An experimental technique is described for measuring the temperature field in a workpiece during surface grinding. The technique involves measurement of the radiation emitted by a side of the workpiece immediately adjoining the wheel-workpiece contact region using a Charge-Coupled Device (CCD) based Infra-Red imaging system. By using an appropriate calibration procedure, measured radiation values are converted to temperatures. Novel aspects of the experimental technique are full-field measurement of temperature at high spatial and temporal resolution, high sensitivity and non-intrusive measurement. The repeatability of temperature measurement is found to be very good. The experiments have provided an accurate estimate of the surface and sub-surface temperatures in the workpiece. Furthermore, by grinding along a taper with a continuously increasing depth of cut, the effect of material removal rate on temperature field has been characterized. Measurements of the temperature field in taper grinding have been found to correlate well with those made in conventional constant depth grinding thereby, establishing taper grinding as a viable, accelerated test for studying grinding temperatures. Full-field measurements of workpiece temperature should facilitate study of thermal damage and multi-scale validation of thermal models in grinding.
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April 2003
Technical Papers
Measurement of Temperature Field in Surface Grinding Using Infra-Red (IR) Imaging System
Jihong Hwang,
Jihong Hwang
School of Industrial Engineering, 1287 GRIS
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Sridhar Kompella,
Sridhar Kompella
School of Industrial Engineering, 1287 GRIS
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Thomas N. Farris
Thomas N. Farris
School of Aeronautics and Astronautics Engineering, 1282 GRIS, Purdue University West Lafayette, IN 47907-1287
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Jihong Hwang
School of Industrial Engineering, 1287 GRIS
Sridhar Kompella
School of Industrial Engineering, 1287 GRIS
Srinivasan Chandrasekar
Thomas N. Farris
School of Aeronautics and Astronautics Engineering, 1282 GRIS, Purdue University West Lafayette, IN 47907-1287
Contributed by the Tribology Division for publication in the ASME JOURNAL OF TRIBOLOGY. Manuscript received by the Tribology Division February 19, 2002 revised manuscript received July 30, 2002. Associate Editor: J. A. Williams.
J. Tribol. Apr 2003, 125(2): 377-383 (7 pages)
Published Online: March 19, 2003
Article history
Received:
February 19, 2002
Revised:
July 30, 2002
Online:
March 19, 2003
Citation
Hwang , J., Kompella , S., Chandrasekar, S., and Farris, T. N. (March 19, 2003). "Measurement of Temperature Field in Surface Grinding Using Infra-Red (IR) Imaging System ." ASME. J. Tribol. April 2003; 125(2): 377–383. https://doi.org/10.1115/1.1537748
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