling Integrated packaging technology has...