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Keywords: integrated circuit packaging
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021003.
Published Online: November 4, 2009
... 2008 07 09 2009 04 11 2009 04 11 2009 cooling heat sinks insulated gate bipolar transistors integrated circuit packaging thermal resistance VC heat dissipation thermal characteristic power module electronics cooling Integrated packaging technology has...
