.... Based on the experimental principle and referring to the ASTM D-5470 testing method, a set of interface thermal resistance experimental testing equipment is designed. The experiment comparatively studies the relationship between the temperature difference between detector and thermal conductive aluminum...

... on the temperature, heat transfer coefficient, thermal resistance, and effective thermal conductivity of the heat pipe. The results indicate that CuO nanoparticles at a 5% concentration lead to a maximum thermal resistance reduction of 4.31% at 50 W, while alumina nanoparticles at the same concentration lead...

..., and the related mechanisms are revealed. Results show that the thermal resistance of the thermosyphon loop tends to decrease as the heating power is increased. It is found that there exists an optimal value of fan power. Interestingly, the invalidity behavior of thermosyphon under the inclination condition...

.... In addition, the increase in the width and the number of cavities leads to gain a significant decrease in heat loss and an increase in thermal resistance. For block B4 improvement, the cavities with the previously characterized insulation have been partially filled. The proposed technique ensure high thermal...

... are studied numerically and experimentally. The effects of cooling channel spacing as well as the inlet parameters of kerosene on the maximum temperature and temperature uniformity of the plate are investigated with varied heat fluxes. Besides, the thermal resistance and flow resistance of kerosene cooling...

...@iitp.ac.in 22 12 2020 12 10 2021 13 10 2021 18 11 2021 two-phase thermosyphon structured heating surface heat transfer enhancement thermal resistance bubble dynamics electronic cooling evaporation experimental techniques extended surfaces/fins two-phase flow and heat...

... dissipation of the system performance, a second-order R-C network thermal resistance model of the experimental device was established with the parameters determined. The total thermal resistance of the dissipation system presented an increasing tendency with the increase of the heating power and gradually...

... configuration reduces thermal resistance by 16% and enhances average Nusselt number by 9.5% compared to rectangular manifold configuration. However, branched manifold configuration shows higher pressure drop in spite of enhancements in thermal performance and flow distribution uniformity. Overall performance...

... O 3 nanofluid, which will find application in smaller electronic units. It is found that use of nanofluid decreases the wall temperature distribution of TPCT. Thermal resistance of TPCT decreases whenever TPCT is filled with nanofluid and a maximum of 36.4% reduction in thermal resistance is noted...

... (PCMs) erythritol slug oscillations thermal resistance Thermal management technologies are given a lot of attention with the development of electronic components. More efficient cooling devices need to be developed to remove a high heat flux. Oscillating heat pipes (OHPs) serve as a self...

... pattern are summarized as a flow map showing the heating rate versus the volume ratio. The recovered heat and the thermal resistance of the thermosyphon loop were clearly improved by using the core blocks with narrow holes instead of hollow blocks for the treated volume ratios from 20% to 80%. The thermal...

... volume method. The performance of microchannel heatsink is evaluated in terms of overall thermal resistance, pressure drop, and heat transfer coefficient and temperature distribution. It is found that the results of the surface temperature profile are in good agreement with numerical data. The results...

... the positives and negatives of advanced solutions. The most commonly used metrics, particularly thermal resistance, are limited in their applicability, especially because they account for only for single factors like the temperature of the heated device. To improve these comparisons, a new volumetric...

... ° C cooler than a non-VC based heat-sink with high power density. The junction-to-case thermal resistance of the power module based on the VC is about 50% less than that of the power module based on a copper substrate with the same weight. The chip overshooting temperature of the copper substrate...

... dimensionless parameters: the conductive thermal resistance ratio and the porosity. After validation of the method by comparison of our results with those from both the literature studies and the numerical simulation, a parametric study is carried out to show the influence of the dimensionless parameters...