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Keywords: heat sinks
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2011, 3(2): 021001.
Published Online: July 13, 2011
...Hemin Hu; Jiahui Zhang; Xiaoze Du; Lijun Yang Liquid-cooled heat sink (cold plate) used for power electronics cooling is numerically studied. Thermal performance and hydraulic resistance are analyzed, with emphasis on geometric construction of cooling channels. Two heat transfer enhancing channel...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2010, 2(4): 041001.
Published Online: January 6, 2011
...Dylan Farnam; Bahgat Sammakia; Kanad Ghose Increasing power dissipation in microprocessors and other devices is leading to the consideration of more capable thermal solutions than the traditional air-cooled fin heat sinks. Microchannel heat sinks (MHSs) are promising candidates for long-term...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2009, 1(4): 041007.
Published Online: June 24, 2010
...Benjamin J. Jones; Suresh V. Garimella The influence of surface roughness on flow boiling heat transfer and pressure drop in microchannels is experimentally explored. The microchannel heat sink employed in the study consists of ten parallel, 25.4 mm long channels with nominal dimensions of 500...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2009, 1(4): 041005.
Published Online: May 24, 2010
..., rate of fluid flow, and heat sink/source temperature are studied. 17 02 2009 15 03 2010 24 05 2010 24 05 2010 cooling flow heat exchangers heat pumps heat sinks heating Peltier effect testing thermoelectric devices water storage Peltier cooling thermal energy...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021003.
Published Online: November 4, 2009
...Y. P. Zhang; X. L. Yu; Q. K. Feng; L. H. Zhang This paper presents an integrated power electronics module with a vapor chamber (VC) acting as a heat spreader to transfer the heat from the insulated gate bipolar transistor (IGBT) module to the base of the heat-sink. The novel VC integrated...