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1-9 of 9
Keywords: heat sink
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Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2023, 15(3): 031004.
Paper No: TSEA-22-1381
Published Online: December 6, 2022
...Seyda Ozbektas; Bilal Sungur; Bahattin Topaloğlu In this study, the effect of heat sink geometries on the performance of a thermoelectric generator was researched. In this context, fins with different geometries (flat fin, square pin fin, hexagonal pin fin, and circle pin fin) placed on an aluminum...
Journal Articles
Yu. E. Nikolaenko, D. V. Pekur, V. Yu. Kravets, V. M. Sorokin, D. V. Kozak, R. S. Melnyk, L. V. Lipnitskyi, A. S. Solomakha
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2022, 14(12): 121001.
Paper No: TSEA-21-1756
Published Online: August 23, 2022
... on the heat sink with the dimensions of 25 × 324 × 500 mm made of mass-produced heat sink profile. The total power of the 8 transistors in the transmit/receive module is 224 W. It is shown that the increase in air velocity in the heat sink channels from 1 to 30 m/s causes an approximately twofold drop...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. November 2022, 14(11): 111013.
Paper No: TSEA-22-1109
Published Online: July 18, 2022
... the laminar forced convection mode using the hybrid cooling technique (liquid cold plate integrated with the heat sinks). Fifteen heat sink cases (combinations) are considered for the analysis with the goal to keep the IC chip’s temperature under the safe limit (less than 100 °C). Variable power (heat) inputs...
Journal Articles
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. June 2021, 13(3): 034501.
Paper No: TSEA-20-1251
Published Online: September 18, 2020
... will be significantly decreased if the heat released by the electronic chips can be reduced directly. Although liquid cooling heat sinks (LCHS) have been demonstrated as an effective way to resolve this problem, the application of LCHS is limited by the uneven cooling distribution on the surface of the electronic chips...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2020, 12(3): 031023.
Paper No: TSEA-19-1489
Published Online: February 28, 2020
...Dileep V. Nair This work presents a simple method to improve natural convection heat transfer performance of horizontal-base straight-fin heat sink by adding partial shroud plates on top of the heat sink at both ends. Experiments are conducted in conjunction with a detailed three-dimensional (3D...
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. August 2019, 11(4): 041005.
Paper No: TSEA-18-1634
Published Online: May 23, 2019
...Santosh Kumar Sahoo; Prasenjit Rath; Mihir Kumar Das The present work aims at developing a heat transfer model for phase change material nanocomposite (PCMNC)-based finned heat sink to study its heat rejection potential. The proposed model is developed in line with the binary alloy formulation...
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. December 2017, 9(4): 041001.
Paper No: TSEA-16-1061
Published Online: March 21, 2017
...Biplab Das; Asis Giri; Suman Debnath A computational analysis of conjugate mixed convection heat transfer from shrouded vertical nonisothermal heat sink on a horizontal base is performed. The overall Nusselt number and the product of friction factor (f) and Reynolds number (Re) are found to vary...
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. June 2015, 7(2): 021005.
Paper No: TSEA-13-1163
Published Online: June 1, 2015
... heat sink The OHP is a type of two-phase heat transfer device partially filled with a working fluid that uses oscillatory motion to efficiently transfer heat as a simply-formed, wickless heat pipe [ 2–7 ]. The pressure difference between the evaporator (hot end) and the condenser (cold end...
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011006.
Paper No: TSEA-12-1102
Published Online: February 22, 2013
... assembly is illustrated in Fig. 2 . It consists of three cover plates (with synthetic jets cavity and orifices on them), a housing, a microchannel heat sink, a cartridge heater, insulation blocks, and a piezoelectric actuator. Fig. 2 Test module exploded view (insulation blocks not shown...